(19)
(11) EP 2 336 669 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
30.07.2014 Bulletin 2014/31

(43) Date of publication A2:
22.06.2011 Bulletin 2011/25

(21) Application number: 10192556.8

(22) Date of filing: 25.11.2010
(51) International Patent Classification (IPC): 
F24H 4/04(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 09.12.2009 JP 2009279169

(71) Applicant: Panasonic Corporation
Kadoma-shi Osaka 571-8501 (JP)

(72) Inventors:
  • Wada, Katsuhiro
    Osaka 540-6207 (JP)
  • Andou, Toshiaki
    Osaka 540-6207 (JP)
  • Nakatani, Kazuhito
    Osaka 540-6207 (JP)

(74) Representative: Eisenführ Speiser 
Patentanwälte Rechtsanwälte PartGmbB Postfach 31 02 60
80102 München
80102 München (DE)

   


(54) Heat pump hot water supply apparatus


(57) A heat pump hot water supply apparatus comprising a heat pump unit 1 having a water refrigerant heat exchanger 3 which heats low temperature water, a hot water reservoir tank unit 10 having a hot water reservoir tank in which high temperature water heated by the water refrigerant heat exchanger 3 is stored, a water pipe 13 which sends low temperature water in a lower portion of the hot water reservoir tank to the water refrigerant heat exchanger 3, and a boiling pipe 12 which sends high temperature water heated by the water refrigerant heat exchanger 3 to an upper portion of the hot water reservoir tank, wherein the heat pump unit 1 is placed on a ceiling surface of the hot water reservoir tank unit 10, and the boiling pipe 12 is shorter than the water pipe 13. The heat pump hot water supply apparatus can be installed in an environment having a small installation space such as a detached house or an apartment in an urban area. A radiation loss from a connecting pipe can be reduced, material cost of the connecting pipe can be reduced, and the number of man-hours of a piping operation at the site of installation can be reduced.







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