<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP11158762A3" file="EP11158762NWA3.xml" lang="de" country="EP" doc-number="2388219" kind="A3" date-publ="20121219" status="n" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="de"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORSMESM..................</B001EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.15 (14 Jul 2008) -  1620000/0</B007EP></eptags></B000><B100><B110>2388219</B110><B120><B121>EUROPÄISCHE PATENTANMELDUNG</B121></B120><B130>A3</B130><B140><date>20121219</date></B140><B190>EP</B190></B100><B200><B210>11158762.2</B210><B220><date>20110318</date></B220><B240><B241><date>20110318</date></B241></B240><B250>de</B250><B251EP>de</B251EP><B260>de</B260></B200><B300><B310>102010029101</B310><B320><date>20100519</date></B320><B330><ctry>DE</ctry></B330><B310>102010044154</B310><B320><date>20101119</date></B320><B330><ctry>DE</ctry></B330></B300><B400><B405><date>20121219</date><bnum>201251</bnum></B405><B430><date>20111123</date><bnum>201147</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>B65H  19/28        20060101AFI20121113BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>B65H  19/29        20060101ALI20121113BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>B65H  75/18        20060101ALI20121113BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Verfahren und Vorrichtung zum Bestücken einer Materialbahnrolle mit RFID-Chips</B542><B541>en</B541><B542>Method and device for applying RFID chips to a roll of material</B542><B541>fr</B541><B542>Procédé et dispositif d'alimentation d'un rouleau de matériau en puces RFID</B542></B540><B590><B598>3</B598></B590></B500><B700><B710><B711><snm>Voith Patent GmbH</snm><iid>101121107</iid><irf>14262 EP 2/RSM</irf><adr><str>Sankt Pöltener Strasse 43</str><city>89520 Heidenheim</city><ctry>DE</ctry></adr></B711></B710><B720><B721><snm>Hantke, Marcel</snm><adr><str>
Brandenburgerstr. 22</str><city>14776 Brandenburg</city><ctry>DE</ctry></adr></B721></B720></B700><B800><B840><ctry>AL</ctry><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MK</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>RS</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>SM</ctry><ctry>TR</ctry></B840><B844EP><B845EP><ctry>BA</ctry></B845EP><B845EP><ctry>ME</ctry></B845EP></B844EP><B880><date>20121219</date><bnum>201251</bnum></B880></B800></SDOBI>
<abstract id="abst" lang="de">
<p id="pa01" num="0001">Die Erfindung betrifft ein Verfahren zum Bestücken von Materialbahnrollen mit RFID-Chips (5,6). Ferner betrifft sie eine Vorrichtung zur Durchfürung des Verfahrens.</p>
<p id="pa02" num="0002">Das Verfahren ist dadurch gekennzeichnet, dass das Bestücken beim Wickeln der Materialbahn (1) erfolgt.</p>
<p id="pa03" num="0003">Die zur Durchführung des Verfahren benötigte Vorrichtung weist dazu in einer bevorzugten Ausgestaltung ein zum Bestücken der Materialbahnrollen, insbesondere der Fertigrollen, verfahrbares Element (10) auf, mittels dessen die Materialbahn, insbesondere eine Papierbahn, auf voller Breite transversal durchtrennbar und beidseits der Trennlinie mit einem zur Trennlinie parallel verlaufenden Klebemittel (3,4) beaufschlagbar ist, in das die RFID-Chips (5,6) einbettbar sind.
<img id="iaf01" file="imgaf001.tif" wi="138" he="99" img-content="drawing" img-format="tif"/></p>
</abstract>
<search-report-data id="srep" lang="de" srep-office="EP" date-produced=""><doc-page id="srep0001" file="srep0001.tif" wi="155" he="233" type="tif"/><doc-page id="srep0002" file="srep0002.tif" wi="157" he="233" type="tif"/></search-report-data><search-report-data date-produced="20121109" id="srepxml" lang="de" srep-office="EP" srep-type="ep-sr" status="n"><!--
 The search report data in XML is provided for the users' convenience only. It might differ from the search report of the PDF document, which contains the officially published data. The EPO disclaims any liability for incorrect or incomplete data in the XML for search reports.
 -->

<srep-info><file-reference-id>14262 EP 2/RSM</file-reference-id><application-reference><document-id><country>EP</country><doc-number>11158762.2</doc-number></document-id></application-reference><applicant-name><name>Voith Patent GmbH</name></applicant-name><srep-established srep-established="yes"/><srep-invention-title title-approval="yes"/><srep-abstract abs-approval="no"/><srep-figure-to-publish figinfo="by-applicant"><figure-to-publish><fig-number>3</fig-number></figure-to-publish></srep-figure-to-publish><srep-info-admin><srep-office><addressbook><text>DH</text></addressbook></srep-office><date-search-report-mailed><date>20121119</date></date-search-report-mailed></srep-info-admin></srep-info><srep-for-pub><srep-fields-searched><minimum-documentation><classifications-ipcr><classification-ipcr><text>B65H</text></classification-ipcr></classifications-ipcr></minimum-documentation></srep-fields-searched><srep-citations><citation id="sr-cit0001"><patcit dnum="US2003025027A1" id="sr-pcit0001" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=US2003025027&amp;CY=ep"><document-id><country>US</country><doc-number>2003025027</doc-number><kind>A1</kind><name>EBISAWA RYOJI [JP] ET AL</name><date>20030206</date></document-id></patcit><category>X</category><rel-claims>1,2,6-8</rel-claims><rel-passage><passage>* Absätze [0109],  [0110],  [0111],  [0123]; Abbildung 18 *</passage></rel-passage></citation><citation id="sr-cit0002"><patcit dnum="EP1803671A2" id="sr-pcit0002" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=EP1803671&amp;CY=ep"><document-id><country>EP</country><doc-number>1803671</doc-number><kind>A2</kind><name>NRC INTERNAT INC [US]</name><date>20070704</date></document-id></patcit><category>X</category><rel-claims>1,6,8</rel-claims><rel-passage><passage>* Absätze [0049],  [0051],  [0052]; Abbildungen 9,10 *</passage></rel-passage></citation><citation id="sr-cit0003"><patcit dnum="EP1947591A1" id="sr-pcit0003" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=EP1947591&amp;CY=ep"><document-id><country>EP</country><doc-number>1947591</doc-number><kind>A1</kind><name>BROTHER IND LTD [JP]</name><date>20080723</date></document-id></patcit><category>X</category><rel-claims>1,3,5,6,8</rel-claims><rel-passage><passage>* Absätze [0176],  [0177],  [0179]; Abbildung 1 *</passage></rel-passage></citation><citation id="sr-cit0004"><patcit dnum="EP1538084A1" id="sr-pcit0004" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=EP1538084&amp;CY=ep"><document-id><country>EP</country><doc-number>1538084</doc-number><kind>A1</kind><name>ISHIDA SEISAKUSHO [JP]</name><date>20050608</date></document-id></patcit><category>X</category><rel-claims>1,2,8</rel-claims><rel-passage><passage>* Absätze [0027],  [0028],  [0033],  [0035],  [0037],  [0218],  [0219] *</passage></rel-passage></citation></srep-citations><srep-admin><examiners><primary-examiner><name>Pussemier, Bart</name></primary-examiner></examiners><srep-office><addressbook><text>The Hague</text></addressbook></srep-office><date-search-completed><date>20121109</date></date-search-completed></srep-admin><!--
							The annex lists the patent family members relating to the patent documents cited in the above mentioned European search report.
							The members are as contained in the European Patent Office EDP file on
							The European Patent Office is in no way liable for these particulars which are merely given for the purpose of information.
							For more details about this annex : see Official Journal of the European Patent Office, No 12/82
						--><srep-patent-family><patent-family><priority-application><document-id><country>US</country><doc-number>2003025027</doc-number><kind>A1</kind><date>20030206</date></document-id></priority-application><family-member><document-id><country>JP</country><doc-number>2003043638</doc-number><kind>A</kind><date>20030213</date></document-id></family-member><family-member><document-id><country>US</country><doc-number>2003025027</doc-number><kind>A1</kind><date>20030206</date></document-id></family-member></patent-family><patent-family><priority-application><document-id><country>EP</country><doc-number>1803671</doc-number><kind>A2</kind><date>20070704</date></document-id></priority-application><family-member><document-id><country>EP</country><doc-number>1803671</doc-number><kind>A2</kind><date>20070704</date></document-id></family-member><family-member><document-id><country>JP</country><doc-number>2007177246</doc-number><kind>A</kind><date>20070712</date></document-id></family-member><family-member><document-id><country>US</country><doc-number>2007144677</doc-number><kind>A1</kind><date>20070628</date></document-id></family-member></patent-family><patent-family><priority-application><document-id><country>EP</country><doc-number>1947591</doc-number><kind>A1</kind><date>20080723</date></document-id></priority-application><family-member><document-id><country>EP</country><doc-number>1947591</doc-number><kind>A1</kind><date>20080723</date></document-id></family-member><family-member><document-id><country>US</country><doc-number>2009072974</doc-number><kind>A1</kind><date>20090319</date></document-id></family-member><family-member><document-id><country>WO</country><doc-number>2007043585</doc-number><kind>A1</kind><date>20070419</date></document-id></family-member></patent-family><patent-family><priority-application><document-id><country>EP</country><doc-number>1538084</doc-number><kind>A1</kind><date>20050608</date></document-id></priority-application><family-member><document-id><country>AU</country><doc-number>2003252695</doc-number><kind>A1</kind><date>20040225</date></document-id></family-member><family-member><document-id><country>EP</country><doc-number>1538084</doc-number><kind>A1</kind><date>20050608</date></document-id></family-member><family-member><document-id><country>US</country><doc-number>2005198920</doc-number><kind>A1</kind><date>20050915</date></document-id></family-member><family-member><document-id><country>US</country><doc-number>2009173046</doc-number><kind>A1</kind><date>20090709</date></document-id></family-member><family-member><document-id><country>WO</country><doc-number>2004014733</doc-number><kind>A1</kind><date>20040219</date></document-id></family-member></patent-family></srep-patent-family></srep-for-pub></search-report-data>
</ep-patent-document>
