(19)
(11) EP 2 272 086 A2

(12)

(88) Date of publication A3:
04.03.2010

(43) Date of publication:
12.01.2011 Bulletin 2011/02

(21) Application number: 09762952.1

(22) Date of filing: 24.02.2009
(51) International Patent Classification (IPC): 
H01L 21/302(2006.01)
H01L 21/31(2006.01)
(86) International application number:
PCT/US2009/035030
(87) International publication number:
WO 2009/151656 (17.12.2009 Gazette 2009/51)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA RS

(30) Priority: 13.03.2008 US 48188

(71) Applicant: Lam Research Corporation
Fremont, CA 94538-6470 (US)

(72) Inventors:
  • YUN, Seokmin
    Pleasanton, CA 94588 (US)
  • ZHU, Ji
    El Cerrito, CA 94530 (US)
  • DELARIOS, John, M.
    Palo Alto, CA 94303 (US)
  • WILCOXSON, Mark
    Oakland, CA 94611 (US)

(74) Representative: Derry, Paul Stefan et al
Venner Shipley LLP 20 Little Britain
London EC1A 7DH
London EC1A 7DH (GB)

   


(54) METHOD OF DIELECTRIC FILM TREATMENT