BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates generally to x-ray systems, devices, and related components.
More particularly, embodiments of the invention relate to brazed x-ray target assemblies
that include an oxide dispersion strengthened (ODS) alloy substrate and a carbon-based
heat sink and methods for manufacturing such x-ray target assemblies and related devices.
2. Related Technology
[0002] The X-ray tube has become essential in medical diagnostic imaging, medical therapy,
and various medical testing and material analysis industries. An x-ray tube typically
includes a cathode assembly and an anode assembly disposed within an evacuated enclosure.
The cathode assembly includes an electron source and the anode assembly includes a
target surface that is oriented to receive electrons emitted by the electron source.
During operation of the x-ray tube, an electric current is applied to the electron
source, which causes electrons to be produced by thermionic emission. The electrons
are then accelerated toward the target surface of the anode assembly by applying a
high-voltage potential between the cathode assembly and the anode assembly. When the
electrons strike the anode assembly target surface, the kinetic energy of the electrons
causes the production of x-rays. Some of the x-rays so produced ultimately exit the
x-ray tube through a window in the x-ray tube, and interact with a material sample,
patient, or other object.
[0003] Stationary anode x-ray tubes employ a stationary anode assembly that maintains the
anode target surface stationary with respect to the stream of electrons produced by
the cathode assembly electron source. In contrast, rotary anode x-ray tubes employ
a rotary anode assembly that rotates portions of the anode's target surface into and
out of the stream of electrons produced by the cathode assembly electron source. The
target surfaces of both stationary and rotary anode x-ray tubes are generally angled,
or otherwise oriented, so as to maximize the amount of x-rays produced at the target
surface that can exit the x-ray tube via a window in the x-ray tube.
[0004] In an X-ray tube device with a rotatable anode, the target has previously consisted
of a disk made of a refractory metal such as tungsten, and the X-rays are generated
by making the electron beam collide with this target, while the target is being rotated
at high speed. Rotation of the target is achieved by driving the rotor provided on
a support shaft extending from the target. Such an arrangement is typical of rotating
X-ray tubes and has remained relatively unchanged in concept of operation since its
induction.
[0005] The operating conditions for X-ray tubes have changed considerably in the recent
decades. Due to continuous demands from radiologists for higher power from X-ray tubes,
more and more tubes are using composite rotating anodes with tungsten-rhenium as a
focal spot layer, molybdenum alloy as a substrate, and brazed graphite as a heat sink.
[0006] Increasing the power levels of the x-ray tube is typically accompanied by an increase
in the operating temperatures of the anode, which, if high enough, may result in deformation
of the molybdenum alloy substrate. Deformation in the substrate can cause large stresses
in the metallurgical bond between the alloy substrate and the graphite heat sink.
Should the stress exceed a threshold value, a complete debond of the graphite heat
sink can result. The magnitude of this stress imposes a limit on the maximum size,
rotational speed and highest allowable temperature of the alloy substrate.
[0007] To overcome the problem with deformation of molybdenum alloy substrates at elevated
temperatures, other Mo-bearing alloys have been considered by x-ray target manufacturers.
Oxide dispersion strengthened (ODS) Mo alloys currently show promising performance
for reducing deformation of the substrate at high temperatures.
[0008] US 2007/0119907 A1 discloses that a composite body which can withstand high thermal stresses is formed
by high-temperature soldering at least a part of a high-temperature-resistant, metallic
or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic
component. Prior to soldering, a metallic barrier layer, which is impervious to the
solder melt, of one or more elements selected from the group consisting of V, Nb,
Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each
nonmetallic component which is to be soldered.
[0009] US 2003/0006269 A1 discloses that a reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous
supports enables an x-ray generating anode to be joined to a preferred lightweight
substrate. Complementary surfaces are provided on a dense refractory metal body and
a graphite or a carbon-carbon composite support. A particulate braze mixture comprising
Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto
the support surface, and hafnium or zirconium foil may be introduced between the braze
mixture and the refractory metal body complementary surface. Reaction-brazing is carried
out in a single step at or near the eutectic point of the components, which may be
influenced to some extent by the presence of carbon and boride.
BRIEF SUMMARY OF THE INVENTION
[0010] The present invention provides an x-ray target assembly, a method for manufacturing
an x-ray target assembly, an x-ray tube and a high performance CT-scanner as defined
in the claims. Embodiments of the invention concern x-ray target assemblies for use
as an anode in an x-ray device. The x-ray target assemblies of the embodiments have
an oxide dispersion strengthened (ODS) refractory metal alloy substrate (
e.
g., ODS Mo alloy) that is bonded to a carbon-containing heat sink. Good bonding between
the substrate and the heat sink is achieved by placing an oxide-free barrier layer
between the ODS metal substrate and the heat sink. The oxide-free barrier layer advantageously
minimizes or eliminates chemical reactions that would otherwise be possible between
the dispersed oxides and the carbon-based heat sink during the manufacturing process.
Preventing these undesired reactions while manufacturing the x-ray target assembly
yields a device with improved bonding between the heat sink and the substrate, compared
to devices manufactured without the barrier layer.
[0011] The present invention includes a method for manufacturing an x-ray target assembly
having an ODS refractory metal substrate. In one embodiment, the method includes (i)
providing an ODS refractory metal substrate (
e.
g., ODS Mo alloy), (ii) forming a barrier layer on the substrate, and (iii) brazing
a carbon-containing heat sink to the barrier layer.
[0012] The substrates used in the x-ray targets of the invention can be made of any molybdenum
or molybdenum alloy that has an oxide dispersed throughout to improve the thermal
stability and/or strength of the alloy. In one embodiment, the primary metal component
of the substrate is molybdenum or molybdenum alloyed with a proper amount of rhenium,
titanium, zirconium, niobium, tantalum, hafnium, vanadium, or tungsten. The amount
of alloying element can vary depending on solution strengthening effect of the element.
[0013] The ODS refractory metal alloy includes one or more oxides dispersed throughout the
substrate to achieve the desired thermal stability and strength. Examples of suitable
oxide compounds that can be dispersed in the refractory metal include, but are not
limited to, lanthana (La
2O
3), yttria (Y
2O
3), ceria (CeO
2), thoria (ThO
2), and combinations of these. The oxide can be included in the refractory metal in
a range from about 0.1 wt% to about 10 wt%, more preferably in a range from about
1 wt% to about 6 wt%, and most preferably in a range from about 2 wt% to about 4 wt%
depending on production capability and performance requirements.
[0014] The barrier layer is a thin layer of metal coated on the substrate to prevent the
oxides in the substrate from reacting with carbon in the heat sink during brazing.
The material used to make the barrier layer is selected to be substantially free of
the oxides in the substrate, and preferably free of any oxides. In one embodiment,
the barrier layer can be substantially pure Mo, Ta, Re, W, Ti, Nb, V, Hf, Zr, or a
Mo alloy of these. Alternatively, other applicable the barrier layer can be a carbide,
nitride, boride, or silicide of these metals.
[0015] The barrier layer can be coated (
i.
e., formed) on the substrate using a deposition technique or a mechanical technique
or other similar technique. In one embodiment the barrier layer is deposited on the
substrate using plasma spray coating, salt-bath electrodeposition, electroplating,
vacuum sputtering, melt evaporation, chemical vapor deposition, or a similar technique.
Aternatively the barrier layer can be metallurgically bonded to the substrate using
hot rolling, cold rolling, upset forging, hot isostatic pressing, cold isostatic pressing,
or a similar technique.
[0016] The foregoing techniques allow the barrier layer to be made very thin. A thin barrier
layer can be advantageous by minimizing the effect that the barrier layer has on the
thermal stability and/or strength of the substrate, while still providing the desired
barrier to reactions between the substrate and the carbon-containing heat sink. In
the embodiments according to the invention, the thickness of the barrier layer (
e.
g., Mo) is in a range from about 0.1 mm to about 1.5 mm, and most preferably in a range
from about 0.25 mm to about 1 mm.
[0017] The carbon-containing heat sink is brazed to the substrate to form the target assembly.
Any type of thermally conductive carbon-based heat sink can be used. Graphitic and/or
composite carbon heat sinks are preferred for their durability and ability to conduct
heat away from the substrate during use.
[0018] The heat sink can be brazed to the barrier layer using a braze that is compatible
with the particular heat sink being used and the particular metals in the barrier
layer. Examples of suitable brazes include, but are not limited to, Zr, Ti, V, Cr,
Fe, Co, Ni, Pt, Rd, and Pd.
[0019] The x-ray target devices manufactured using the method of the present invention have
surprisingly good bonding between the heat sink and the substrate compared to similar
devices manufactured without a barrier layer. It is believed that the superior bonding
in the x-ray target assemblies of the invention is achieved by reducing or eliminating
the production of carbon oxide gases during the brazing process. The barrier layer
keeps oxides in the ODS refractory metal away from the carbon heat sink during the
brazing process, thereby preventing the oxides from reacting with carbon to form a
gaseous carbon oxide. Preventing the formation of gases during brazing improves the
quality of bonding.
[0020] These and other advantages and features of the invention will become more fully apparent
from the following description and appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order that the manner in which the above-recited and other advantages and features
of the invention are obtained, a more particular description of the invention briefly
described above will be rendered by reference to specific embodiments thereof which
are illustrated in the appended drawings. Understanding that these drawings depict
only typical embodiments of the invention and are not therefore to be considered limiting
of its scope, the invention will be described and explained with additional specificity
and detail through the use of the accompanying drawings in which:
Figure 1 is a cross-sectional view of an x-ray target assembly according to one embodiment
of the invention;
Figure 2 is an end view of the x-ray target assembly of Figure 1 showing the disk-like
shape of the substrate and track;
Figure 3 is a partial cross-sectional view of the x-ray target assembly of Figure
1 showing the barrier layer in more detail;
Figure 4 is a high resolution photograph showing a cross section of a portion of an
x-ray target assembly manufactured according to one embodiment of the invention;
Figure 5 is a partial cross-sectional view of an x-ray tube incorporating the x-ray
target assembly of Figure 1.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
I. X-ray Target Assembly
[0022] Reference will now be made to the figures wherein like structures will be provided
with like reference designations. It is understood that the drawings are diagrammatic
and schematic representations of exemplary embodiments of the invention, and are not
limiting of the present invention nor are they necessarily drawn to scale.
[0023] Figures 1-3 depict various features of embodiments of the present invention, which
is generally directed to an x-ray tube device having a high performance rotating anode.
Reference is first made to Figure 1, which illustrates in cross-section a simplified
structure of an example rotating-type x-ray target assembly 100. The x-ray target
assembly 100 includes a target substrate 110 that is formed from an oxide dispersed
strengthened molybdenum alloy. A stem 112 is integrally formed with the target substrate
110. A target focal track 114 is formed on the upper surface of the target substrate.
Focal track 114 is typically made of a tungsten-rhenium alloy, although other materials
can also be used. Electrons generated by a cathode (not shown) impinge on the focal
track 114. The X-ray emitting metal of focal track 114 emits X-rays in response to
the impingement of electrons. The target substrate 110 is backed by a heat sink 116,
which is bonded to the substrate through various layers, which are discussed more
fully below. Heat produced from the impingement of the electrons is mostly dissipated
through heat sink 116. As shown in Figure 2, in one embodiment, substrate 110 and
focal track 114 can be shaped like a disk to facilitate high speed rotation.
[0024] The anode assembly 100 is rotated by an induction motor, which drives bearing sleeve
119 and bearing shaft 118. Bearing shaft 118 is connected to stem 112 and rotatably
supported by bearings 120. Bearings 120 are housed in bearing housing 122, which supports
the x-ray target assembly 100.
[0025] In a typical x-ray tube, the anode and cathode assemblies are sealed in a vacuum
envelope. The stator portion of the motor is typically provided outside the vacuum
envelope. The x-ray tube can is enclosed in a casing having a window for the X-rays
that are generated to escape the tube. The casing can be filled with oil to absorb
heat produced as a result of x-ray generation.
[0026] Figure 3 shows a portion of the x-ray target assembly, illustrating substrate 110
and the heat sink 116 in greater detail and showing the interlayers that bond substrate
110 to the heat sink 116. As shown in Figure 3, x-ray target assembly 100 includes
a barrier layer 124 and a braze layer 126.
[0027] Barrier layer 124 is positioned between substrate 110 and heat sink heat sink 116
to prevent chemical reactions between substrate 110 and heat sink 116 during brazing.
The following describes the substrate, heat sink, and interlayers in more detail.
A. Substrate
[0028] Substrate 110 can have any shape suitable for use in an x-ray tube. To facilitate
rotation, the substrate is preferably disk-like. The thickness of the substrate and
shape is selected to maximize strength, heat dissipation, and ease of manufacturing
while minimizing cost. In one embodiment, the substrate is substantially disk shaped
and has a thickness in a range from about 10 mm to about 14 mm. Substrate 110 can
be made from any oxide-dispersed-strengthened refractory metal (ODS refractory metal).
In a preferred embodiment, the primary refractory metal is Mo. Molybdenum-based substrates
have yielded exceptionally good substrates for use in rotating anode x-ray tubes.
[0029] In addition to the refractory metal, the substrate includes one or more inert metal
oxides that are dispersed as fine particles throughout the refractory metal. Examples
of suitable metal oxides that can be dispersed in the refractory metal include lanthana,
yttria, ceria, and thoria, with lanthana being preferred.
[0030] The metal oxide compounds can be included in the refractory metal in any amount that
yields a strengthened refractory metal substrate. In one embodiment, the weight percent
of the metal oxide (
e.
g., La) in the ODS refractory metal is in a range from about 0.1 wt% to about 10 wt%,
more preferably in a range from about 1.0 wt% to about 6 wt%, and most preferably
in a range from about 2 wt% to about 4 wt%.
[0031] The grain size of the ODS refractory metal and the particle size of the metal oxides
can have an effect on the properties of the substrate. In one embodiment, the grain
size is in a range from about 10 to about 50 micrometers and the average diameter
of the oxide particles is in a range from about 0.05 micrometers to about 5 micrometers.
[0032] The ODS refractory metals can be manufactured using any suitable method. In one embodiment
of the invention, the ODS refractory metal can be manufactured by using the following
steps: (a) forming a slurry of molybdenum oxide and an aqueous solution of a metal
salt selected from nitrates or acetates of lanthanum, cerium, thorium, or yttria;
(b) heating the slurry in a hydrogen atmosphere to produce a powder of molybdenum
and the oxides of the metal salt; (c) mixing and cold isostatically pressing the powder;
(d) sintering the powder from step (c) in a hydrogen atmosphere to produce a sintered
product; and (e) thermomechanically processing the sintered product to a total reduction
in cross-sectional area of about 60% to about 80% or even higher to produce about
a 93%-99% dense molybdenum alloy containing an oxide dispersion.
[0033] The ODS refractory metals are typically provided as a powder. Substrate 110 can be
manufactured from the powders using known powder metallurgy techniques.
B. Heat Sink
[0035] The heat sink 116 is a carbon-based structure positioned on the substrate 110 so
as to absorb heat generated from electrons impinging upon focal track 114, to create
x-rays. Heat sink 116 is made of a thermoconductive material such as, but not limited
to, graphite or thermally conductive carbon composite. During use, the heat sink absorbs
thermal energy from the substrate and dissipates the heat. The heat sink can have
any shape or size so long as the heat sink adequately dissipates heat and is suitable
for rotating anodes. Typically the heat sink is disk-shaped to facilitate high speed
rotation. The surface of the heat sink that faces the substrate can have a regular
or irregular pattern of grooves to enhance the surface area that bonds with the substrate.
In one embodiment, the pattern comprises concentric or phonographic grooves.
C. Barrier Layer
[0036] The barrier layer is a thin layer of a metal compound that separates the ODS refractory
metal from the carbon-based heat sink. The barrier layer material is substantially
free of the metal oxides that are present in the substrate and is preferably free
of any oxides. The barrier layer can be made from a substantially pure metal. Examples
of suitable metals include Mo, Ta, Re, W, Ti, Nb, V, Hf, Zr, and combinations of these.
These compounds can also be used in combination with boron, silicon, nitrogen, or
carbon in the form of metal borides, nitrides, silicides, carbides, or combinations
of these. Where a metal carbide is used as the barrier layer, the surface of the substrate
can be chemically etched before depositing the carbide so as to remove oxides from
the surface of the substrate, thereby preventing the oxides from reacting with the
carbide.
[0037] In one embodiment, the barrier layer is made very thin to minimize the effect that
the barrier layer has on the overall mechanical and chemical properties of the substrate.
Since the barrier layer does not include the dispersed oxides, the barrier layer does
not have some of the same properties as the oxide containing portion of the substrate.
By using a thin layer, the overall properties of the substrate can retain the strength
and thermal properties of the substrate. In the embodiments according to the invention,
the barrier layer has a thickness in a range from about 0.1 mm to about 1.5 mm, and
most preferably in a range from about 0.25 mm to about 1.0 mm.
D. Braze layer
[0038] The braze layer is a layer of metal that bonds the surface of the carbon-containing
heat sink to the substrate. The braze layer is formed by brazing (
i.
e., melting) a brazing material. At the interface of the heat sink and the braze layer,
the braze layer takes the shape of the surface of the heat sink. In one embodiment,
the heat sink has concentric rings or another grooved pattern that the braze layer
fills to provide high surface area contact.
[0039] The braze layer is made from any brazing material compatible with brazing the carbon-based
heat sink to the barrier layer. The brazing material is typically selected to have
a melting point that is below that of the substrate. In one embodiment, the braze
material and a component of the barrier layer form a diffused boundary. The diffused
boundary can be formed by selecting a braze that melts at a temperature similar to
at least one metal component in the barrier material. In one embodiment, the braze
and the barrier material form a eutectic during brazing. Examples of suitable brazing
materials include Zr, Ti, V, Cr, Fe, Co, Ni, Pt, Rd, and Pd.
II. Methods For Manufacturing X-ray Target Assembly
[0040] Embodiments of the invention also include methods for manufacturing an anode assembly.
Methods for manufacturing the anode assembly according to the invention generally
include (i) providing an x-ray target substrate having a deposited track, (ii) forming
a barrier layer on at least a portion of the substrate on the opposite side as the
track, and (iii) brazing a carbon-containing heat sink to the substrate.
[0041] The substrate can be provided in powder form or as a manufactured and/or machined
piece. In the case where the substrate is provided in powder form, the manufacturing
process of the invention yields a solidified solid structure having the desired shape
(
e.
g., a disk shaped solid).
[0042] The barrier layer is formed on at least a portion of the substrate. Preferably the
barrier layer covers the entire surface where the heat sink is to be attached. If
desired, the barrier layer can cover the entire substrate (
e.
g., a W or W-Re substrate).
[0043] The barrier layer is formed on the substrate by either depositing a barrier layer
material or by mechanically bonding a thin layer of barrier material to the substrate.
Examples of suitable materials that can be deposited or mechanically bonded to the
substrate include pure metals, borides, nitrides, silicides, or carbides of Mo, Ta,
Re, W, Ti, Nb, V, Hf, Zr, and combinations of these.
[0044] To deposit the barrier material on the substrate, any deposition technique compatible
with the barrier layer materials can be used. Examples of suitable deposition techniques
include plasma spray coating, salt-bath electrodeposition, electroplating, vacuum
sputtering, melt evaporation, chemical or physical vapor deposition, or a combination
of these. The deposition technique is carried out so as to deposit the barrier layer
material in the desired location and with a desired thickness. Those skilled in the
art are familiar with the use of the foregoing techniques to deposit thin or thick
layers of metals.
[0045] Where a carbide is used as the barrier material, it can be advantageous to remove
oxides from the surface of the substrate before depositing the metal carbide compound.
Removing oxides prevents the carbides from forming carbon oxides during the deposition
process. Carbon oxides typically form gases that can cause poor bonding between the
substrate and the barrier layer. The oxides on the surface of the substrate can be
removed using chemical etching techniques known in the art.
[0046] In an alternative embodiment, a mechanical technique can be used to form the barrier
layer. Examples of mechanical techniques that can be used to form the barrier layer
include hot rolling, cold rolling, upset forging, hot isostatic pressing, cold isostatic
pressing, and combinations thereof. In this embodiment, the barrier material can be
provided as a thin sheet that is pressed onto the substrate.
[0047] In one embodiment, the barrier layer can be formed while simultaneously forming the
substrate from a powder ODS refractory metal. In this embodiment, a three-dimensional
piece of barrier material (
e.
g., a can) is used to hold the powdered ODS refractory metal. The substrate is then
formed inside the barrier material using a technique such as isostatic pressing. In
this embodiment, the barrier material encapsulates the substrate. If desired, the
barrier material can be machined or otherwise worked to remove a portion of the barrier
material.
[0048] In a subsequent step, the carbon heat sink is brazed to the substrate (
i.
e., to the barrier layer on the substrate). In one embodiment, the braze can be Ti,
Zr, or a compound thereof. The barrier layer material, braze material, brazing temperature,
and thickness of the barrier layer are selected to ensure that the braze will form
a melt and bond the heat sink to the barrier layer, while preventing oxides in the
ODS metal from coming into contact with the carbon substrate. The braze and barrier
material can be selected such that the brazing temperature is below the melting point
of the barrier material. In one embodiment, the barrier material has a melting point
in a range from about 1600 °C to about 2000 °C, alternatively in a range from about
1700 °C to about 1900 °C. In some cases the melting point of the barrier layer can
be in a range between about 2000 °C and 3900 °C (
e.
g., for W or TaC or ZrC materials).
[0049] The type of barrier material used can also affect the temperature need during brazing.
In one embodiment, the materials are selected to form a eutectic, thereby allowing
for brazing at relatively low temperatures. Alternatively, if the barrier material
is a boride, nitride, silicide, or carbide, the brazing temperature may need to be
close to the melting point of the braze. In addition, the particular barrier material
selected should be thermodynamically stable above the melting point of the braze.
For example, where Zr is used as a braze, the barrier material can be selected to
be stable at a temperature above 1850 °C, the melting point of Zr.
[0050] During the brazing process, the barrier material provides a physical barrier between
the carbon atoms in the heat sink and the oxides in the ODS refractory metal of the
substrate. During brazing, there is typically some diffusion of atoms at the boundary
between the braze and other layers. By using a barrier layer that is substantially
free of oxides, there are no oxides available to migrate through the braze to the
boundary with the carbon heat sink when the braze is molten. Similarly, if carbon
radicals diffuse from the boundary with the carbon heat sink to the boundary with
the barrier layer, there will be no oxides that can form carbon oxide gases. By reducing
and/or eliminating the formation of carbon oxide gases during brazing, the braze is
able to form a good bond with the carbon heat sink and allows for a higher performance
anode to be built.
[0051] The superior bonding of the carbon heat sink to the substrate allows for very large
targets to be manufactured. In one embodiment, the target has a diameter of at least
about 100 mm, more preferably at least about 150 mm and most preferably at least about
200 mm. Of course smaller diameters such as from 25-100 mm are also possible. Larger
diameter targets are useful for making higher performance x-ray tubes.
III. Examples
[0052] The following provides an example of an x-ray target assembly and method according
to one embodiment of the invention. An x-ray target assembly was manufactured from
a substrate comprising an ODS Mo alloy. The ODS Mo alloy included 1 wt% La
2O
3 dispersed in Mo. The substrate was disk-shaped with an approximately 200 mm diameter.
A W-Re track was deposited on the upper side of the substrate using a vacuum plasma
spray process. A substantially pure Mo barrier layer of about 0.25 mm to 1 mm was
deposited on the substrate using a vacuum plasma spray process.
[0053] A graphite heat sink with "record grooves" was brazed to the substrate using a Zr
braze washer (thickness of ~ 0.25 mm). Figure 4 is a high resolution picture of a
cross section of the x-ray target assembly. The cross section was achieved by fracturing
the substrate and heat sink. The specimen shows excellent brazing between the substrate
and the carbon heat sink as evidenced by the Zr-Mo-C (ternary alloy) brazed layer
with no bubbles within the well-defined "saw-tooth like" outline on the graphite side
(
i.
e., cross-section of record groove) and straight boundary with the Mo barrier. In contrast,
targets manufactured the same way except without a barrier layer showed significant
spacing at the boundary between the braze and the heat sink, which resulted in debonded
areas and poor performance of heat conduction into the heat sink. It is believed that
the poor bonding in the devices made without the barrier layer was due to the formation
of carbon oxide gas bubbles that prevented good bonding between the graphite and the
ODS substrate.
IV. Use of Target Assembly In X-Ray Tube And CT-Scanner
[0054] The x-ray target assemblies of the present invention can advantageously be incorporated
into an x-ray tube. Figure 5 illustrates an x-ray tube 200 that includes an outer
housing 202, within which is disposed an evacuated enclosure 204. Disposed within
evacuated enclosure 204 is a cathode 208 and a rotating anode 100, manufactured according
to the present invention. Anode 100 is spaced apart from and oppositely disposed to
cathode 208. Anode 100 is rotatably supported by bearing assembly 120.
[0055] As is typical, a high-voltage potential is provided between anode 100 and cathode
208. In the illustrated embodiment, cathode 208 is biased by a power source (not shown)
to have a large negative voltage, while anode 100 is maintained at ground potential.
In other embodiments, the cathode is biased with a negative voltage while the anode
is biased with a positive voltage.
[0056] Cathode 208 includes at least one filament 214 that is electrically connected to
a high-voltage source. During operation, electrical current is passed through the
filament 214 to cause electrons, designated at 218, to be emitted from cathode 208
by thermionic emission. Application of the high-voltage differential between anode
100 and cathode 208 then causes electrons 218 to accelerate from cathode filament
214 toward a focal track 114 that is positioned on a target surface of rotating anode
100.
[0057] As electrons 218 accelerate, they gain a substantial amount of kinetic energy, and
upon striking the target material on focal track 114, some of this kinetic energy
is converted into electromagnetic waves of very high frequency (
i.
e., x-rays). At least some of the emitted x-rays, designated at 222, are directed through
x-ray transmissive window 224 disposed in outer housing 202. Window 224 is comprised
of an x-ray transmissive material so as to enable the x-rays to pass through window
224 and exit x-ray tube 200. The x-rays exiting the tube 100 can then be directed
for penetration into an object, such as a patient's body during a medical evaluation,
or a sample for purposes of materials analysis.
[0058] The high performance and/or larger diameters of the x-ray target assemblies of the
present invention make the x-ray target assemblies of the invention particularly suitable
for use in high performance devices such as CT-scanners. CT-scanners incorporating
the x-ray tubes of the invention can achieve higher intensity x-rays that allow for
higher resolution spectroscopy. Thus, the CT-scanners of the invention can be made
to detect material features that might not otherwise be possible with x-ray tubes
having inferior performance. In addition, the improved bonding of the heat sink to
the substrate improves the durability of the device, thereby lowering operating costs
and/or avoiding downtime for repairs or maintenance.
[0059] The disclosed embodiments are to be considered in all respects only as exemplary
and not restrictive. The scope of the invention is, therefore, indicated by the appended
claims rather than by the foregoing disclosure.
1. An x-ray target assembly for use in a rotating anode assembly, comprising:
a substrate (110) comprising a refractory metal and one or more oxide compounds dispersed
in the refractory metal;
a heat sink (116) comprising carbon;
a barrier layer (124) having a thickness in a range from about 0.1 millimeter to about
1.5 millimeter, the barrier layer (124) bonded to the substrate (110) so as to be
positioned between the substrate (110) and heat sink (116), wherein the barrier layer
(124) is substantially free of the one or more oxide compounds that are dispersed
in the refractory metal; and
a braze layer (126);
characterised in that barrier layer (124) is directly bonded to the substrate (110) and in that the braze layer (126) is positioned directly between the heat sink (116) and the
barrier layer (124) such that the barrier layer (124) and the heat sink (116) are
brazed directly together by the braze layer.
2. An x-ray target assembly as in claim 1, wherein the barrier layer (124):
is made from a substantially pure metal, or
is made from a substantially pure metal of Mo, Ta, Re, W, Ti, Nb, V, Hf or Zr, or
a combination thereof, or
comprises:
a boride of Mo, Ta, Re, W, Ti, Nb, V, Hf or Zr,
a silicide of Mo, Ta, Re, W, Ti, Nb, V, Hf or Zr,
a nitride of Mo, Ta, Re, W, Ti, Nb, V, Hf or Zr, or
a carbide of Mo, Ta, Re, W, Ti, Nb, V, Hf or Zr, or
a combination thereof.
3. An x-ray target assembly as in claim 1 or 2, wherein the barrier layer (124) has a
thickness in a range from about 0.25 mm to about 1.0 mm.
4. An x-ray target assembly as in claim 1, 2 or 3 wherein the braze layer (126) comprises
Zr, Ti, V, Cr, Fe, Co, Ni, Pt or Pd.
5. An x-ray target assembly as in claim 1, 2, 3 or 4, wherein the substrate (110) is
disk-shaped and further comprises a circular target track about a periphery of the
substrate.
6. An x-ray target assembly as in any one of claims 1 to 5, wherein the refractory metal
is molybdenum or a molybdenum alloy.
7. An x-ray target assembly as in any one of claims 1 to 6, wherein the oxide compound
comprises lanthana, yttria, ceria, thoria, or a combination thereof.
8. A method for manufacturing an x-ray target assembly, comprising:
providing a substrate (110) comprising a refractory metal and one or more oxide compounds
dispersed in the refractory metal;
forming a target track (114) on the substrate (110);
forming a barrier layer (124) having a thickness in a range from about 0.1 millimeter
to about 1.5 millimeter on at least a portion of the substrate (110) such that the
barrier layer (124) is bonded to the substrate (110), the barrier layer (124) comprising
a material that is substantially free of the one or more oxide compounds that are
dispersed in the refractory metal; and
characterised in that the barrier layer (124) is directly bonded to the substrate (110), and by, subsequent
to the barrier (124) forming step, brazing a carbon-based heat sink (116) directly
to the barrier layer (124) using a braze (126).
9. A method as in claim 8, wherein the refractory metal is molybdenum or a molybdenum
alloy.
10. A method as in claim 8 or 9, wherein the oxide compound comprises lanthana, yttria,
ceria, thoria, or a combination thereof.
11. A method as in claims 8, 9 or 10, wherein the heat sink (116) comprises graphite or
a carbon composite.
12. A method as in claim 8, 9, 10 or 11, wherein the barrier layer (124) comprises Mo,
Ta, Re, W, Ti, Nb, V, Hf, Zr, or combinations thereof.
13. A method as in claim 8, wherein the substrate (110) comprises an oxide dispersion
strengthened (ODS) Mo alloy and wherein the barrier layer (124) is substantially pure
metal or metal alloy selected from the group consisting of Mo, Ta, Re, W, Ti, Nb,
V, Hf, Zr, or a Mo alloy thereof, and the method includes outgassing the substrate
coated by the barrier layer (124) and brazing a graphite disk to the outgassed coated
substrate using a braze comprising Zr, Ti, V, Cr, Fe, Co, Ni, Pt, or Pd.
14. A method as in any one of claims 8 to 13, wherein the barrier layer (124) is deposited
on the substrate (110) using a technique selected from the group consisting of plasma
spray coating, salt-bath electrodeposition, electroplating, vacuum sputtering, melt
evaporation, chemical vapor deposition, physical vapor deposition, or a combination
thereof.
15. A method as in any one of claims 8 to 14, wherein the barrier layer (124) is mechanically
adhered or metallurgically bonded to the substrate (110) using a technique selected
from the group consisting of hot rolling, cold rolling, upset forging, hot isostatic
pressing, cold isostatic pressing, and combinations thereof.
16. An x-ray tube comprising the x-ray target of any one of claims 1 to 7 or an x-ray
target manufactured according to the method of any one of claims 8 to 12.
17. A high performance CT-scanner comprising the x-ray tube or x-ray target of claim 16.
1. Röntgentarget-Anordnung zur Verwendung in einer rotierenden Anodenanordnung, umfassend:
ein Substrat (110), das ein hochschmelzendes Metall und eine oder mehrere in dem hochschmelzenden
Metall dispergierte Oxidverbindungen umfasst;
eine Wärmesenke (116), die Kohlenstoff umfasst;
eine Sperrschicht (124) mit einer Dicke im Bereich von etwa 0,1 Millimeter bis etwa
1,5 Millimeter, wobei die Sperrschicht (124) mit dem Substrat (110) verbunden ist,
so dass sie zwischen dem Substrat (110) und der Wärmesenke (116) positioniert werden
kann, wobei die Sperrschicht (124) im Wesentlichen frei von der einen oder den mehreren
Oxidverbindungen, die in dem hochschmelzenden Metall dispergiert sind, ist;
eine Lotschicht (126);
dadurch charakterisiert, dass die Sperrschicht (124) direkt mit dem Substrat (110)
verbunden ist und dadurch, dass die Lotschicht (126) direkt zwischen der Wärmesenke
(116) und der Sperrschicht (124) positioniert ist, so dass die Sperrschicht (124)
und die Wärmesenke (116) direkt durch die Lotschicht zusammengelötet werden.
2. Röntgentarget-Anordnung nach Anspruch 1, wobei die Sperrschicht (124):
im Wesentlichen aus einem reinen Metall gefertigt ist, oder
im Wesentlichen aus einem reinen Metall von Mo, Ta, Re, W, Ti, Nb, V, Hf oder Zr oder
einer Kombination davon gefertigt ist, oder
ein Borid von Mo, Ta, Re, W, Ti, Nb, V, Hf oder Zr,
ein Silicid von Mo, Ta, Re, W, Ti, Nb, V, Hf oder Zr,
ein Nitrid von Mo, Ta, Re, W, Ti, Nb, V, Hf oder Zr, oder
ein Carbid von Mo, Ta, Re, W, Ti, Nb, V, Hf oder Zr oder eine Kombination davon umfasst.
3. Röntgentarget-Anordnung nach Anspruch 1 oder 2, wobei die Sperrschicht (124) eine
Dicke in einem Bereich von etwa 0,25 mm bis etwa 1,0 mm aufweist.
4. Röntgentarget-Anordnung nach Anspruch 1, 2 oder 3, wobei die Lotschicht (126) Zr,
Ti, V, Cr, Fe, Co, Ni, Pt oder Pd umfasst.
5. Röntgentarget-Anordnung nach Anspruch 1, 2, 3 oder 4, wobei das Substrat (110) scheibenförmig
ist und ferner eine kreisförmige Targetspur um einen Umfang des Substrats umfasst.
6. Röntgentarget-Anordnung nach einem der Ansprüche 1 bis 5, wobei das hochschmelzende
Metall Molybdän oder eine Molybdän-Legierung ist.
7. Röntgentarget-Anordnung nach einem der Ansprüche 1 bis 6, wobei die Oxidverbindung
Lanthanoxid, Yttriumoxid, Ceroxid, Thoriumoxid oder eine Kombination davon umfasst.
8. Verfahren zur Herstellung einer Röntgentarget-Anordnung, umfassend:
Bereitstellen eines Substrats (110), das ein hochschmelzendes Metall und eine oder
mehrere in dem hochschmelzenden Metall dispergierte Oxidverbindungen, umfasst;
Bilden einer Targetspur (114) auf dem Substrat (110) ;
Bilden einer Sperrschicht (124) mit einer Dicke im Bereich von etwa 0,1 Millimeter
bis etwa 1,5 Millimeter auf mindestens einem Abschnitt des Substrats (110), so dass
die Sperrschicht (124) mit dem Substrat (110) verbunden ist, wobei die Sperrschicht
(124) ein Material umfasst, das im Wesentlichen frei von der einen oder den mehreren
Oxidverbindungen, die in dem hochschmelzenden Metall dispergiert sind, ist;
dadurch charakterisiert, dass die Sperrschicht (124) direkt mit dem Substrat (110)
verbunden ist und dadurch, dass im Anschluss an den Sperre (124)-bildenden Schritt
eine kohlstoffbasierte Wärmesenke (116) direkt an die Sperrschicht (124) unter Verwendung
eines Lots (126) gelötet wird.
9. Röntgentarget-Anordnung nach Anspruch 8, wobei das hochschmelzende Metall Molybdän
oder eine Molybdän-Legierung ist.
10. Röntgentarget-Anordnung nach einem der Ansprüche 8 oder 9, wobei die Oxidverbindung
Lanthanoxid, Yttriumoxid, Ceroxid, Thoriumoxid oder eine Kombination davon umfasst.
11. Verfahren nach Ansprüchen 8, 9 oder 10, wobei die Wärmesenke (116) Graphit oder einen
Kohlenstoff-Verbundwerkstoff umfasst.
12. Verfahren nach Anspruch 8,9, 10 oder 11, wobei die Sperrschicht (124) Mo, Ta, Re,
W, Ti, Nb, V, Hf, Zr oder Kombinationen davon umfasst.
13. Verfahren nach Anspruch 8, wobei das Substrat (110) eine oxidispersionsverfestigte
(ODS) Mo-Legierung umfasst und wobei die Sperrschicht (124) ein im Wesentlichen reines
Metall oder eine Metalllegierung, ausgewählt aus der Gruppe bestehend aus einer Mo-,
Ta-, Re-W-, Ti-, Nb-, V-, Hf-, Zr- oder Mo-Legierung davon ist, und das Verfahren
Entgasen des von der Sperrschicht (124) beschichteten Substrats und Löten einer Graphit-Scheibe
an das entgaste beschichtete Substrat unter Verwendung eines Lots, das Zr, Ti, V,
Cr, Fe, Co, Ni, Pt, oder Pd umfasst, umfasst.
14. Verfahren nach einem der Ansprüche 8 bis 13, wobei die Sperrschicht (124) unter Verwendung
einer Technik, ausgewählt aus der Gruppe bestehend aus Plasmaspritzen, Salzbad-Elektroabscheidung,
Galvanisieren, Sputtern im Vakuum, Schmelzverdampfung, chemische Dampfabscheidung,
physikalische Dampfabscheidung oder einer Kombination davon, auf dem Substrat (110)
abgeschieden wird.
15. Verfahren nach einem der Ansprüche 8 bis 14, wobei die Sperrschicht (124) unter Verwendung
einer Technik, ausgewählt aus der Gruppe bestehend aus Warmwalzen, Kaltwalzen, Stauchen,
heißisostatischem Pressen, kaltisostatischem Pressen und Kombinationen davon, mit
dem Substrat (110) mechanisch verklebt oder metallurgisch verbunden wird.
16. Röntgenröhre, die das Röntgentarget nach einem der Ansprüche 1 bis 7 oder ein Röntgentarget,
das nach dem Verfahren nach einem der Ansprüche 8 bis 12 hergestellt wird, umfasst.
17. Hochleistungs-CT-Scanner, der die Röntgenröhre oder das Röntgentarget nach Anspruch
16 umfasst.
1. Ensemble de cible pour rayons X devant être utilisé dans un jeu d'anode rotative,
comprenant :
un substrat (110) contenant un métal réfractaire et un ou plusieurs composés d'oxyde
dispersés dans le métal réfractaire ;
un puits thermique (116) contenant du carbone ;
une couche barrière (124) ayant une épaisseur dans une fourchette d'environ 0,1 millimètre
à environ 1,5 millimètre, la couche barrière (124) étant liée au substrat (110) de
sorte qu'elle soit positionnée entre le substrat (110) et le puits thermique (116),
la couche barrière (124) étant sensiblement exempte d'un ou de plusieurs composés
oxydes qui sont dispersés dans le métal réfractaire ; et
une couche de brasure (126) ;
caractérisé en ce que la couche barrière (124) est directement liée au substrat (110) et en ce que la couche de brasure (126) est positionnée directement entre le puits thermique (116)
et la couche barrière (124) de sorte que la couche barrière (124) et le puits thermique
(116) sont brasées directement ensemble par la couche de brasure.
2. Ensemble de cible pour rayons X selon la revendication 1, dans lequel la couche barrière
(124) :
est fabriquée en un métal sensiblement pur, ou
est fabriquée en un métal sensiblement pur de Mo, Ta, Re, W, Ti, Nb, V, Hf ou Zr,
ou une combinaison de ceux-ci, ou
comprend :
un borure de Mo, Ta, Re, W, Ti, Nb, V, Hf ou Zr,
un siliciure de Mo, Ta, Re, W, Ti, Nb, V, Hf ou Zr,
un nitrure de Mo, Ta, Re, W, Ti, Nb, V, Hf ou Zr,
un carbure de Mo, Ta, Re, W, Ti, Nb, V, Hf ou Zr,
une combinaison de ceux-ci.
3. Ensemble de cible pour rayons X selon la revendication 1 ou 2, dans lequel la couche
barrière (124) possède une épaisseur dans une fourchette d'environ 0,25 à environ
1,0 mm.
4. Ensemble de cible pour rayons X selon la revendication 1, 2 ou 3, dans lequel la couche
de brasure (126) contient le Zr, Ti, V, Cr, Fe, Co, Ni, Pt ou Pd.
5. Ensemble de cible pour rayons X selon la revendication 1, 2, 3 ou 4, dans lequel le
substrat (1 10) a une forme de disque et comprend également une voie de cible circulaire
autour de la périphérie du substrat.
6. Ensemble de cible pour rayons X selon l'une quelconque des revendications 1 à 5, dans
lequel le métal réfractaire est le molybdène ou un alliage de molybdène.
7. Ensemble de cible pour rayons X selon l'une quelconque des revendications 1 à 6, dans
lequel le composé d'oxyde comprend le lanthane, l'yttrium, la cérine, la thorine,
ou une combinaison de ceux-ci.
8. Procédé de fabrication d'un ensemble de cible pour rayons X, comprenant :
l'utilisation d'un substrat (110) contenant un métal réfractaire et un ou plusieurs
composés d'oxyde dispersés dans le métal réfractaire ;
la formation d'une piste cible (114) sur le substrat (110) ;
la formation d'une couche barrière (124) ayant une épaisseur dans une fourchette d'environ
0,1 millimètre à environ 1,5 millimètre sur au moins une partie du substrat (110)
de sorte que la couche barrière (124) est liée au substrat (110), la couche barrière
(124) comprenant un matériau qui est sensiblement exempt d'un ou de plusieurs composés
d'oxyde dispersés dans le métal réfractaire ; et
caractérisé en ce que la couche barrière (124) est directement liée au substrat (110), et en ce que, après l'étape de formation de la barrière (124), un puits thermique (116) à base
de carbone est directement brasé à la couche barrière (124) avec une brasure (126).
9. Procédé selon la revendication 8, dans lequel le métal réfractaire est du molybdène
ou un alliage de molybdène.
10. Procédé selon les revendications 8 ou 9, dans lequel le composé d'oxyde comprend du
lanthane, de l'yttrium, de la cérine, de la thorine, ou une combinaison de ceux-ci.
11. Procédé selon les revendications 8, 9, ou 10 dans lequel le puits thermique (116)
contient du graphite ou un composite de carbone.
12. Procédé selon les revendications 8, 9, 10 ou 11 dans lequel la couche barrière (124)
contient du Mo, Ta, Re, W, Ti, Nb, V, Hf, Zr, ou des combinaisons de ceux-ci.
13. Procédé selon la revendication 8, dans lequel le substrat (110) comprend un alliage
de Mo renforcé par une dispersion d'oxyde (ODS) et dans lequel la couche barrière
(124) est un métal sensiblement pur ou un alliage de métal choisi dans le groupe composé
de Mo, Ta, Re, W, Ti, Nb, V, Hf, Zr ou un alliage Mo de ceux-ci, et le procédé comprenant
le dégazage du substrat recouvert par la couche barrière (124) et la brasure d'un
disque en graphite au substrat recouvert dégazé en utilisant une brasure contenant
du Zr, Ti, V, Cr, Fe, Co, Ni, Pt ou du Pd.
14. Procédé selon l'une quelconque des revendications 8 à 13, dans lequel la couche barrière
(124) est déposée sur le substrat (110) à l'aide d'une technique choisie dans le groupe
composé d'un revêtement par jet de plasma, l'électrodéposition par bain de sel, la
galvanoplastie, la pulvérisation à vide, l'évaporation par fusion, le dépôt chimique
en phase vapeur, le dépôt physique en phase vapeur, ou une combinaison de ceux-ci.
15. Procédé selon l'une quelconque des revendications 8 à 14, dans lequel la couche barrière
(124) est collée mécaniquement ou liée métallurgiquement au substrat (110) avec une
technique choisie dans le groupe composé de laminage à chaud, laminage à froid, refoulage,
pressage hydrostatique à chaud, pressage hydrostatique à froid et des combinaisons
de ceux-ci.
16. Un tube à rayons X comprenant la cible à rayons X de l'une quelconque des revendications
1 à 7 ou une cible à rayons X fabriquée selon le procédé de l'une quelconque des revendications
8 à 12.
17. Tomodensitogramme à haute performance comprenant un tube à rayons X ou une cible à
rayons X selon la revendication 16.