SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND METHOD OF MANUFACTURE THEROF - Patent 2308085

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EP 2 308 085 A1

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(43)	Date of publication:
	13.04.2011 Bulletin 2011/15

(21)	Application number: 08796999.4

(22)	Date of filing: 31.07.2008

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International Patent Classification (IPC):

H01L 23/48^(2006.01)
G05F 1/00^(2006.01)

H01L 21/60^(2006.01)

(86)	International application number:
	PCT/US2008/071832

(87)	International publication number:
	WO 2010/014103 (04.02.2010 Gazette 2010/05)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA MK RS

(71)	Applicant: Skyworks Solutions, Inc.
	Woburn, MA 01801 (US)

(72)	Inventors:
	WELCH, Patrick, L. Laguna Niguel CA 92677 (US) GUO, Yifan Aliso Viejo CA 92656 (US)

(74)	Representative: Walaski, Jan Filip et al
	Venner Shipley LLP 20 Little Britain London EC1A 7DH London EC1A 7DH (GB)

(54)	SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND METHOD OF MANUFACTURE THEROF