(19)
(11) EP 2 224 023 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
19.02.2014 Bulletin 2014/08

(45) Mention of the grant of the patent:
02.10.2013 Bulletin 2013/40

(21) Application number: 08861690.9

(22) Date of filing: 18.12.2008
(51) International Patent Classification (IPC): 
C22B 9/18(2006.01)
C22B 15/14(2006.01)
 B22D 23/10(2006.01)
(86) International application number:
PCT/JP2008/073108
(87) International publication number:
WO 2009/078467 (25.06.2009 Gazette 2009/26)

(54)

SLAG FOR ELECTROSLAG REMELTING OF COPPER ALLOYS AND PROCESS FOR MANUFACTURING COPPER ALLOY PRODUCTS

SCHLACKE FÜR ELEKTROSCHLACKEUMSCHMELZEN VON KUPFERLEGIERUNGEN UND VERFAHREN ZUR HERSTELLUNG VON KUPFERLEGIERUNGSPRODUKTEN

LAITIER POUR REFUSION SOUS LAITIER ÉLECTROCONDUCTEUR D'ALLIAGES DE CUIVRE ET PROCÉDÉ DE FABRICATION DE PRODUITS D'ALLIAGE DE CUIVRE

(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

(30) Priority: 18.12.2007 JP 2007326097

(43) Date of publication of application:
01.09.2010 Bulletin 2010/35

(73) Proprietor: The Japan Steel Works, Ltd.
Tokyo 141-0032 (JP)

(72) Inventors:
  • Yamada, Hitohisa
    Hokkaido (JP)
  • Mizusawa, Mamoru
    Hokkaido (JP)
  • Tanaka, Shinji
    Hokkaido (JP)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser 
Leopoldstrasse 4
80802 München
80802 München (DE)


(56) References cited: : 
JP-A- 3 138 323
JP-A- 53 048 926
JP-A- 61 183 419
 JP-A- 5 318 087
JP-A- 57 209 795
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).