FRONT-END PROCESSED WAFER HAVING THROUGH-CHIP CONNECTIONS - Patent 2097924

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EP 2 097 924 A2

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(88)	Date of publication A3:
	21.08.2008

(43)	Date of publication:
	09.09.2009 Bulletin 2009/37

(21)	Application number: 07870039.0

(22)	Date of filing: 28.12.2007

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International Patent Classification (IPC):

H01L 21/4763^(2006.01)

H01L 21/768^(2006.01)

(86)	International application number:
	PCT/US2007/089061

(87)	International publication number:
	WO 2008/083284 (10.07.2008 Gazette 2008/28)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

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Priority:

29.12.2006 US 882671 P

(71)	Applicant: Cufer Asset Ltd. L.L.C.
	Wilmington, DE 19801 (US)

(72)	Inventor:
	TREZZA, John Nashua, New Hampshire 03063 (US)

(74)	Representative: Bruce, Alexander Richard Henry et al
	Venner Shipley LLP 20 Little Britain London EC1A 7DH London EC1A 7DH (GB)

(54)	FRONT-END PROCESSED WAFER HAVING THROUGH-CHIP CONNECTIONS