SOLDERING FILLER METAL, ASSEMBLY METHOD FOR SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE - Patent 2099580

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EP 2 099 580 A1

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(43)	Date of publication:
	16.09.2009 Bulletin 2009/38

(21)	Application number: 03797594.3

(22)	Date of filing: 12.09.2003

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International Patent Classification (IPC):

B23K 35/26^(2006.01)

H05K 3/34^(2006.01)

(86)	International application number:
	PCT/JP2003/011730

(87)	International publication number:
	WO 2004/026527 (01.04.2004 Gazette 2004/14)

(84)	Designated Contracting States:
	DE FR GB

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Priority:

19.09.2002 JP 2002273598

(71)	Applicant: SUMITOMO METAL MINING COMPANY LIMITED
	Tokyo 105 (JP)

(72)	Inventors:
	MORI, Nobuki SUMITOMO METAL MINING METAL CO.,LTD. Oume-shi, Tokyo 198-0025 (JP) MORIMOTO, Kei SUMITOMO METAL MINING METAL CO.,LTD. Oume-shi, Tokyo 198-0025 (JP)

(74)	Representative: Morelle, Guy Georges Alain
	Cabinet Morelle & Bardou S.C. 9 Avenue de l'Europe B.P. 72253 31522 Ramonville Cedex 31522 Ramonville Cedex (FR)

(54)	SOLDERING FILLER METAL, ASSEMBLY METHOD FOR SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE