(57) A circuit board (1) with a heat dissipating structure is provided. A first grounding
conductor layer (210, 410) is formed on a first surface (21, 41) of a substrate (2,
4). A first insulting layer (211, 411) is formed on the first grounding conductor
layer (210, 410) and defines a number of circuit element pin openings (212, 412) and
a plurality of heat dissipating openings (213, 413) therein so that the first grounding
conductor layer (210, 410) is exposed from the circuit element pin openings (212,
412) and the heat dissipating openings (213, 413). A number of solder balls (214,
414) are disposed in the circuit element pin openings (212, 412) and contacted with
the first grounding conductor layer (210, 410). A number of heat dissipating structures
(215, 415) are disposed in the heat dissipating openings (213, 413) and contacted
with the first grounding conductor layer (210, 410). The heat dissipating structures
(215, 415) and the solder balls (214, 414) have an identical material. The method
for manufacturing the circuit board is also provided.
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