(19)
(11) EP 2 246 539 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
10.11.2010 Bulletin 2010/45

(43) Date of publication A2:
03.11.2010 Bulletin 2010/44

(21) Application number: 10250810.8

(22) Date of filing: 21.04.2010
(51) International Patent Classification (IPC): 
F01N 3/28(2006.01)
F28F 21/04(2006.01)
F01N 3/02(2006.01)
F28F 7/02(2006.01)
F28D 7/00(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated Extension States:
AL BA ME RS

(30) Priority: 23.04.2009 JP 2009105246
16.04.2010 JP 2010095149

(71) Applicant: NGK Insulators, Ltd.
Nagoya-City, Aichi Pref. 467-8530 (JP)

(72) Inventors:
  • Takahashi, Michio
    Nagoya City Aichi-ken 47-8530 (JP)
  • Mizuno, Hiroshi
    Nagoya City Aichi-ken 47-8530 (JP)

(74) Representative: Paget, Hugh Charles Edward et al
Mewburn Ellis LLP 33 Gutter Lane
London EC2V 8AS
London EC2V 8AS (GB)

   


(54) Ceramics heat exchanger and production method thereof


(57) There is provided a heat exchanger having high heat exchange efficiency in comparison with conventional heat exchange elements, heat exchangers, and the like and realizing miniaturization, weight saving, and cost reduction and a production method thereof. In a heat exchange element 1, first fluid circulation portions 5 having a honeycomb structure having a plurality of cells separated by ceramic partition walls 4, extending through in an axial direction from one end face 2 to the other end face 2, and allowing a heated medium as a first fluid to flow therethrough and second fluid circulation portions 6 being separated by ceramic partition walls 4, extending in the direction perpendicular to the axial direction, allowing a second fluid to flow therethrough, transferring heat to a medium to be heated as the second fluid are alternately formed as a unit. The cells 3 on the first fluid circulation portion 5 side are smaller than the cells 3 on the second fluid circulation portion 6 side, and the partition walls have a density of 0.5 to 5 g/cm3 and a thermal conductivity of 10 to 300 W/mK.







Search report