(19)
(11) EP 2 255 939 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
19.10.2011 Bulletin 2011/42

(43) Date of publication A2:
01.12.2010 Bulletin 2010/48

(21) Application number: 10164119.9

(22) Date of filing: 27.05.2010
(51) International Patent Classification (IPC): 
B28D 1/22(2006.01)
 B28D 7/04(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated Extension States:
BA ME RS

(30) Priority: 29.05.2009 JP 2009130454

(71) Applicant: Mitsuboshi Diamond Industrial Co., Ltd.
Suita-city, Osaka 564-0044 (JP)

(72) Inventors:
  • Maekawa, Kazuya
    Suita-city Osaka 564-0044 (JP)
  • Ichikawa, Katsunori
    Suita-city Osaka 564-0044 (JP)

(74) Representative: TBK 
Bavariaring 4-6
80336 München
80336 München (DE)

   


(54) Breaking apparatus and breaking method


(57) A substrate is held on a table 22, and the substrate is caused to project beyond a lateral side of the table 22 and is positioned by a positioning section 30. Then, that part of the substrate 23 which is located on the table is locked in place by a clamping section 40. Subsequently the substrate is broken along a scribing line, with its projecting part kept pressed from above, by using a breaking unit 50. In this way, a substrate of even smaller size can be precisely broken with ease under uniform application of pressure.







Search report