A heat pump device connecting a compressor, a heat radiator, an expansion mechanism, and a heat absorber by using a pipe through which a refrigerant circulates, a temperature measuring unit that is disposed in a pipe connecting the heat radiator, and a wind circuit through which air of the heat pump device flows inside from an air inlet at the heat absorber and flows outside from an air outlet at the heat radiator, are included. Further, a drain pan receiving condensed water produced by heat exchange between the air in the wind circuit and air in heat absorber is further included, and the temperature measuring unit is disposed under a boundary position where water of the drain pan overflows.