(19)
(11) EP 2 092 553 A1

(12)

(43) Date of publication:
26.08.2009 Bulletin 2009/35

(21) Application number: 06845126.9

(22) Date of filing: 08.12.2006
(51) International Patent Classification (IPC): 
H01L 21/60(2006.01)
(86) International application number:
PCT/US2006/047067
(87) International publication number:
WO 2008/069805 (12.06.2008 Gazette 2008/24)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

(71) Applicant: Henkel AG & Co. KGaA
40589 Düsselsdorf (DE)

(72) Inventors:
  • WYATT, Derek
    Huntington Beach, CA 92647 (US)
  • DUTT, Gyan
    Piscataway, NJ 08854 (US)
  • PEREZ, Albert P.
    La Habra, CA 90631 (US)

   


(54) PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER