LED LEADFRAME PACKAGE, LED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE LED PACKAGE - Patent 2406835

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EP 2 406 835 A2

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(88)	Date of publication A3:
	25.11.2010

(43)	Date of publication:
	18.01.2012 Bulletin 2012/03

(21)	Application number: 10750967.1

(22)	Date of filing: 24.02.2010

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International Patent Classification (IPC):

H01L 33/62^(2010.01)

H01L 33/64^(2010.01)

(86)	International application number:
	PCT/KR2010/001134

(87)	International publication number:
	WO 2010/104276 (16.09.2010 Gazette 2010/37)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

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Priority:

10.03.2009 US 381408
10.03.2009 US 381409

(71)	Applicant: Nepes Led Corporation
	Chungcheongbuk-Do 363-886 (KR)

(72)	Inventor:
	NGUYEN, The Tran Garden Grove, California 92843 (US)

(74)	Representative: Barth, Stephan Manuel
	Reinhard, Skuhra, Weise & Partner GbR Patent- und Rechtsanwälte Friedrichstrasse 31 80801 München 80801 München (DE)

(54)	LED LEADFRAME PACKAGE, LED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE LED PACKAGE