[0001] The present invention relates generally to aluminum alloys and more specifically
to heat treatable aluminum alloys produced by melt processing and strengthened by
L1
2 phase dispersions.
[0002] The combination of high strength, ductility, and fracture toughness, as well as low
density, make aluminum alloys natural candidates for aerospace and space applications.
However, their use is typically limited to temperatures below about 300°F (149°C)
since most aluminum alloys start to lose strength in that temperature range as a result
of coarsening of strengthening precipitates.
[0003] The development of aluminum alloys with improved elevated temperature mechanical
properties is a continuing process. Some attempts have included aluminum-iron and
aluminum-chromium based alloys such as Al-Fe-Ce, Al-Fe-V-Si, Al-Fe-Ce-W, and Al-Cr-Zr-Mn
that contain incoherent dispersoids. These alloys, however, also lose strength at
elevated temperatures due to particle coarsening. In addition, these alloys exhibit
ductility and fracture toughness values lower than other commercially available aluminum
alloys.
[0004] Other attempts have included the development of mechanically alloyed Al-Mg and Al-Ti
alloys containing ceramic dispersoids. These alloys exhibit improved high temperature
strength due to the particle dispersion, but the ductility and fracture toughness
are not improved.
[0005] U.S. Patent No. 6,248,453 discloses aluminum alloys strengthened by dispersed Al
3X L1
2 intermetallic phases where X is selected from the group consisting of Sc, Er, Lu,
Yb, Tm, and U. The Al
3X particles are coherent with the aluminum alloy matrix and are resistant to coarsening
at elevated temperatures. The improved mechanical properties of the disclosed dispersion
strengthened L1
2 aluminum alloys are stable up to 572°F (300°C). In order to create aluminum alloys
containing fine dispersions of Al
3X L1
2 particles, the alloys need to be manufactured by expensive rapid solidification processes
with cooling rates in excess of 1.8x10
3°F/sec (10
3°C/sec).
U.S. Patent Application Publication No. 2006/0269437 discloses an aluminum alloy that contains scandium and other elements. While the
alloy is effective at high temperatures, it is not capable of being heat treated using
a conventional age hardening mechanism.
[0006] Heat treatable aluminum alloys strengthened by coherent L1
2 intermetallic phases produced by standard, inexpensive melt processing techniques
would be useful.
[0007] The present invention is heat treatable aluminum alloys that can be cast, wrought,
or formed by rapid solidification, and thereafter heat treated. The alloys can achieve
high temperature performance and can be used at temperatures up to about 650°F (343°C).
[0008] These alloys comprise silicon, magnesium, and an Al
3X L1
2 dispersoid where X is at least one first element selected from scandium, erbium,
thulium, ytterbium, and lutetium, and at least one second element selected from gadolinium,
yttrium, zirconium, titanium, hafnium, and niobium. The balance is substantially aluminum.
[0009] The alloys may also contain, optionally, copper, and have less than 1.0 weight percent
total impurities.
[0010] In at least a preferred embodiment there is provided a heat treatable aluminum alloy
comprising: about 0.2 to about 3.0 weight percent magnesium; at least one element
selected from the group comprising about 0.1 to about 2.0 weight percent silicon,
about 0.2 to about 6.5 weight percent copper, and about 0.1 to about 2.0 weight percent
manganese; at least one first element selected from the group comprising about 0.1
to about 0.5 weight percent scandium, about 0.1 to about 6.0 weight percent erbium,
about 0.1 to about 10 weight percent thulium, about 0.1 to about 15.0 weight percent
ytterbium, and about 0.1 to about 12 weight percent lutetium; at least one second
element selected from the group comprising about 0.1 to about 4.0 weight percent gadolinium,
about 0.1 to about 4.0 weight percent yttrium, about 0.05 to about 1.0 weight percent
zirconium, about 0.05 to about 2.0 weight percent titanium, about 0.05 to about 2.0
weight percent hafnium, and about 0.05 to about 1.0 weight percent niobium; and the
balance substantially aluminum.
[0011] The alloys are formed by a process selected from casting, deformation processing
and rapid solidification. The alloys are then heat treated at a temperature of from
about 800°F (426°C) to about 1100°F (593°C) for between about 30 minutes and four
hours, followed by quenching in water, and thereafter aged at a temperature from about
200°F (93°C) to about 600°F (315°C) for about two to forty eight hours.
[0012] Certain preferred embodiments of the invention will now be described by way of example
only and with reference to the accompanying drawings.
FIG. 1 is an aluminum silicon phase diagram.
FIG. 2 is an aluminum magnesium phase diagram.
FIG. 3 is an aluminum copper phase diagram.
FIG. 4 is an aluminum manganese phase diagram.
FIG. 5 is an aluminum scandium phase diagram.
FIG. 6 is an aluminum erbium phase diagram.
FIG. 7 is an aluminum thulium phase diagram.
FIG. 8 is an aluminum ytterbium phase diagram.
FIG. 9 is an aluminum lutetium phase diagram
[0013] The alloys of this invention are based on the aluminum-magnesium-silicon and aluminum-magnesium-copper
systems. The aluminum silicon phase diagram is shown in FIG. 1. The binary system
is a simple eutectic alloy system with a eutectic reaction at 12.5 weight percent
silicon and 1077°F (577°C). There is little solubility of silicon in aluminum at temperatures
up to 930°F (500°C) and none of aluminum in silicon. Hypoeutectic alloys with less
than 12.6 weight percent silicon solidify with a microstructure consisting of primary
aluminum grains in a finely divided aluminum/silicon eutectic matrix phase. Hypereutectic
alloys with silicon contents greater than the eutectic composition solidify with a
microstructure of primary silicon grains in a finely divided aluminum/silicon eutectic
matrix phase. Alloys of this invention include alloys with the addition of about 0.1
to about 2.0 weight percent silicon, more preferably about 0.2 to about 1.6 weight
percent silicon, and even more preferably about 0.3 to about 1.4 weight percent silicon.
[0014] The alloys are formed by a process selected from casting, casting plus deformation
processing and rapid solidification. Following formation the alloys are heat treated
at a temperature from about 800°F (425°C) to about 1100°F (593°C) for between about
30 minutes and four hours, followed by quenching in a liquid, and thereafter aged
at a temperature from about 200°F (93°C) to about 600°F (315°C) for about two to about
forty-eight hours. The alloys of this invention are based on the aluminum magnesium
system. The aluminum magnesium phase diagram is shown in FIG. 2. The binary system
is a eutectic alloy system with a eutectic reaction at 36 weight percent magnesium
and 842°F (450°C). Magnesium has maximum solid solubility of 16 weight percent in
aluminum at 842°F (450°C). The amount of magnesium in these alloys ranges from about
0.2 to about 3.0 weight percent, more preferably about 0.4 to about 2.0 weight percent,
and even more preferably about 0.5 to about 1.6 weight percent. The ratio of magnesium
to silicon is about 2.5:1, more preferably about 2:1, and even more preferably about
1.75:1.
[0015] The aluminum copper phase diagram is shown in FIG. 3. The aluminum copper binary
system is a eutectic alloy system with a eutectic reaction at 31.2 weight percent
copper and 1018°F (548.2°C). Copper has maximum solid solubility of 6 weight percent
in aluminum at 1018°F (548.2°C) which can be extended further by rapid solidification
processing. Copper provides a considerable amount of precipitation strengthening in
aluminum by precipitation of fine second phases. The present invention is focused
on hypoeutectic alloy composition ranges. The amount of copper in these alloys ranges
from about 0.2 to about 6.5 weight percent, more preferably about 0.3 to about 6.0
weight percent, and even more preferably about 0.4 to about 5.0 weight percent.
[0016] The aluminum manganese phase diagram is shown in FIG. 4. The aluminum manganese binary
system is a eutectic alloy system with a eutectic reaction at 2.0 weight percent manganese
and 1216.4°F (658°C). Manganese has maximum solid solubility of about 2 weight percent
in aluminum at 1216.4°F (658°C) which can be extended further by rapid solidification
processing. Manganese provides a considerable amount of precipitation strengthening
in aluminum by precipitation of fine Al
6Mn second phases. The present invention is focused on hypoeutectic alloy composition
ranges. The amount of manganese in these alloys ranges from about 0.1 to about 2.0
weight percent, more preferably about 0.2 to about 1.5 weight percent, and even more
preferably about 0.3 to about 1.0 weight percent.
[0017] Aluminum-magnesium-silicon alloys and aluminum-copper-magnesium alloys can include
either manganese or silicon or both. Copper is completely soluble in aluminum in the
compositions of the inventive alloys discussed herein. In aluminum-magnesium-copper
alloys, strengthening phases Al
2C
U (θ'), and Al
2CuMg (S') precipitate following a solution treatment, quench and age process. Aluminum
copper and aluminum magnesium alloys are heat treatable with Al
2Cu (θ'), Al
2CuMg (S') precipitating. Si crystals also precipitate in aluminum-copper-silicon alloys.
Mg
2Si and Si crystals precipitate in aluminum-magnesium-silicon alloys following a solution
heat treatment, quench, and age process. In aluminum-copper-magnesium-silicon alloys,
strengthening phases are Al
2Cu (θ'), Al
2CuMg (S'), Mg
2Si and Si crystals following a solution heat treatment, quench, and age process. Mg
2Al
3 (β) phase precipitates as large intermetallic particles in high magnesium containing
aluminum alloys which is not desired from a strengthening point of view. The presence
of L1
2 phase prevents formation of β phase in this material which improves ductility and
toughness of material. The alloys of this invention also contain phases consisting
of aluminum copper solid solutions, aluminum magnesium solid solutions, and aluminum
copper magnesium solid solutions. In the solid solutions are dispersions of Al
3X having an L1
2 structure where X is at least one first element selected from scandium, erbium, thulium,
ytterbium, and lutetium. Also present is at least one second element selected from
gadolinium, yttrium, zirconium, titanium, hafnium, and niobium.
[0018] Exemplary aluminum alloys of this invention include, but are not limited to (in weight
percent):
about Al-(0.1-2.0)Si-(0.2-3.0)Mg- (0.1-0.5)Sc-(0.1-4)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg - 0.1-6)Er-(0.1-4)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-10)Tm-(0.1-4)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-15)Yb-(0.1-4)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-12)Lu-(0.1-4)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.1-0.5)Sc-(0.1-4)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-6)Er-(0.1-4)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-10)Tm-(0.1-4)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-15)Yb-(0.1-4)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.1-12)Lu-(0.1-4)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.5)Sc-(0.05-1)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-6)Er-(0.05-1)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-10)Tm-(0.05-1)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-1)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-1)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.5)Sc-(0.05-2)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-6)Er-(0.05-2)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-10)Tm-(0.05-2)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-2)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-2)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.1-0.5)Sc-(0.05-2)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-6)Er-(0.05-2)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-10)Tm-(0.05-2)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-2)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-2)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.5)Sc-(0.05-1)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-6)Er-(0.05-1)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.1-10)Tm-(0.05-1)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-1)Nb; and
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-1)Nb.
[0019] Examples of alloys similar to those listed are alloys with the addition of about
0.2 to about 6.5 weight percent Cu, more preferably alloys with the addition of about
0.3 to about 6.0 weight percent Cu, and even more preferably alloys with the addition
of about 0.4 to about 5 weight percent Cu. Examples of other alloys similar to the
above are those alloys with the addition of about 0.1 to about 2.0 weight percent
Mn, more preferably alloys with the addition of about 0.2 to about 1.5 weight percent
Mn, and even more preferably alloys with the addition of about 0.3 to about 1.0 weight
percent Mn.
[0020] In the inventive aluminum based alloys disclosed herein, scandium, erbium, thulium,
ytterbium, and lutetium are potent strengtheners that have low diffusivity and low
solubility in aluminum. All these elements form equilibrium Al
3X intermetallic dispersoids where X is at least one of scandium, erbium, ytterbium,
lutetium, that have an L1
2 structure that is an ordered face centered cubic structure with the X atoms located
at the corners and aluminum atoms located on the cube faces of the unit cell.
[0021] Scandium forms Al
3Sc dispersoids that are fine and coherent with the aluminum matrix. Lattice parameters
of aluminum and Al
3Sc are very close (0.405nm and 0.410nm respectively), indicating that there is minimal
or no driving force for causing growth of the Al
3Sc dispersoids. This low interfacial energy makes the Al
3Sc dispersoids thermally stable and resistant to coarsening up to temperatures as
high as about 842°F (450°C). Addition of magnesium in solid solution in aluminum increases
the lattice parameter of the aluminum matrix, and decreases the lattice parameter
mismatch further increasing the resistance of the Al
3Sc to coarsening. Addition of copper increases the strength of alloys through precipitation
of Al
2Cu (θ') and Al
2CuMg (S') phases. In the alloys of this invention these Al
3Sc dispersoids are made stronger and more resistant to coarsening at elevated temperatures
by adding suitable alloying elements such as gadolinium, yttrium, zirconium, titanium,
hafnium, niobium, or combinations thereof, that enter Al
3Sc in solution.
[0022] Erbium forms Al
3Er dispersoids in the aluminum matrix that are fine and coherent with the aluminum
matrix. The lattice parameters of aluminum and Al
3Er are close (0.405 nm and 0.417 nm respectively), indicating there is minimal driving
force for causing growth of the Al
3Er dispersoids. This low interfacial energy makes the Al
3Er dispersoids thermally stable and resistant to coarsening up to temperatures as
high as about 842°F (450°C). Addition of magnesium in solid solution in aluminum increases
the lattice parameter of the aluminum matrix, and decreases the lattice parameter
mismatch further increasing the resistance of the Al
3Er to coarsening. Addition of copper increases the strength of alloys through precipitation
of Al
2Cu (θ') and Al
2CuMg (S') phases. In the alloys of this invention, these Al
3Er dispersoids are made stronger and more resistant to coarsening at elevated temperatures
by adding suitable alloying elements such as gadolinium, yttrium, zirconium, titanium,
hafnium, niobium, or combinations thereof that enter Al
3Er in solution.
[0023] Thulium forms metastable Al
3Tm dispersoids in the aluminum matrix that are fine and coherent with the aluminum
matrix. The lattice parameters of aluminum and Al
3Tm are close (0.405 nm and 0.420 nm respectively), indicating there is minimal driving
force for causing growth of the Al
3Tm dispersoids. This low interfacial energy makes the Al
3Tm dispersoids thermally stable and resistant to coarsening up to temperatures as
high as about 842°F (450°C). Addition of magnesium in solid solution in aluminum increases
the lattice parameter of the aluminum matrix and decreases the lattice parameter mismatch
further increasing the resistance to coarsening of the dispersoid. Addition of copper
increases the strength of alloys through precipitation of Al
2Cu (θ') and Al
2CuMg (S') phases. In the alloys of this invention these Al
3Tm dispersoids are made stronger and more resistant to coarsening at elevated temperatures
by adding suitable alloying elements such as gadolinium, yttrium, zirconium, titanium,
hafnium, niobium, or combinations thereof that enter Al
3Tm in solution.
[0024] Ytterbium forms Al
3Yb dispersoids in the aluminum matrix that are fine and coherent with the aluminum
matrix. The lattice parameters of Al and Al
3Yb are close (0.405 nm and 0.420 nm respectively), indicating there is minimal driving
force for causing growth of the Al
3Yb dispersoids. This low interfacial energy makes the Al
3Yb dispersoids thermally stable and resistant to coarsening up to temperatures as
high as about 842°F (450°C). Addition of magnesium in solid solution in aluminum increases
the lattice parameter of the aluminum matrix and decreases the lattice parameter mismatch
further increasing the resistance to coarsening of the Al
3Yb. Addition of copper increases the strength of alloys through precipitation of Al
2Cu (θ') and Al
2CuMg (S') phases. In the alloys of this invention, these Al
3Yb dispersoids are made stronger and more resistant to coarsening at elevated temperatures
by adding suitable alloying elements such as gadolinium, yttrium, zirconium, titanium,
hafnium, niobium, or combinations thereof that enter Al
3Yb in solution.
[0025] Lutetium forms Al
3Lu dispersoids in the aluminum matrix that are fine and coherent with the aluminum
matrix. The lattice parameters of Al and Al
3Lu are close (0.405 nm and 0.419 nm respectively), indicating there is minimal driving
force for causing growth of the Al
3Lu dispersoids. This low interfacial energy makes the Al
3Lu dispersoids thermally stable and resistant to coarsening up to temperatures as
high as about 842°F (450°C). Addition of magnesium in solid solution in aluminum increases
the lattice parameter of the aluminum matrix and decreases the lattice parameter mismatch
further increasing the resistance to coarsening of Al
3Lu. Addition of copper increases the strength of alloys through precipitation of Al
2Cu (θ') and Al
2CuMg (S') phases. In the alloys of this invention, these Al
3Lu dispersoids are made stronger and more resistant to coarsening at elevated temperatures
by adding suitable alloying elements such as gadolinium, yttrium, zirconium, titanium,
hafnium, niobium, or mixtures thereof that enter Al
3Lu in solution.
[0026] Gadolinium forms metastable Al
3Gd dispersoids in the aluminum matrix that have an L1
2 structure in the metastable condition. The Al
3Gd dispersoids are stable up to temperatures as high as about 842°F (450°C) due to
their low diffusivity in aluminum. The Al
3Gd dispersoids have a D0
19 structure in the equilibrium condition. Despite its large atomic size, gadolinium
has fairly high solubility in the Al
3X intermetallic dispersoids (where X is scandium, erbium, thulium, ytterbium or lutetium).
Gadolinium can substitute for the X atoms in Al
3X intermetallic, thereby forming an ordered L1
2 phase which results in improved thermal and structural stability.
[0027] Yttrium forms metastable Al
3Y dispersoids in the aluminum matrix that have an L1
2 structure in the metastable condition and a D0
19 structure in the equilibrium condition. The metastable Al
3Y dispersoids have a low diffusion coefficient which makes them thermally stable and
highly resistant to coarsening. Yttrium has a high solubility in the Al
3X intermetallic dispersoids allowing large amounts of yttrium to substitute for X
in the Al
3X L1
2 dispersoids which results in improved thermal and structural stability.
[0028] Zirconium forms Al
3Zr dispersoids in the aluminum matrix that have an L1
2 structure in the metastable condition and D0
23 structure in the equilibrium condition. The metastable Al
3Zr dispersoids have a low diffusion coefficient which makes them thermally stable
and highly resistant to coarsening. Zirconium has a high solubility in the Al
3X dispersoids allowing large amounts of zirconium to substitute for X in the Al
3X dispersoids, which results in improved thermal and structural stability.
[0029] Titanium forms Al
3Ti dispersoids in the aluminum matrix that have an L1
2 structure in the metastable condition and D0
22 structure in the equilibrium condition. The metastable Al
3Ti dispersoids have a low diffusion coefficient which makes them thermally stable
and highly resistant to coarsening. Titanium has a high solubility in the Al
3X dispersoids allowing large amounts of titanium to substitute for X in the Al
3X dispersoids, which results in improved thermal and structural stability.
[0030] Hafnium forms metastable Al
3Hf dispersoids in the aluminum matrix that have an L1
2 structure in the metastable condition and a D0
23 structure in the equilibrium condition. The Al
3Hf dispersoids have a low diffusion coefficient, which makes them thermally stable
and highly resistant to coarsening. Hafnium has a high solubility in the Al
3X dispersoids allowing large amounts of hafnium to substitute for scandium, erbium,
thulium, ytterbium, and lutetium in the above mentioned Al
3X dispersoids, which results in stronger and more thermally stable dispersoids.
[0031] Niobium forms metastable Al
3Nb dispersoids in the aluminum matrix that have an L1
2 structure in the metastable condition and a D0
22 structure in the equilibrium condition. Niobium has a lower solubility in the Al
3X dispersoids than hafnium or yttrium, allowing relatively lower amounts of niobium
than hafnium or yttrium to substitute for X in the Al
3X dispersoids. Nonetheless, niobium can be very effective in slowing down the coarsening
kinetics of the Al
3X dispersoids because the Al
3Nb dispersoids are thermally stable. The substitution of niobium for X in the above
mentioned Al
3X dispersoids results in stronger and more thermally stable dispersoids.
[0032] Al
3X L1
2 precipitates improve elevated temperature mechanical properties in aluminum alloys
for two reasons. First, the precipitates are ordered intermetallic compounds. As a
result, when the particles are sheared by glide dislocations during deformation, the
dislocations separate into two partial dislocations separated by an anti-phase boundary
on the glide plane. The energy to create the anti-phase boundary is the origin of
the strengthening. Second, the cubic L1
2 crystal structure and lattice parameter of the precipitates are closely matched to
the aluminum solid solution matrix. This results in a lattice coherency at the precipitate/matrix
boundary that resists coarsening. The lack of an interphase boundary results in a
low driving force for particle growth and resulting elevated temperature stability.
Alloying elements in solid solution in the dispersed strengthening particles and in
the aluminum matrix that tend to decrease the lattice mismatch between the matrix
and particles will tend to increase the strengthening and elevated temperature stability
of the alloy.
[0033] The amount of scandium present in the alloys of this invention if any may vary from
about 0.1 to about 0.5 weight percent, more preferably from about 0.1 to about 0.35
weight percent, and even more preferably from about 0.1 to about 0.25 weight percent.
The Al-Sc phase diagram shown in FIG. 2 indicates a eutectic reaction at about 0.5
weight percent scandium at about 1219°F (659°C) resulting in a solid solution of scandium
and aluminum and Al
3Sc dispersoids. Aluminum alloys with less than 0.5 weight percent scandium can be
quenched from the melt to retain scandium in solid solution that may precipitate as
dispersed L1
2 intermetallic Al
3Sc following an aging treatment. Alloys with scandium in excess of the eutectic composition
(hypereutectic alloys) can only retain scandium in solid solution by rapid solidification
processing (RSP) where cooling rates are in excess of about 10
3°C/second.
[0034] The amount of erbium present in the alloys of this invention, if any, may vary from
about 0.1 to about 6.0 weight percent, more preferably from about 0.1 to about 4 weight
percent, and even more preferably from about 0.2 to 2 weight percent. The Al-Er phase
diagram shown in FIG. 3 indicates a eutectic reaction at about 6 weight percent erbium
at about 1211°F (655°C). Aluminum alloys with less than about 6 weight percent erbium
can be quenched from the melt to retain erbium in solid solutions that may precipitate
as dispersed L1
2 intermetallic Al
3Er following an aging treatment. Alloys with erbium in excess of the eutectic composition
can only retain erbium in solid solution by rapid solidification processing (RSP)
where cooling rates are in excess of about 10
3°C/second. Alloys with erbium in excess of the eutectic composition (hypereutectic
alloys) cooled normally will have a microstructure consisting of relatively large
Al
3Er dispersoid in a finely divided aluminum-Al
3Er eutectic phase matrix.
[0035] The amount of thulium present in the alloys of this invention, if any, may vary from
about 0.1 to about 10 weight percent, more preferably from about 0.2 to about 6 weight
percent, and even more preferably from about 0.2 to about 4 weight percent. The Al-Tm
phase diagram shown in FIG. 4 indicates a eutectic reaction at about 10 weight percent
thulium at about 1193°F (645°C). Thulium forms metastable Al
3Tm dispersoids in the aluminum matrix that have an L1
2 structure in the equilibrium condition. The Al
3Tm dispersoids have a low diffusion coefficient which makes them thermally stable
and highly resistant to coarsening. Aluminum alloys with less than 10 weight percent
thulium can be quenched from the melt to retain thulium in solid solution that may
precipitate as dispersed metastable L1
2 intermetallic Al
3Tm following an aging treatment. Alloys with thulium in excess of the eutectic composition
can only retain Tm in solid solution by rapid solidification processing (RSP) where
cooling rates are in excess of about 10
3°C/second.
[0036] The amount of ytterbium present in the alloys of this invention, if any, may vary
from about 0.1 to about 15 weight percent more preferably from about 0.2 to about
8 weight percent, and even more preferably from about 0.2 to about 4 weight percent.
The Al-Yb phase diagram shown in FIG. 5 indicates a eutectic reaction at about 21
weight percent ytterbium at about 1157°F (625°C). Aluminum alloys with less than about
21 weight percent ytterbium can be quenched from the melt to retain ytterbium in solid
solution that may precipitate as dispersed L1
2 intermetallic Al
3Yb following an aging treatment. Alloys with ytterbium in excess of the eutectic composition
can only retain ytterbium in solid solution by rapid solidification processing (RSP)
where. cooling rates are in excess of about 10
3°C/second.
[0037] The amount of lutetium present in the alloys of this invention, if any, may vary
from about 0.1 to about 12 weight percent, more preferably from 0.2 to about 8 weight
percent, and even more preferably from about 0.2 to about 4 weight percent. The Al-Lu
phase diagram shown in FIG. 6 indicates a eutectic reaction at about 11.7 weight percent
Lu at about 1202°F (650°C). Aluminum alloys with less than about 11.7 weight percent
lutetium can be quenched from the melt to retain Lu in solid solution that may precipitate
as dispersed L1
2 intermetallic Al
3Lu following an aging treatment. Alloys with Lu in excess of the eutectic composition
can only retain Lu in solid solution by rapid solidification processing (RSP) where
cooling rates are in excess of about 10
3°C/second.
[0038] The amount of gadolinium present in the alloys of this invention, if any, may vary
from about 0.1 to about 4 weight percent, more preferably from 0.2 to about 2 weight
percent, and even more preferably from about 0.5 to about 2 weight percent.
[0039] The amount of yttrium present in the alloys of this invention, if any, may vary from
about 0.1 to about 4 weight percent, more preferably from 0.2 to about 2 weight percent,
and even more preferably from about 0.5 to about 2 weight percent.
[0040] The amount of zirconium present in the alloys of this invention, if any, may vary
from about 0.05 to about 1 weight percent, more preferably from 0.1 to about 0.75
weight percent, and even more preferably from about 0.1 to about 0.5 weight percent.
[0041] The amount of titanium present in the alloys of this invention, if any, may vary
from about 0.05 to 2 about weight percent, more preferably from 0.1 to about 1 weight
percent, and even more preferably from about 0.1 to about 0.5 weight percent.
[0042] The amount of hafnium present in the alloys of this invention, if any, may vary from
about 0.05 to about 2 weight percent, more preferably from 0.1 to about 1 weight percent,
and even more preferably from about 0.1 to about 0.5 weight percent.
[0043] The amount of niobium present in the alloys of this invention, if any, may vary from
about 0.05 to about 1 weight percent, more preferably from 0.1 to about 0.75 weight
percent, and even more preferably from about 0.1 to about 0.5 weight percent.
[0044] In order to have the best properties for the alloys of this invention, it is desirable
to limit the amount of other elements. Specific elements that should be reduced or
eliminated include no more than about 0.1 weight percent iron, 0.1 weight percent
chromium, 0.1 weight percent vanadium, 0.1 weight percent cobalt, and 0.1 weight percent
nickel. The total quantity of additional elements should not exceed about 1 % by weight,
including the above listed elements.
[0045] Other additions in the inventive alloys include at least one of about 0.001 weight
percent to about 0.10 weight percent sodium, about 0.001 weight percent to about 0.10
weight percent calcium, about 0.001 to about 0.10 weight percent strontium, about
0.001 to about 0.10 weight percent antimony, 0.001 to 0.10 weight percent barium and
about 0.001 to about 0.10 weight percent phosphorus. These are added to refine the
microstructure of the eutectic phase and the primary silicon particle morphology and
size.
[0046] These aluminum alloys may be made by any and all consolidation and fabrication processes
known to those in the art such as casting (without further deformation), deformation
processing (wrought processing), rapid solidification processing, forging, extrusion,
rolling, die forging, powder metallurgy and others. The rapid solidification process
should have a cooling rate greater than about 10
3°C/second including but not limited to powder processing, atomization, melt spinning,
splat quenching, spray deposition, cold spray, plasma spray, laser melting and deposition,
ball milling and cryomilling.
[0047] Preferred exemplary aluminum alloys of this invention include, but are not limited
to (in weight percent):
about Al-(0.1-2.0)Si-(0.2-3.0)Mg 0.1-0.35)Sc-(0.2-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-4)Er-(0.2-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.2-6)Tm-(0.2-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Yb-(0.2-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Lu-(0.2-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.35)Sc-(0.2-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-4)Er-(0.2-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-6)Tm-(0.2-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Yb-(0.2-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.2-8)Lu-(0.2-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0. -0.35)sic-(0.1-0.75)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-4)Er-(0.1-0.75)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-0.75)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Yb-(0.1-0.75)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-0.75)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg (0.1-0.35)Sc-(0.1-1)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg (0.1-4)Er-(0.1-1)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-1)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.2-8)Yb-(0.1-1)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-1)Ti;
about A1-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.35)Sc-(0.1-1)Hf;;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg (0.1-4)Er-(0.1-1)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-1)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Yb-(0.1-1)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-1)Hf;
about Al-(0.1-2.0)Si -(0.2-3.0)Mg -(0.1-0.35)Sc-(0.1-0.75)Nb;
about Al-(0.1-2.0)Si -(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.75)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-0.75)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Yb-(0.1-0.75)Nb; and
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-0.75)Nb.
[0048] Examples of alloys similar to those listed above are alloys with the addition of
about 0.2 to about 6.5 weight percent Cu, more preferably alloys with the addition
of about 0.3 to about 6.0 weight percent Cu, and even more preferably alloys with
the addition of about 0.4 to about 5 weight percent Cu. Examples of other alloys similar
to the above are alloys with the addition of about 0.1 to about 2.0 weight percent
Mn, more preferably alloys with the addition of about 0.2 to about 1.5 weight percent
Mn, and even more preferably alloys with the addition of about 0.3 to about 1.0 weight
percent Mn.
[0049] Even more preferred exemplary aluminum alloys of this invention include, but are
not limited to (in weight percent):
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.5-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-2)Er-(0.5-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg-(0.2-4)Tm-(0.5-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Yb-(0.5-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Lu-(0.5-2)Gd;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.5-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-2)Er-(0.5-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Tm-(0.5-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Yb-(0.5-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Lu-(0.5-2)Y;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Zr;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Ti;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Hf;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Nb;
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Nb; and
about Al-(0.1-2.0)Si-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Nb.
[0050] Examples of alloys similar to those listed above are alloys with the addition of
about 0.2 to about 6.5 weight percent Cu, more preferably alloys with the addition
of about 0.3 to about 6.0 weight percent Cu, and even more preferably alloys with
the addition of about 0.4 to about 5 weight percent Cu. Examples of other alloys similar
to these are alloys with the addition of about 0.1 to about 2.0 weight percent Mn,
more preferably alloys with the addition of about 0.2 to about 1.5 weight percent
Mn, and even more preferably alloys with the addition of about 0.3 to about 1.0 weight
percent Mn.
[0051] Exemplary aluminum alloys of this invention include, but are not limited to (in weight
percent):
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg- (0.1-0.5)Sc-(0.1-4)Gd;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg 0.1-6)Er-(0.1-4)Gd;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg -(0.1-10)Tm-(0.1-4)Gd;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg -(0.1-15)Yb-(0.1-4)Gd;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg -(0.1-12)Lu-(0.1-4)Gd;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg-(0.1-0.5)Sc-(0.1-4)Y;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg -(0.1-6)Er-(0.1-4)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-10)Tm-(0.1-4)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-15)Yb-(0.1-4)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg-(0.1-12)Lu-(0.1-4)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.5)Sc-(0.05-1)Zr;
about Al-(0.2-6.5)Cu -(0.2-3.0)Mg -(0.1-6)Er-(0.05-1)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-10)Tm-(0.05-1)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-1)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-1)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.5)Sc-(0.05-2)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-6)Er-(0.05-2)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-10)Tm-(0.05-2)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-2)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-2)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg-(0.1-0.5)Sc-(0.05-2)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-6)Er-(0.05-2)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-10)Tm-(0.05-2)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-2)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-2)Hf;
about Al -(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.5)Sc-(0.05-1)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-6)Er-(0.05-1)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg-(0.1-10)Tm-(0.05-1)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-15)Yb-(0.05-1)Nb; and
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-12)Lu-(0.05-1)Nb.
[0052] Examples of alloys similar to those listed above are alloys with the addition of
about 0.1 to about 2.0 weight percent Si, more preferably alloys with the addition
of about 0.2 to about 1.6 weight percent Si, and even more preferably alloys with
the addition of about 0.3 to about 1.4 weight percent Si. Examples of other alloys
similar to these are alloys with the addition of about 0.1 to about 2.0 weight percent
Mn, more preferably alloys with the addition of about 0.2 to about 1.5 weight percent
Mn, and even more preferably alloys with the addition of about 0.3 to about 1.0 weight
percent Mn.
[0053] Preferred exemplary aluminum alloys of this invention include, but are not limited
to (in weight percent):
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg 0.1-0.35)Sc-(0.2-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-4)Er-(0.2-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg-(0.2-6)Tm-(0.2-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Yb-(0.2-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Lu-(0.2-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.35)Sc-(0.2-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-4)Er-(0.2-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-6)Tm-(0.2-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Yb-(0.2-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg-(0.2-8)Lu-(0.2-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.35)Sc-(0.1-0.75)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-4)Er-(0.1-0.75)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-0.75)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Yb-(0.1-0.75)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-0.75)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg (0.1-0.35)Sc-(0.1-1)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg (0.1-4)Er-(0.1-1)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-1)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg-(0.2-8)Yb-(0.1-1)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-1)Ti;
about A1-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.35)Sc-(0.1-1)Hf;;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-4)Er-(0.1-1)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-6)Tm-(0.1-1)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Yb-(0.1-1)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-1)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.35)Sc-(0.1-0.75)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.75)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg- 0.2-6)Tm-(0.1-0.75)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Yb-(0.1-0.75)Nb; and
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-8)Lu-(0.1-0.75)Nb.
[0054] Examples of alloys similar to those listed above are alloys with the addition of
about 0.1 to about 2.0 weight percent Si, more preferably alloys with the addition
of about 0.2 to about 1.6 weight percent Si, and even more preferably alloys with
the addition of about 0.3 to about 1.4 weight percent Si. Examples of other alloys
similar to these are alloys with the addition of about 0.1 to about 2.0 weight percent
Mn, more preferably alloys with the addition of about 0.2 to about 1.5 weight percent
Mn, and even more preferably alloys with the addition of about 0.3 to about 1.0 weight
percent Mn.
[0055] Even more preferred exemplary aluminum alloys of this invention include, but are
not limited to (in weight percent):
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.5-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.5-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -0.2-4)Tm-(0.5-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Yb-(0.5-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Lu-(0.5-2)Gd;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.5-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.5-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Tm-(0.5-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Yb-(0.5-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Lu-(0.5-2)Y;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Zr;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Ti;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Hf;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.1-0.25)Sc-(0.1-0.5)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-2)Er-(0.1-0.5)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Tm-(0.1-0.5)Nb;
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Yb-(0.1-0.5)Nb; and
about Al-(0.2-6.5)Cu-(0.2-3.0)Mg -(0.2-4)Lu-(0.1-0.5)Nb.
[0056] Examples of alloys similar to those listed above are alloys with the addition of
about 0.1 to about 2.0 weight percent Si, more preferably alloys with the addition
of about 0.2 to about 1.6 weight percent Si, and even more preferably alloys with
the addition of about 0.3 to about 1.4 weight percent Si. Examples of other alloys
similar to these are alloys with the addition of about 0.1 to about 2.0 weight percent
Mn, more preferably alloys with the addition of about 0.2 to about 1.5 weight percent
Mn, and even more preferably alloys with the addition of about 0.3 to about 1.0 weight
percent Mn.
[0057] Although the present invention has been described with reference to preferred embodiments,
workers skilled in the art will recognize that changes may be made in form and detail
without departing from the scope of the invention as defined by the attached claims.
[0058] One aspect of at least the preferred embodiment of the present invention is a heat
treatable aluminum alloy comprising about 0.2 to about 3.0 weight percent magnesium,
at least one element selected from the group consisting of about 0.1 to about 2.0
weight percent silicon, about 0.2 to about 6.5 weight percent copper, and about 0.1
to about 2.0 weight percent manganese; an aluminum solid solution matrix containing
a plurality of dispersed Al
3X second phases having L1
2 structures where X comprises at least one of scandium, erbium, thulium, ytterbium,
lutetium, and at least one of gadolinium, yttrium, zirconium, titanium, hafnium, niobium.
[0059] Preferably wherein the alloy comprises an aluminum solid solution matrix, precipitates
including but not limited to Al
2C
U, Al
2(Cu,Mg), Mg
2Si, Al
6Mn, and a plurality of dispersed Al
3X second phases having L1
2 structures where X comprises at least one of scandium, erbium, thulium, ytterbium,
lutetium, and at least one of gadolinium, yttrium, zirconium, titanium, hafnium, niobium.
[0060] Preferably wherein the alloy comprises at least one of about 0.1 to about 0.5 weight
percent scandium, about 0.1 to about 6.0 weight percent erbium, about 0.1 to about
10 weight percent thulium, about 0.1 to about 15.0 weight percent ytterbium, about
0.1 to about 12 weight percent lutetium, and about 0.1 to about 4.0 weight percent
gadolinium, about 0.1 to about 4.0 weight percent yttrium, about 0.05 to about 1.0
weight percent zirconium, about 0.05 to about 2.0 weight percent titanium, about 0.05
to about 2.0 weight percent hafnium, and about 0.05 to about 1.0 weight percent niobium.
1. A heat treatable aluminum alloy comprising:
about 0.2 to about 3.0 weight percent magnesium;
at least one element selected from the group comprising about 0.1 to about 2.0 weight
percent silicon, about 0.2 to about 6.5 weight percent copper, and about 0.1 to about
2.0 weight percent manganese;
at least one first element selected from the group comprising about 0.1 to about 0.5
weight percent scandium, about 0.1 to about 6.0 weight percent erbium, about 0.1 to
about 10 weight percent thulium, about 0.1 to about 15.0 weight percent ytterbium,
and about 0.1 to about 12 weight percent lutetium;
at least one second element selected from the group comprising about 0.1 to about
4.0 weight percent gadolinium, about 0.1 to about 4.0 weight percent yttrium, about
0.05 to about 1.0 weight percent zirconium, about 0.05 to about 2.0 weight percent
titanium, about 0.05 to about 2.0 weight percent hafnium, and about 0.05 to about
1.0 weight percent niobium; and
the balance substantially aluminum.
2. The alloy of claim 1, wherein the alloy comprises an aluminum solid solution matrix
containing a plurality of dispersed Al3X second phases having L12 structures, wherein X includes at least one first element and at least one second
element.
3. The alloy of claim 1, wherein the alloy comprises an aluminum solid solution matrix
and precipitates including but not limited to Al2Cu, Al2(Cu,Mg), Mg2Si, and Al6Mn;
a plurality of dispersed Al3X second phases having L12 structures, wherein X includes at least one first element selected from the group
comprising about 0.1 to about 0.5 weight percent scandium, about 0.1 to about 6.0
weight percent erbium, about 0.1 to about 10 weight percent thulium, about 0.1 to
about 15.0 weight percent ytterbium, and about 0.1 to about 12 weight percent lutetium;
and
at least one second element selected from the group comprising about 0.1 to about
4.0 weight percent gadolinium, about 0.1 to about 4.0 weight percent yttrium, about
0.05 to about 1.0 weight percent zirconium, about 0.05 to about 2.0 weight percent
titanium, about 0.05 to about 2.0 weight percent hafnium, and about 0.05 to about
1.0 weight percent niobium; and
the balance substantially aluminum.
4. The alloy of claim 1, 2 or 3, wherein the at least one element selected from the group
comprising about 0.1 to about 2.0 weight percent silicon, about 0.2 to about 6.5 weight
percent copper, and about 0.1 to about 2.0 weight percent manganese is about 0.1 to
about 2.0 weight percent silicon.
5. The alloy of any preceding claim, wherein the amount of silicon ranges from about
0.2 to about 1.6 weight percent.
6. The alloy of claim 1, 2 or 3, wherein the at least one element selected from the group
comprising about 0.1 to about 2.0 weight percent silicon, about 0.2 to about 6.5 weight
percent copper, and about 0.1 to about 2.0 weight percent manganese is about 0.2 to
about 6.5 weight percent copper.
7. The alloy of claim 1, 2 or 3, wherein the at least one element selected from the group
comprising about 0.1 to about 2.0 weight percent silicon, about 0.2 to about 6.5 weight
percent copper, and about 0.1 to about 2.0 weight percent manganese is about 0.1 to
about 2.0 weight percent manganese.
8. The alloy of any preceding claim further comprising at least one of about 0.001 to
about 0.1 weight percent sodium, about 0.001 to about 0.1 weight percent calcium,
about 0.001 to about 0.1 weight percent strontium, about 0.001 to about 0.1 weight
percent antimony, about 0.001 to about 0.1 weight percent barium, and about 0.001
to about 0.1 weight percent phosphorus, and/or
comprising no more than about 1.0 weight percent total other elements including impurities,
and/or
comprising no more than about 0.1 weight percent iron, about 0.1 weight percent chromium,
about 0.1 weight percent vanadium, about 0.1 weight percent cobalt, and about 0.1
weight percent nickel.
9. The alloy of any preceding claim, which has been formed by a process selected from
casting, and subsequent deformation processing, and rapid solidification processing.
10. The alloy of any preceding claim, in which the alloy has been heat treated by a solution
anneal at a temperature of about 800°F (426°C) to about 1100°F (593°C) for about 30
minutes to four hours, followed by quenching and preferably
wherein the quenching is in liquid, and wherein the alloy is aged after quenching
at a temperature of about 200°F (93°C) to about 600°F (315°C) for about two to forty-eight
hours.
11. The heat treatable aluminum alloy of any preceding claim, wherein the alloy is capable
of being used at temperatures from about -420°F (-251°C) up to about 650°F (343°C).
12. A method of forming a heat treatable aluminum alloy, the method comprising:
(a) forming a melt comprising:
about 0.2 to about 3.0 weight percent magnesium;
at least one element selected from the group comprising about 0.1 to about 2.0 weight
percent silicon, about 0.2 to about 6.5 weight percent copper, and about 0.1 to about
2.0 weight percent manganese;
at least one first element selected from the group comprising about 0.1 to about 0.5
weight percent scandium, about 0.1 to about 6.0 weight percent erbium, about 0.1 to
about 10 weight percent thulium, about 0.1 to about 15.0 weight percent ytterbium,
and about 0.1 to about 12 weight percent lutetium;
at least one second element selected from the group comprising about 0.1 to about
4.0 weight percent gadolinium, about 0.1 to about 4.0 weight percent yttrium, about
0.05 to about 1.0 weight percent zirconium, about 0.05 to about 2.0 weight percent
titanium, about 0.05 to about 2.0 weight percent hafnium, and about 0.05 to about
1.0 weight percent niobium; and
the balance substantially aluminum;
(b) solidifying the melt to form a solid body; and
(c) heat treating the solid body.
13. The method of claim 12 further comprising:
refining the structure of the solid body by deformation processing including but not
limited to these processes: extrusion, forging and rolling.
14. The method of claim 12 or 13, wherein solidifying comprises a rapid solidification
process in which the cooling rate is greater than about 103°C/second including at least one of: powder processing, atomization, melt spinning,
splat quenching, spray deposition, cold spray, plasma spray, laser melting and deposition,
ball milling, and cryomilling.
15. The method of claim 12, 13 or 14, wherein the heat treating comprises:
solution heat treatment at about 800°F (426°C) to about 1100°F (593°C) for about thirty
minutes to four hours; and
quenching; and
aging at a temperature of about 200°F (93°C) to about 600°F (315°C) for about two
to forty eight hours.