MULTI-LAYER COMPACT, EMBEDDED ANTENNAS USING LOW-LOSS SUBSTRATE STACK-UP FOR MULTI-FREQUENCY BAND APPLICATIONS - Patent 2201642

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EP 2 201 642 A1

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(43)	Date of publication:
	30.06.2010 Bulletin 2010/26

(21)	Application number: 08840186.4

(22)	Date of filing: 10.10.2008

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International Patent Classification (IPC):

H01P 1/24^(2006.01)

H04B 1/40^(2006.01)

(86)	International application number:
	PCT/US2008/079561

(87)	International publication number:
	WO 2009/052029 (23.04.2009 Gazette 2009/17)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA MK RS

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Priority:

18.10.2007 US 874899

(71)	Applicant: Intel Corporation
	Santa Clara, CA 95052 (US)

(72)	Inventors:
	CHOUDHURY, Debabani Thousand Oaks California 91320 (US) SUH, Seong-youp San Jose California 95124 (US)

(74)	Representative: Beresford, Keith Denis Lewis et al
	Beresford & Co. 16 High Holborn London WC1V 6BX London WC1V 6BX (GB)

(54)	MULTI-LAYER COMPACT, EMBEDDED ANTENNAS USING LOW-LOSS SUBSTRATE STACK-UP FOR MULTI-FREQUENCY BAND APPLICATIONS