| (19) |
 |
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(11) |
EP 2 325 579 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
14.01.2015 Bulletin 2015/03 |
| (43) |
Date of publication A2: |
|
25.05.2011 Bulletin 2011/21 |
| (22) |
Date of filing: 23.07.2010 |
|
| (51) |
International Patent Classification (IPC):
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| (84) |
Designated Contracting States: |
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AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL
NO PL PT RO SE SI SK SM TR |
| (30) |
Priority: |
20.11.2009 KR 20090112739
|
| (71) |
Applicant: LG Electronics Inc. |
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Youngdungpo-ku
Seoul (KR) |
|
| (72) |
Inventors: |
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- Chin, Sim Won
Changwon-si
Kyungsangnam-do 641-110 (KR)
- Jang, Yong Hee
Changwon-si
Kyungsangnam-do 641-110 (KR)
- Kim, Bum Suk
Changwon-si
Kyungsangnam-do 641-110 (KR)
- Ryu, Byoung Jin
Changwon-si
Kyungsangnam-do 641-110 (KR)
|
| (74) |
Representative: Boult Wade Tennant |
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Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT
London WC1X 8BT (GB) |
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(57) Disclosed is a heat pump including: a refrigeration cycle unit 1 that includes a
compressor 10 for compressing a coolant, a first heat exchanger 14 for condensing
the coolant compressed in the compressor, an expansion mechanism 16 for expanding
the coolant condensed in the first heat exchanger, and a second heat exchanger 18
for evaporating the coolant expanded in the expansion mechanism 16; and a booster
module 2 that is connected to the refrigeration cycle unit 1, wherein the booster
module 2 separates a gaseous coolant from the coolant flowing from the first heat
exchanger 14 to the expansion mechanism 16, compresses the separated gaseous coolant,
and then has the compressed gaseous coolant flow between the compressor 10 and the
first heat exchanger 14.