(19)
(11) EP 2 179 442 A2

(12)

(88) Date of publication A3:
09.04.2009

(43) Date of publication:
28.04.2010 Bulletin 2010/17

(21) Application number: 08796037.3

(22) Date of filing: 27.06.2008
(51) International Patent Classification (IPC): 
H01L 23/04(2006.01)
(86) International application number:
PCT/US2008/068542
(87) International publication number:
WO 2009/006284 (08.01.2009 Gazette 2009/02)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA MK RS

(30) Priority: 28.06.2007 US 769927
28.06.2007 US 769937

(71) Applicant: Sandisk Corporation
Milpitas, CA 95035 (US)

(72) Inventors:
  • LIAO, Chien-Ko
    Milpitas, CA 95035 (US)
  • CHIU, Chin-Tien
    Milpitas, CA 95035 (US)
  • CHIEN, Jack, Chang
    Milpitas, CA 95035 (US)
  • YU, Cheemen
    Milpitas, CA 95035 (US)
  • TAKIAR, Hem
    Milpitas, CA 95035 (US)

(74) Representative: Tothill, John Paul 
Dehns St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER