<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.5//EN" "ep-patent-document-v1-5.dtd">
<ep-patent-document id="EP08797141B8W1" file="EP08797141W1B8.xml" lang="en" country="EP" doc-number="2183769" kind="B8" correction-code="W1" date-publ="20170823" status="c" dtd-version="ep-patent-document-v1-5">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIRO..CY..TRBGCZEEHUPLSK..HRIS..MTNO........................</B001EP><B003EP>*</B003EP><B005EP>J</B005EP><B007EP>BDM Ver 0.1.63 (23 May 2017) -  2999001/0</B007EP></eptags></B000><B100><B110>2183769</B110><B120><B121>CORRECTED EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20170823</date></B140><B150><B151>W1</B151><B153>73</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>08797141.2</B210><B220><date>20080804</date></B220><B240><B241><date>20100218</date></B241></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>953602 P</B310><B320><date>20070802</date></B320><B330><ctry>US</ctry></B330><B310>59039</B310><B320><date>20080605</date></B320><B330><ctry>US</ctry></B330></B300><B400><B405><date>20170823</date><bnum>201734</bnum></B405><B430><date>20100512</date><bnum>201019</bnum></B430><B450><date>20170719</date><bnum>201729</bnum></B450><B452EP><date>20170214</date></B452EP><B480><date>20170823</date><bnum>201734</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>C25D   5/02        20060101AFI20151104BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>H01L  21/288       20060101ALI20151104BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>KUPFERMETALLISIERUNG EINER SI-DURCHKONTAKTIERUNG</B542><B541>en</B541><B542>COPPER METALLIZATION OF THROUGH SILICON VIA</B542><B541>fr</B541><B542>MÉTALLISATION EN CUIVRE DE TROUS D'INTERCONNEXION DANS DU SILICIUM</B542></B540><B560><B561><text>WO-A1-2007/130710</text></B561><B561><text>WO-A2-2006/053242</text></B561><B561><text>US-A1- 2004 045 832</text></B561><B561><text>US-A1- 2004 082 756</text></B561><B561><text>US-A1- 2005 045 488</text></B561><B561><text>US-A1- 2006 141 784</text></B561><B561><text>US-A1- 2006 141 784</text></B561><B565EP><date>20151110</date></B565EP></B560></B500><B700><B720><B721><snm>RICHARDSON, Thomas, B.</snm><adr><str>c/o Enthone Inc.
350 Frontage Road</str><city>West Haven, CT 06515</city><ctry>US</ctry></adr></B721><B721><snm>ZHANG, Yun</snm><adr><str>109 Corporate Blvd.</str><city>South Plainfield, New Jersey 07080</city><ctry>US</ctry></adr></B721><B721><snm>WANG, Chen</snm><adr><str>193 Marsh Hill Road</str><city>Orange, Connecticut 06477</city><ctry>US</ctry></adr></B721><B721><snm>PANECCASIO, Vincent</snm><adr><str>c/o Enthone Inc.
350 Frontage Road</str><city>West Haven, CT 06516</city><ctry>US</ctry></adr></B721><B721><snm>WANG, Cai</snm><adr><str>c/o Enthone Inc.
350 Frontage Road</str><city>West Haven, Connecticut 06516</city><ctry>US</ctry></adr></B721><B721><snm>LIN, Xuan</snm><adr><str>c/o Enthone Inc.
350 Frontage Road</str><city>West Haven, CT 06516</city><ctry>US</ctry></adr></B721><B721><snm>HURTUBISE, Richard</snm><adr><str>c/o Enthone Inc.
350 Frontage Road</str><city>West Haven, CT 06516</city><ctry>US</ctry></adr></B721><B721><snm>ABYS, Joseph, A.</snm><adr><str>c/o Enthone Inc.
350 Frontage Road</str><city>New Haven, CT 06516</city><ctry>US</ctry></adr></B721></B720><B730><B731><snm>MacDermid Enthone Inc.</snm><iid>101674839</iid><irf>P 82026</irf><adr><str>350 Frontage Road</str><city>West Haven CT 06516</city><ctry>US</ctry></adr></B731></B730><B740><B741><snm>Uexküll &amp; Stolberg</snm><iid>101312292</iid><adr><str>Partnerschaft von 
Patent- und Rechtsanwälten mbB 
Beselerstraße 4</str><city>22607 Hamburg</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>TR</ctry></B840><B860><B861><dnum><anum>US2008072136</anum></dnum><date>20080804</date></B861><B862>en</B862></B860><B870><B871><dnum><pnum>WO2009018581</pnum></dnum><date>20090205</date><bnum>200906</bnum></B871></B870><B880><date>20100512</date><bnum>201019</bnum></B880></B800></SDOBI>
</ep-patent-document>
