Method of making a heat sink

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(11)

EP 2 216 808 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 A2)

(48)	Corrigendum issued on:
	15.09.2010 Bulletin 2010/37

(43)	Date of publication:
	11.08.2010 Bulletin 2010/32

(21)	Application number: 09004891.9

(22)	Date of filing: 02.04.2009

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International Patent Classification (IPC):

H01L 21/48^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA RS

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Priority:

10.02.2009 TW 98104258

(71)	Applicant: Giga-Byte Technology Co., Ltd.
	Taipei County (TW)

(72)	Inventors:
	Huang, Shun-Chih Hsin-Tien, Taipei County, (TW) Mao, Tai-Chuan Hsin-Tien, Taipei County, (TW)

(74)	Representative: Brandenburger, Karin
	Brandenburger & Liu Schiller Strasse 30 80336 München 80336 München (DE)

(54)	Method of making a heat sink

(57) A method of making a heat sink is disclosed. The heat sink includes a first heat conductive plate, a second heat conductive plate and a fin assembly. The first heat conductive plate has a plurality of first protrusions uniformly spaced apart by through holes. The second heat conductive plate is formed with a plurality of second protrusions parallel to one another. The fin assembly includes a plurality of heat-dissipation plates. The method includes the steps of placing the first heat conductive plate on the fin assembly; placing the second heat conductive plate on the first heat conductive plate so as to have each of the heat-dissipation plates be sandwiched between a pair of the first and second conductive plates; and punching the assembled first and second conductive plates and the fin assembly to have the same tightly bonded together.