IMPROVED COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERS - Patent 2310558

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EP 2 310 558 A1

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(43)	Date of publication:
	20.04.2011 Bulletin 2011/16

(21)	Application number: 09776985.5

(22)	Date of filing: 06.07.2009

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International Patent Classification (IPC):

C25D 3/58^(2006.01)

C25D 3/02^(2006.01)

(86)	International application number:
	PCT/EP2009/004879

(87)	International publication number:
	WO 2010/003621 (14.01.2010 Gazette 2010/02)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
	Designated Extension States:
	AL BA RS

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Priority:

10.07.2008 DE 102008032398

(71)	Applicant: Umicore Galvanotechnik GmbH
	73525 Schwäbisch Gmünd (DE)

(72)	Inventors:
	BRONDER, Klaus 73527 Schwaebisch Gmuend (DE) WEYHMUELLER, Bernd 73553 Alfdorf Hintersteinenberg (DE) OBERST, Frank 73529 Schwaebisch Gmuend (DE) BERGER, Sascha 73527 Schwaebisch Gmuend (DE) MANZ, Uwe 73434 Aalen (DE)

(74)	Representative: Retzow, Stefan
	Umicore AG & Co. KG Patente Rodenbacher Chaussee 4 63457 Hanau-Wolfgang 63457 Hanau-Wolfgang (DE)

(54)	IMPROVED COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERS