(19)
(11) EP 2 153 465 A1

(12)

(43) Date of publication:
17.02.2010 Bulletin 2010/07

(21) Application number: 07784074.2

(22) Date of filing: 23.05.2007
(51) International Patent Classification (IPC): 
H01L 23/48(2006.01)
(86) International application number:
PCT/US2007/069553
(87) International publication number:
WO 2008/143675 (27.11.2008 Gazette 2008/48)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK RS

(71) Applicant: Texas Instruments Incorporated
Dallas, Texas 75265-5474 (US)

(72) Inventors:
  • WACHTLER, Kurt, P.
    Richardson, TX 75081 (US)
  • CASTRO, Abram, M.
    Fort Worth, TX 76103 (US)
  • GERBER, Mark, A.
    Lucas, TX 75002 (US)

(74) Representative: Holt, Michael 
Texas Instruments Limited European Patents Department
800 Pavilion Drive Northampton Business Park Northampton NN4 7YL
800 Pavilion Drive Northampton Business Park Northampton NN4 7YL (GB)

   


(54) PACKAGED SYSTEM OF SEMICONDUCTOR CHIPS HAVING A SEMICONDUCTOR INTERPOSER