Method of cutting out chips for a plurality of sensor elements from laminated body

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EP 2 103 930 B8

(12)	CORRECTED EUROPEAN PATENT SPECIFICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 B1)

(48)	Corrigendum issued on:
	07.12.2016 Bulletin 2016/49

(45)	Mention of the grant of the patent:
	19.10.2016 Bulletin 2016/42

(21)	Application number: 09250766.4

(22)	Date of filing: 19.03.2009

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International Patent Classification (IPC):

G01N 27/407^(2006.01)

G01N 27/419^(2006.01)

(54)	Method of cutting out chips for a plurality of sensor elements from laminated body Verfahren zum Schneiden von Chips aus einer Vielzahl von Sensorelementen eines laminierten Körpers Procédé de découpage de puces pour une pluralité d'éléments capteurs dans un corps stratifié

(84)	Designated Contracting States:
	DE FR

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Priority:

19.03.2008 JP 2008071258

(43)	Date of publication of application:
	23.09.2009 Bulletin 2009/39

(73)	Proprietors:
	NGK Insulators, Ltd. Nagoya-shi, Aichi 467-8530 (JP) NGK Ceramic Device Co., Ltd. Komaki-shi, Aichi 485-8557 (JP)

(72)	Inventors:
	Shindo, Hiroyuki Nagoya City, Aichi-ken, 485-8530 (JP) Asai, Toyohiko Komaki-shi, Aichi 485-8557 (JP)

(74)	Representative: Naylor, Matthew John et al
	Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE City Tower 40 Basinghall Street London EC2V 5DE (GB)

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References cited: :

EP-A1- 1 626 273
JP-A- 8 271 476
US-A1- 2005 252 770
US-B1- 6 620 302

EP-A2- 0 309 360
US-A- 6 027 622
US-A1- 2007 007 136

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).