(19)
(11) EP 2 374 612 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
28.12.2011 Bulletin 2011/52

(43) Date of publication:
12.10.2011 Bulletin 2011/41

(21) Application number: 09834706.5

(22) Date of filing: 08.12.2009
(51) International Patent Classification (IPC): 
B32B 15/08(2006.01)
H05K 3/38(2006.01)
(86) International application number:
PCT/JP2009/070543
(87) International publication number:
WO 2010/073903 (01.07.2010 Gazette 2010/26)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 26.12.2008 JP 2008334170

(71) Applicant: FUJIFILM Corporation
Tokyo 106-8620 (JP)

(72) Inventor:
  • SATOU, Masataka
    Ashigarakami-gun Kanagawa 258-8577 (JP)

(74) Representative: HOFFMANN EITLE 
Patent- und Rechtsanwälte Arabellastraße 4
81925 München
81925 München (DE)

   


(54) SURFACE METAL FILM MATERIAL, PROCESS FOR PRODUCING SURFACE METAL FILM MATERIAL, PROCESS FOR PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL


(57) A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x µm represents surface roughness (Ra) at an interface between the substrate and the polymer layer, and y µm represents surface roughness (Ra) at an interface between the polymer layer and the metal film, x > y and 5 µm > x > 0.1 µm.