(19)
(11) EP 2 396 815 A2

(12)

(88) Date of publication A3:
28.10.2010

(43) Date of publication:
21.12.2011 Bulletin 2011/51

(21) Application number: 10741683.6

(22) Date of filing: 10.02.2010
(51) International Patent Classification (IPC): 
H01L 21/66(2006.01)
G01N 21/88(2006.01)
(86) International application number:
PCT/US2010/023802
(87) International publication number:
WO 2010/093733 (19.08.2010 Gazette 2010/33)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 13.02.2009 US 152477 P

(71) Applicant: KLA-Tencor Corporation
Milpitas, CA 95035 (US)

(72) Inventors:
  • HUANG, Junqing
    Fremont California 94536 (US)
  • ZHANG, Yong
    Cupertino California 95014 (US)
  • CHEN, Stephanie
    Fremont California 94555 (US)
  • LUO, Tao
    Fremont California 94539 (US)
  • GAO, Lisheng
    Morgan Hill California 95037 (US)
  • WALLINGFORD, Richard
    San Jose California 95118 (US)

(74) Representative: Lukaszyk, Szymon 
Kancelaria Patentowa Lukaszyk ul. Glowackiego 8
40-062 Katowice
40-062 Katowice (PL)

   


(54) DETECTING DEFECTS ON A WAFER