(19)
(11) EP 2 176 447 A1

(12)

(43) Date of publication:
21.04.2010 Bulletin 2010/16

(21) Application number: 08758242.5

(22) Date of filing: 20.06.2008
(51) International Patent Classification (IPC): 
C25D 3/60(2006.01)
C25D 7/10(2006.01)
C22F 1/00(2006.01)
C23F 1/28(2006.01)
C25D 5/48(2006.01)
C21D 7/04(2006.01)
C22F 1/08(2006.01)
(86) International application number:
PCT/DK2008/000233
(87) International publication number:
WO 2008/154925 (24.12.2008 Gazette 2008/52)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA MK RS

(30) Priority: 21.06.2007 US 929299 P
22.06.2007 EP 07388045

(71) Applicant: Danmarks Tekniske Universitet - DTU
2800 Kongens Lyngby (DK)

(72) Inventors:
  • TANG, Peter, Torben
    DK-2860 Søborg (DK)
  • ARENTOFT, Mogens
    DK-4000 Roskilde (DK)
  • BAY, Niels
    DK-2765 Smørum (DK)
  • BORRILD, Morten, Jerne
    DK-2100 Copenhagen (DK)
  • MIZUSHIMA, Io
    DK-2800 Kongens Lyngby (DK)
  • JENSEN, Jørgen, Dai
    DK-1754 Copenhagen V (DK)
  • PALDAN, Nikolas, Aulin
    DK-2920 Charlottenlund (DK)

(74) Representative: Bender, Mikkel 
Chas. Hude A/S H.C. Andersens Boulevard 33
DK-1780 Copenhagen V
DK-1780 Copenhagen V (DK)

   


(54) A MICROPOROUS LAYER FOR LOWERING FRICTION IN METAL-FORMING PROCESSES