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(11) | EP 2 189 784 A2 |
| (12) | EUROPEAN PATENT APPLICATION |
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| (54) | Apparatus for inspecting surface of electrolytically refined metal deposited plate |
| (57) An apparatus for inspecting an electrolytically refined metal deposition plate includes
a loading robot for loading the metal deposition plate to the inspection unit; an
unloading robot for unloading the metal deposition plate upon which inspection has
been completed by the inspection unit; a conveyor unit for conveying the metal deposition
plate unloaded by the unloading robot; and a controller for grading the metal deposition
plate based on a size of and distribution per unit surface area of nodules on the
metal deposition plate using images of the metal deposition plate captured by the
inspection unit.
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[0001] The present invention relates to an apparatus for inspecting a surface of an electrolytically refined metal deposition plate, and more particularly, to an apparatus for inspecting a surface of an electrolytically refined metal deposition plate by capturing a surface image of the metal deposition plate and by automatically grading the metal deposition plate based on a size of nodules and a distribution per unit surface area of the nodules in the captured surface image.
[0002] As is well known, a metal such as copper (Cu), zinc (Zn), nickel (Ni), and tellurium (Te) can be refined into a high purity metal by electrolysis. Electrolytic refinement is carried out by alternately submerging a plurality of anode and cathode plates in an electrolytic bath containing electrolytes and performing electrolysis. That is, the anode and cathode plates are submerged in the electrolytic bath in alternate fashion and an electric current is applied to the anode plate and the cathode plate. Then, metal ions such as copper ions (Cu2+) are separated from the anode plate submerged in the electrolyte and are deposited on the cathode plate to a preset thickness. The deposited metal is then separated from the cathode plate so that the refined metal may be obtained.
[0003] A solution containing electrolytic metal to be deposited is used as an electrolyte in the electrolytic refinement. Oxidation occurs at the surface of the anode plate where positive metal ions are produced and reduction occurs at the surface of the cathode plate where the positive metal ions are deposited. For example, in electrolytic refinement, 99% pure copper produced by smelting is cast as an anode plate and a stainless steel plate is used as a cathode plate. The copper ions separated from the anode plate are reduced at the cathode plate so that 99.993% or high purity copper is deposited to the cathode plate.
[Reaction formula]
Anode reaction: Cu (99.5%) → Cu2+ + 2e
Cathode reaction: Cu2+ + 2e → Cu (99.993%)
Full reaction: Cu (99.5%) -> Cu (99.993%)
[0004] As described above, when a preset amount of metal is deposited to the cathode plate through the electrolytic refinement, it is examined whether the refined metal is normally deposited to the cathode plate. According to a conventional method of examining a plate deposited with metal refined by electrolysis, a worker examines a size of and distribution per unit surface area of nodules that are caused by impurities contained in the deposited metal with the naked eye and grades the electrolytically refined metal deposition plate. In other words, the electrolytically refined metal deposition plate having large, widely distributed nodules is determined to be a low grade.
[0005] However, according to the conventional method, it is difficult to precisely determine the grade of the electrolytically refined metal due to degree of expertise and worker fatigue.
[0006] Therefore, an object of the present invention is to provide an apparatus for inspecting a surface of an electrolytically refined metal deposition plate by capturing a surface of the plate and by automatically grading the metal deposition plate based on a size of nodules and distribution per surface of the nodules in the captured surface.
[0007] In accordance with an aspect of the present invention, there is provided an apparatus for inspecting a surface of an electrolytically refined deposition plate, including:
an inspection unit for capturing and inspecting a metal deposition plate to be inspected;
a loading robot for loading the metal deposition plate to the inspection unit;
an unloading robot for unloading the metal deposition plate upon which inspection has been completed by the inspection unit;
a conveyor unit for conveying the metal deposition plate unloaded by the unloading robot; and
a controller for grading the metal deposition plate based on a size of and distribution per unit surface area of nodules on the metal deposition plate using images of the metal deposition plate captured by the inspection unit.
[0008] The above and other aspects and features of the present invention will become apparent from the following description of preferred embodiments given in conjunction with the accompanying drawings, in which:
Fig. 1 is a perspective view illustrating an apparatus for inspecting an electrolytically refined metal deposition plate according to an embodiment of the present invention;
Fig. 2 is a front view of the inspecting apparatus of Fig. 1;
Fig. 3 is a perspective view illustrating an inspection unit of the inspection apparatus of Fig. 1;
Fig. 4 is a front view of the inspection unit of Fig. 3;
Fig. 5 is a perspective view illustrating a gripper unit of the inspection apparatus of Fig. 1;
Fig. 6 is a front view of the gripper unit of Fig. 5;
Fig. 7 is a side view of the gripper unit of Fig. 5; and
Figs. 8A to 8D are images of an electrolytically refined metal deposition plate captured by the inspection unit of Fig. 3.
[0009] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily carry out the present invention. However, the present invention is not limited to the embodiments.
[0010] Fig. 1 is a perspective view illustrating an apparatus for inspecting an electrolytically refined metal deposition plate according to an embodiment of the present invention, and Fig. 2 is a front view of the inspection apparatus of Fig. 1.
[0011] As illustrated in Figs. 1 and 2, the apparatus for inspecting an electrolytically refined metal deposition plate according to an embodiment of the present invention includes a conveyor 100, an inspection unit 200, a loading robot 300, and an unloading robot 400.
[0012] The conveyor 100 withdraws a metal deposition plate 10, inspection of which has been completed and that is unloaded and discharged. An inspection unit 200 is installed at a side of the conveyor 100 to capture an image of a nodule generated on the metal deposition plate 10 and to provide the captured image to a controller 600.
[0013] The loading robot 300 is installed at the other side of the conveyor 100 to load the metal deposition plate 10 to the inspection unit 200. The unloading robot 400 is installed in an upper side of the conveyor 100 to unload the metal deposition plate 10, inspection of which has been completed by the inspection unit 200 to the conveyor 100.
[0014] The controller 600 performs overall control of the apparatus for inspecting an electrolytically refined metal deposition plate by controlling the conveyor 100, the inspection unit 200, the loading robot 300, and the unloading robot 400 respectively. The controller 600 receives the image obtained by capturing the metal deposition plate 100 in the inspection unit 200, and estimates the size of a nodule and nodule distribution per unit surface area of the metal deposition plate 10 using the captured image when the nodule is generated at the metal deposition plate 10 to automatically determine grade of the metal deposition plate 10 upon which inspection has been completed.
[0015] The conveyor 100, the inspection unit 200, the loading robot 300, and the unloading robot 400 of the apparatus for inspecting an electrolytically refined metal deposition plate will be described as follows.
[0016] The conveyor 100, as illustrated in Figs. 1 and 2, includes a conveyor base 110 and a pair of chain conveyor assemblies 120.
[0017] The conveyor base 110 supports the conveyor 100. The chain conveyor assemblies 120 are installed to the conveyor base 110 and include chains 121. Each of the chains 121 includes a plurality of links 121a and a plurality of seat members 121b having a seat groove 121c on which the metal deposition plate 10 is seated.
[0018] The inspection unit 200, as illustrated in Figs. 1, 3, and 4, includes an accommodating unit 210, a first vision unit 220, and a second vision unit 230.
[0019] The accommodating unit 210 accommodates the metal deposition plate 10 and includes an accommodator base 211, a pair of guide members 212, and a tension unit 213.
[0020] The accommodator base 211 supports the accommodating unit 210. The guide members 212 are installed on the accommodator base 211 and have guide grooves 212a guiding the metal deposition plate 10 to be accommodated in the accommodating unit 210. The tension unit 213 is installed between the guide members 212 to attenuate shock applied when the metal deposition plate is accommodated.
[0021] The tension unit 213 includes a support 213a, a pair of first tension bases 213b, a second tension base 213c, and a plurality of springs 213d.
[0022] The support 213a is installed between the guide members 212 and the first tension bases 213b are installed to both sides of the support 213a. The second tension 213c is installed on the first tension bases 213b. The springs 213d are installed between the first tension bases 213b and the second tension base 213c to absorb shock applied when the metal deposition plate 10 is lowered.
[0023] The first vision unit 220 is installed to one side of the accommodating unit 210 to capture a surface of the metal deposition plate 10 that is accommodated in the accommodating unit 210. The second vision unit 230 is installed to the opposite side of the accommodating unit 210 to capture the opposite surface of the metal deposition plate 10.
[0024] The first and second vision units 220 and 230 capturing the metal deposition plate 10 include elevation devices 221 and 231, elevation members 222 and 232, lighting devices 223 and 233, and cameras 224 and 234, respectively.
[0025] The elevation devices 221 and 231 may be devices employing ball screws. The elevation members 222 and 232 are elevated and lowered by the elevation devices 221 and 231. The lighting devices 223 and 233 are obliquely installed to the elevation members 222 and 232 by an angle to illuminate the metal deposition plate 10. The lighting devices 223 and 233 may include a laser and a light emitting diode (LED). If it is desired to get three-dimensional images, the lasers may be used. On the other hand, if it is required to get two-dimensional images, the LEDs may be used. The controller 600 controls selection of the lasers or the LEDs. Since this control is already well known, a detailed description thereof will be omitted.
[0026] The lighting devices 223 and 233 further include tilting units 225 and 235. The tilting units 225 and 235 include fixing blocks 225a and 235a, tilting members 225d and 235d, and pneumatic cylinders 225e and 235e.
[0027] The fixing blocks 225a and 235a are installed to the elevation members 222 and 232 and include a plurality of guide pins 225b and 235b. The tilting members 225d and 235d have a plurality of longitudinal holes 225c and 235c into which the guide pins 225b and 235b are inserted. The lighting devices 223 and 233 are installed to the tilting members 225d and 235d of the elevation members 222 and 232. The pneumatic cylinders 225e and 235e are connected to the fixing blocks 225a and 235a and the lighting devices 223 and 233. The pneumatic cylinders 225e and 235e push the lighting devices 223 and 233 to tilt the tilting members 225d and 235d by an angle so that an inclination of the lighting devices 223 and 233 is adjusted.
[0028] The cameras 224 and 234 are spaced apart from the lighting devices 223 and 233 so as to be perpendicular to the elevation members 222 and 232. The cameras 224 and 234 capture the metal deposition plate 10 to generate captured images of the metal deposition plate 10. The cameras 224 and 234 may be area cameras.
[0029] The loading robot 300, as illustrated in Figs. 1 and 2, includes a first robot base 310 and a first robot 320.
[0030] The first robot base 310 is installed at the opposite side of the conveyor unit 100. The first robot 320 loads the metal deposition plate 10 accommodated on the first robot base 310 to the inspection unit 200.
[0031] The first robot 320 includes a yoke 321 installed to the first robot base 310 to rotate by a motor, a swing member 322 connected to the yoke 321 to swing, a first arm 323 connected to the swing member 322 in cooperation with the swing member 322, a second arm 324 connected to the first arm 323 in cooperation with the first arm 323, a supporting member 325 connected to the yoke 321 and the second arm 324, and a gripper unit 326 rotatably installed to the second arm 324 to grip the metal deposition plate 10.
[0032] The unloading robot 400, as illustrated in Figs. 1 and 2, includes a second robot base 410 and a second robot 420.
[0033] The second robot base 410 is installed above the conveyor unit 100. The second robot 420 unloads the metal deposition plate 10, inspection of which has been completed by the inspection unit 200 and which is accommodated on the second robot base 410, to the conveyor unit 100.
[0034] The second robot 420, similar to the first robot 320 of the loading robot 300, includes a yoke 421, a swing member 422, a first arm 423, a second arm 424, a supporting member 425, and a gripper unit 426.
[0035] The yoke 521 is installed to the second robot base 410 to rotate by a motor. The swing member 422 is connected to the yoke 421 to swing. The first arm 423 is connected to the swing member 422 in cooperation with the swing member 422. The second arm 424 is connected to the first arm 423 in cooperation with the first arm 423. The supporting member 425 is connected to the yoke 421 and the second arm 424, and the gripper unit 426 rotatably installed to the second arm 424 to grip the metal deposition plate 10.
[0036] The gripper units 326 and 426 gripping the metal deposition plate 10 will be described with reference to Figs. 5 to 7 as follows.
[0037] Each of the gripper units 326 and 426 includes a pivoting member 510, a gripper frame 520, a pair of first grippers 530, and a pair of second grippers 540.
[0038] The pivoting members 510 are mounted to the second arms 324 and 424 to pivot. The gripper frames 520 are installed to the pivoting members 510. The first grippers 530 are installed to a side and an opposite side of the gripper frame 520 to grip the metal deposition plate 10. Each of the first grippers 530 includes a pneumatic cylinder 531, a pair of rotating members 532, and a pair of first gripping members 533.
[0039] The pneumatic cylinders 531 are installed to a side and an opposite side of the gripper frame 520. The rotating members 532 are installed to the gripper frame 520 to rotate the first gripping members 533 and are connected to the pneumatic cylinders 531, respectively. The first gripping members 533 are connected to the rotating members 532 to grip and release the metal deposition plate 10 due to the movement of the rotating members 532.
[0040] The second grippers 540 are installed inside the first gripper units 530 to the gripper frame 520 to grip the metal deposition plate 10. Each of the second grippers 540 includes a pneumatic cylinder 541 and a pair of second gripping members 542.
[0041] The pneumatic cylinders 541 are installed to a side and an opposite side of the gripper frame 520 to be inside the first gripper units 530. The second gripping members 542 are installed to the pneumatic cylinders 541 to grip and release the metal deposition plate 10.
[0042] The operation of the apparatus for inspecting a surface of an electrolytically refined metal deposition plate will be described as follows.
[0043] When the electrolytically refined metal deposition plate 10, e.g., having a size of 98 cm x 108 cm, is conveyed in the direction denoted by an arrow 'A' as shown in Fig. 1, the loading robot 300 grips the metal deposition plate 10 to load the plate 10 to the inspection unit 200. The inspection unit 200 captures the loaded metal deposition plate 10. In capturing the metal deposition plate 10, the first vision unit 220 captures one surface of the metal deposition plate 10 and the second vision unit 230 captures an opposite surface of the plate 10 to inspect whether nodules are generated on the surfaces of the metal deposition plate 10.
[0044] In order to inspect the surfaces of the metal deposition plate 10, the lighting devices 223 and 233 and the cameras 224 and 234 are installed to the elevation members 222 and 232, respectively. The elevation members 222 and 232 installed to the elevation devices 221 and 231 are elevated and lowered in the vertical direction. When the elevation members 222 and 232 are elevated and lowered in the vertical direction by the elevation devices 221 and 231, the lighting devices 223 and 233 and the cameras 224 and 234 scan and capture the surfaces of the metal deposition plate 10. The captured images of the metal deposition plate 10 are transmitted to the controller 600.
[0045] Fig. 8A shows a two-dimensional image of a surface of the metal deposition plate 10 without a nodule, whereas Fig. 8B shows a two-dimensional image of a surface of the plate 10 with nodules. Fig. 8C shows a three-dimensional image of a surface of the plate 10 without a nodule, whereas Fig. 8D shows a three-dimensional image of a surface of the plate 10 with nodules.
[0046] In a case where the images captured by the cameras 224 and 234 include nodules as shown in Figs. 8B and 8D, the controller 600 receives the captured images and determines the size and the number of the nodules to grade the metal deposition plate 10.
[0047] For example, when four grades are used to grade the metal deposition plates 10, such as an 'S' grade, an 'E' grade, a 'G' grade, and an 'R' grade, the size and the distribution per unit surface area of the nodules to be inspected are as follows.
| Grade | Nodules | |
| Distribution (per unit surface area) | Size (per unit surface area) | |
| Grade 'S' | less than 2% | 1x1 cm < 0 |
| Grade 'E' | less than 10% | 1 to 3 cm < 10, greater than 3x3 cm: 0 |
| Grade G | less than 15% | - |
| Grade R | less than 15% | - |
[0048] The metal deposition plate 10, which is captured and whose grade is determined by the controller 600, is transferred to the conveyor unit 100 by the unloading robot 400. In other words, the unloading robot 400 grips and unloads the metal deposition plate 10 accommodated in the inspection unit 200 to the conveyor unit 100. When the plate 10 is unloaded, the conveyor unit 100 conveys the plate 10 in the direction denoted by an arrow 'B' such that the controller 600 grades the plate 10.
[0049] As described above, the metal deposition plate is automatically graded based on a size of and distribution per unit surface area of nodules within the surface of the metal deposition plate, so that the electrolytically refined metal deposition plate may be graded at high speed and precisely. Moreover, it is easy to manage end product quality and to determine inferiority patterns of manufacturing apparatus.
an inspection unit for capturing and inspecting a metal deposition plate to be inspected;
a loading robot for loading the metal deposition plate to the inspection unit;
an unloading robot for unloading the metal deposition plate upon which inspection has been completed by the inspection unit;
a conveyor unit for conveying the metal deposition plate unloaded by the unloading robot; and
a controller for grading the metal deposition plate based on a size of and distribution per unit surface area of nodules on the metal deposition plate using images of the metal deposition plate captured by the inspection unit.
a conveyor base; and
a pair of chain conveyor assemblies installed to the conveyor base and including chains, wherein each of the chains includes links and seat members having seat grooves on which the metal deposition plate is seated.
an accommodating unit accommodating the metal deposition plate;
a first vision unit installed at a side of the accommodating unit to capture a surface of the metal deposition plate accommodated in the accommodating unit; and
a second vision unit installed to an opposite side of the accommodating unit to capture an opposite surface of the metal deposition plate accommodated in the accommodating unit,
wherein the surface images of the metal deposition plate are provided to the controller for the grading the metal deposition plate.an accommodator base;
a pair of guide members installed to the accommodator base and having guide grooves to guide the metal deposition plate to be accommodated; and
a tension unit installed between the guide members to attenuate shock applied when the metal deposition plate is accommodated, wherein the tension unit comprises:
a support installed between the guide members;
first tension bases installed to sides of the support;
a second tension base installed on the first tension bases; and
springs installed between the first tension bases and the second tension base to absorb shock applied when the metal deposition plate is lowered.
an elevation device;
an elevation member installed to the elevation device to be elevated and lowered;
a lighting device installed to the elevation member by an angle to illuminate the metal deposition plate; and
a camera spaced apart from the lighting device to be perpendicular to the elevation member to capture the metal deposition plate.
a fixing block installed to an elevation member and having a plurality of guide pins;
a tilting member having a plurality of longitudinal hole into which the guide pins are inserted and to which the lighting device is installed; and
a pneumatic cylinder connected to the fixing block and the lighting device to push the lighting device such that the tilting member is tilted to adjust an inclination of the lighting device.
a first robot base; and
a robot for loading the metal deposition plates accumulated on the first robot base to the inspection unit;
wherein the robot comprises:a yoke rotatably installed to the first robot base;
a swing member connected to the yoke to swing;
a first arm associated with the swing member;
a second arm associated with the first arm;
a supporting member connected to the yoke and the second arm; and
a gripper unit rotatably installed to the second arm to grip the metal deposition plate.
a second robot base; and
a robot unloading the metal deposition plates upon which the inspection has been completed by the inspection unit and which are accumulated on the second robot base to the inspection unit;
wherein the robot comprises:a yoke rotatably installed to the second robot base;
a swing member connected to the yoke to swing;
a first arm associated with the swing member;
a second arm associated with the first arm;
a supporting member connected to the yoke and the second arm; and
a gripper unit rotatably installed to the second arm to grip the metal deposition plate.
a pivoting member pivotally mounted to the second arm;
a gripper frame installed to the pivoting member;
a pair of first grippers installed to a side and an opposite side of the gripper frame to grip the metal deposition plate; and
a pair of second grippers installed to the gripper frame inside the first grippers to grip the metal deposition plate;
wherein the first grippers include:pneumatic cylinders installed to a side and an opposite side of the gripper frame;
a pair of rotating members rotatably installed to the gripper frame and connected to the pneumatic cylinders; and
a pair of first gripping members connected to the rotating members to grip and release the metal deposition plate due to the movement of the rotating members,
wherein the second grippers includes:a pair of pneumatic cylinders installed to a side and an opposite side of the gripper frame to be inside the first gripper units; and
a pair of second gripping members installed to the pneumatic cylinders to grip and release the metal deposition plate.