(19)
(11) EP 2 338 170 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
05.08.2015 Bulletin 2015/32

(45) Mention of the grant of the patent:
17.06.2015 Bulletin 2015/25

(21) Application number: 09785641.3

(22) Date of filing: 14.09.2009
(51) International Patent Classification (IPC): 
H01L 23/31(2006.01)
H01L 23/525(2006.01)
H01L 21/78(2006.01)
 H01L 23/485(2006.01)
H01L 21/60(2006.01)
H01L 23/00(2006.01)
(86) International application number:
PCT/GB2009/051187
(87) International publication number:
WO 2010/046674 (29.04.2010 Gazette 2010/17)

(54)

IMPROVED WAFER LEVEL CHIP SCALE PACKAGING

VERBESSERTE CHIP-SCALE-VERKAPSELUNG AUF WAFEREBENE

MISE SOUS BOÎTIER AMÉLIORÉE DE PUCES EFFECTUÉE AU NIVEAU D UNE TRANCHE

(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 22.10.2008 GB 0819351

(43) Date of publication of application:
29.06.2011 Bulletin 2011/26

(73) Proprietor: Cambridge Silicon Radio Limited
Cambridge, Cambridgeshire CB4 OWZ (GB)

(72) Inventor:
  • HOLLAND, Andrew
    Cambridgeshire CB25 0NL (GB)

(74) Representative: Wallis, Helen Frances Mary et al
Olswang LLP 90 High Holborn
London WC1V 6XX
London WC1V 6XX (GB)


(56) References cited: : 
US-A1- 2004 087 130
US-A1- 2005 037 539
US-A1- 2005 266 671
 US-A1- 2004 137 660
US-A1- 2005 040 523
US-A1- 2007 035 000
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).