(19)
(11) EP 2 126 159 A1

(12)

(43) Date of publication:
02.12.2009 Bulletin 2009/49

(21) Application number: 07860736.3

(22) Date of filing: 28.12.2007
(51) International Patent Classification (IPC): 
C25D 3/30(2006.01)
(86) International application number:
PCT/KR2007/006952
(87) International publication number:
WO 2008/082192 (10.07.2008 Gazette 2008/28)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

(30) Priority: 29.12.2006 KR 20060138526
28.12.2007 KR 20070139768

(71) Applicant: Iljin Copper Foil Co., Ltd.
Iksan-si Jeollabuk-do 570-998 (KR)

(72) Inventors:
  • LEE, Dong-Nyung
    Seoul 156-030 (KR)
  • KIM, Sang-Beom
    Daejeon-city 305-749 (KR)
  • KANG, Kyoo-Sik
    Seoul 135-989 (KR)

(74) Representative: Schouller, Jean-Philippe et al
Cabinet Lavoix 62, rue de Bonnel
69448 Lyon Cedex 03
69448 Lyon Cedex 03 (FR)

   


(54) SN-B PLATING SOLUTION AND PLATING METHOD USING IT