(19)
(11)
EP 2 140 743 A1
(12)
(43)
Date of publication:
06.01.2010
Bulletin 2010/01
(21)
Application number:
07776181.5
(22)
Date of filing:
26.04.2007
(51)
International Patent Classification (IPC):
H05K
1/09
(2006.01)
H05K
3/40
(2006.01)
(86)
International application number:
PCT/US2007/010030
(87)
International publication number:
WO 2008/133612
(
06.11.2008
Gazette 2008/45)
(84)
Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
(71)
Applicant:
E. I. Du Pont de Nemours and Company
Wilmington, DE 19898 (US)
(72)
Inventor:
INABA, Akira
Kanagawa 213-0012 (JP)
(74)
Representative:
Towler, Philip Dean
Frank B. Dehn & Co. St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)
(54)
ELECTRICALLY CONDUCTIVE COMPOSITION FOR VIA-HOLES