(19)
(11) EP 2 380 190 A2

(12)

(88) Date of publication A3:
23.09.2010

(43) Date of publication:
26.10.2011 Bulletin 2011/43

(21) Application number: 10700719.7

(22) Date of filing: 20.01.2010
(51) International Patent Classification (IPC): 
H01L 21/302(2006.01)
(86) International application number:
PCT/EP2010/000328
(87) International publication number:
WO 2010/083995 (29.07.2010 Gazette 2010/30)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 21.01.2009 DE 102009005484

(71) Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
80686 München (DE)

(72) Inventors:
  • BAGDAHN, Jörg
    06366 Köthen (DE)
  • BOHNE, Alexander
    04107 Leipzig (DE)
  • SCHÖNFELDER, Stephan
    06112 Halle (DE)
  • FISCHER, Carola
    06112 Halle (DE)

(74) Representative: Gagel, Roland 
Patentanwalt Dr. Roland Gagel Landsberger Strasse 480a
81241 München
81241 München (DE)

   


(54) METHOD OF ENHANCING THE STRENGTH OF SEMICONDUCTOR WAFERS OR CHIPS