(19)
(11) EP 2 140 743 A1

(12)

(43) Date of publication:
06.01.2010 Bulletin 2010/01

(21) Application number: 07776181.5

(22) Date of filing: 26.04.2007
(51) International Patent Classification (IPC): 
H05K 1/09(2006.01)
H05K 3/40(2006.01)
(86) International application number:
PCT/US2007/010030
(87) International publication number:
WO 2008/133612 (06.11.2008 Gazette 2008/45)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

(71) Applicant: E. I. Du Pont de Nemours and Company
Wilmington, DE 19898 (US)

(72) Inventor:
  • INABA, Akira
    Kanagawa 213-0012 (JP)

(74) Representative: Towler, Philip Dean 
Frank B. Dehn & Co. St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) ELECTRICALLY CONDUCTIVE COMPOSITION FOR VIA-HOLES