Electrical circuit with heat sink

(19)

(11)

EP 2 323 465 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	13.07.2011 Bulletin 2011/28

(43)	Date of publication:
	18.05.2011 Bulletin 2011/20

(21)	Application number: 10177982.5

(22)	Date of filing: 21.09.2010

(51)

International Patent Classification (IPC):

H05K 1/02^(2006.01)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
	Designated Extension States:
	BA ME RS

(30)

Priority:

10.11.2009 IT TO20090861

(71)	Applicants:
	OSRAM Gesellschaft mit beschränkter Haftung 81543 München (DE) OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI 20144 Milano (IT) IT

(72)	Inventor:
	Piva, Raffaele 31100 Treviso (IT)

(74)	Representative: Bosotti, Luciano
	Buzzi, Notaro & Antonielli d'Oulx Via Maria Vittoria, 18 10123 Torino 10123 Torino (IT)

(54)	Electrical circuit with heat sink

(57) An electrical circuit includes a printed circuit board (12) for mounting circuit components (C) with an electrical connection line (14) extending over a given connection path (140, 142, 144). There is provided a heat sink (14) to dissipate the heat produced by said components (C), which is comprised of a shaped sheet-like body extending orthogonal to said printed circuit board (12) and having a shape at least partly (140, 142) reproducing said given connection path (140, 142, 144). The heat sink can also ensure the electrical connection of the components (C).