(19)
(11) EP 2 135 964 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
23.01.2013 Bulletin 2013/04

(43) Date of publication A2:
23.12.2009 Bulletin 2009/52

(21) Application number: 09008100.1

(22) Date of filing: 19.06.2009
(51) International Patent Classification (IPC): 
C22C 9/04(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA RS

(30) Priority: 20.06.2008 JP 2008161635

(71) Applicant: Daido Metal Company Ltd.
Nagoya-shi, Aichi 4600008 (JP)

(72) Inventors:
  • Ochi, Shinji
    Inuyama-shi Aichi (JP)
  • Toda, Kazuaki
    Inuyama-shi Aichi (JP)
  • Yago, Wataru
    Nakaniikawa-gun Toyama (JP)
  • Yasukawa, Jun
    Nakaniikawa-gun Toyama (JP)
  • Fujiyama, Kouji
    Nakaniikawa-gun Toyama (JP)

(74) Representative: Beckmann, Claus et al
Kraus & Weisert Patent- und Rechtsanwälte Thomas-Wimmer-Ring 15
80539 München
80539 München (DE)

   


(54) Copper-based sliding material


(57) A copper-based sliding material consisting of: 5.0 to 25.0 mass % of Zn; 4.2 to 10.0 mass % of Bi; 2.0 to 7.0 mass % of Mn; 1.0 to 3.0 mass % of Si; 0.1 to 2.0 mass % of Sn; and the balance being Cu and unavoidable impurities is provided. The copper-based sliding material includes a single α-phase matrix (1, 2), a Mn-Si compound (3) and a Bi-particle phase (4). The Mn-Si compound (3) and the Bi-particle phase (4) are dispersed in the single α-phase matrix (1, 2). The mass ratio of Sn to Bi is 0.024 to 0.200, preferably 0.050 to 0.140.







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Search report