<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP09166171A3" file="EP09166171NWA3.xml" lang="en" country="EP" doc-number="2150097" kind="A3" date-publ="20100915" status="n" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORS..SM..................</B001EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.15 (14 Jul 2008) -  1620000/0</B007EP></eptags></B000><B100><B110>2150097</B110><B120><B121>EUROPEAN PATENT APPLICATION</B121></B120><B130>A3</B130><B140><date>20100915</date></B140><B190>EP</B190></B100><B200><B210>09166171.0</B210><B220><date>20090723</date></B220><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>183260</B310><B320><date>20080731</date></B320><B330><ctry>US</ctry></B330></B300><B400><B405><date>20100915</date><bnum>201037</bnum></B405><B430><date>20100203</date><bnum>201005</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>H05K   5/02        20060101AFI20091130BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Verfahren und Vorrichtung zum physikalischen Schutz elektrischer Komponenten</B542><B541>en</B541><B542>Method and apparatus for electrical component physical protection</B542><B541>fr</B541><B542>Procédé et appareil pour la protection physique de composant électrique</B542></B540><B590><B598>1</B598></B590></B500><B700><B710><B711><snm>GE Aviation Systems LLC</snm><iid>101007148</iid><irf>233853/14058</irf><adr><str>3290 Patterson Avenue, SE</str><city>Grand Rapids, MI 49512-1991</city><ctry>US</ctry></adr></B711></B710><B720><B721><snm>Steffler, Joseph B.</snm><adr><str>
8223 100th Street</str><city>Alto, MI 49302</city><ctry>US</ctry></adr></B721></B720><B740><B741><snm>Gray, Thomas</snm><iid>101091596</iid><adr><str>GE International Inc. 
Global Patent Operation - Europe 
15 John Adam Street</str><city>London WC2N 6LU</city><ctry>GB</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MK</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>SM</ctry><ctry>TR</ctry></B840><B844EP><B845EP><ctry>AL</ctry></B845EP><B845EP><ctry>BA</ctry></B845EP><B845EP><ctry>RS</ctry></B845EP></B844EP><B880><date>20100915</date><bnum>201037</bnum></B880></B800></SDOBI>
<abstract id="abst" lang="en">
<p id="pa01" num="0001">An enclosure (100) for protecting a heat sensitive component from high temperature, shock, and moisture is provided. The enclosure includes an outer housing (102) surrounding an inner cavity (104) configured to receive a heat sensitive component (121) therein, and a cover (108) configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material.
<img id="iaf01" file="imgaf001.tif" wi="78" he="102" img-content="drawing" img-format="tif"/></p>
</abstract>
<search-report-data id="srep" lang="en" srep-office="EP" date-produced=""><doc-page id="srep0001" file="srep0001.tif" wi="158" he="233" type="tif"/><doc-page id="srep0002" file="srep0002.tif" wi="157" he="233" type="tif"/></search-report-data>
</ep-patent-document>
