(19)
(11) EP 2 325 877 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
18.12.2013 Bulletin 2013/51

(43) Date of publication A2:
25.05.2011 Bulletin 2011/21

(21) Application number: 10191516.3

(22) Date of filing: 17.11.2010
(51) International Patent Classification (IPC): 
H01L 21/683(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 17.11.2009 JP 2009261867

(71) Applicant: TOKYO ELECTRON LIMITED
Minato-ku Tokyo 107-6325 (JP)

(72) Inventors:
  • Sato, Tetsuji
    Nirasaki-City Yamanashi 407-8511 (JP)
  • Kitazawa, Takashi
    Nirasaki-City Yamanashi 407-8511 (JP)
  • Yoshimura, Akihiro
    Nirasaki-City Yamanashi 407-8511 (JP)

(74) Representative: HOFFMANN EITLE 
Patent- und Rechtsanwälte Arabellastrasse 4
81925 München
81925 München (DE)

   


(54) Substrate mounting table of substrate processing apparatus


(57) A substrate mounting table of a substrate processing apparatus includes a base portion and a circular plate-shaped electrostatic chuck adhered to an upper surface of the base portion by an adhesive layer. The electrostatic chuck has a circular attracting surface to support a substrate. The substrate mounting table further includes an annular focus ring arranged around the electrostatic chuck to surround the substrate and to cover an outer peripheral portion of the upper surface of the base portion. The electrostatic chuck has a two-layer structure including an upper circular part and a lower circular part having a diameter larger than that of the upper circular part. An outer peripheral portion of the lower circular part and an outer peripheral portion of the adhesive layer adhering the lower circular part to the base portion are covered with the focus ring.







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