(19)
(11) EP 2 149 622 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
14.04.2010 Bulletin 2010/15

(43) Date of publication:
03.02.2010 Bulletin 2010/05

(21) Application number: 08752904.6

(22) Date of filing: 16.05.2008
(51) International Patent Classification (IPC): 
C23C 18/24(2006.01)
C23C 18/30(2006.01)
 C23C 18/20(2006.01)
C25D 5/56(2006.01)
(86) International application number:
PCT/JP2008/059075
(87) International publication number:
WO 2008/143190 (27.11.2008 Gazette 2008/48)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

(30) Priority: 22.05.2007 JP 2007135200

(71) Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD.
Osaka-shi Osaka 541 (JP)

(72) Inventors:
  • NAGAO, Toshimitsu
    Osaka-shi Osaka 538-0044 (JP)
  • YOSHIKANE, Yusuke
    Osaka-shi Osaka 538-0044 (JP)
  • YOSHIKAWA, Junji
    Osaka-shi Osaka 538-0044 (JP)
  • MORIMOTO, Toru
    Osaka-shi Osaka 538-0044 (JP)
  • MURATA, Toshiya
    Osaka-shi Osaka 538-0044 (JP)
  • SATOU, Kazuya
    Osaka-shi Osaka 538-0044 (JP)

(74) Representative: Müller-Boré & Partner Patentanwälte 
Grafinger Strasse 2
81671 München
81671 München (DE)

   


(54) PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT


(57) The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.