(19)
(11) EP 2 423 955 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
09.10.2019 Bulletin 2019/41

(45) Mention of the grant of the patent:
04.09.2019 Bulletin 2019/36

(21) Application number: 10766819.6

(22) Date of filing: 19.04.2010
(51) International Patent Classification (IPC): 
H05K 3/34(2006.01)
H05K 3/30(2006.01)
(86) International application number:
PCT/JP2010/002800
(87) International publication number:
WO 2010/122757 (28.10.2010 Gazette 2010/43)

(54)

METHOD FOR MOUNTING SEMICONDUCTOR PACKAGE COMPONENT, AND STRUCTURE HAVING SEMICONDUCTOR PACKAGE COMPONENT MOUNTED THEREIN

VERFAHREN ZUR MONTAGE EINER HALBLEITERPAKETKOMPONENTE UND STRUKTUR MIT DARAUF MONTIERTER HALBLEITERPAKETKOMPONENTE

PROCÉDÉ DE MONTAGE D'UN COMPOSANT DE BOÎTIER POUR SEMI-CONDUCTEUR, ET STRUCTURE DANS LAQUELLE EST MONTÉ CET ÉLÉMENT


(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 24.04.2009 JP 2009105757
24.04.2009 JP 2009105758

(43) Date of publication of application:
29.02.2012 Bulletin 2012/09

(73) Proprietor: Panasonic Intellectual Property Management Co., Ltd.
Osaka-shi, Osaka 540-6207 (JP)

(72) Inventors:
  • Ohashi, Naomichi
    Osaka 540-6207 (JP)
  • Yamaguchi, Atsushi
    Osaka 540-6207 (JP)
  • Kishi, Arata
    Osaka 540-6207 (JP)
  • Udaka, Masato
    Osaka 540-6207 (JP)
  • Tokii, Seiji
    Osaka 540-6207 (JP)

(74) Representative: Grünecker Patent- und Rechtsanwälte PartG mbB 
Leopoldstraße 4
80802 München
80802 München (DE)


(56) References cited: : 
JP-A- 2002 198 384
JP-A- 2003 197 681
JP-A- 2009 021 465
US-A- 5 814 401
US-A1- 2004 262 368
JP-A- 2002 198 384
JP-A- 2008 166 377
JP-A- 2009 021 465
US-A1- 2004 238 925
US-A1- 2008 308 930
   
  • -: "Epoxy Adhesive Application Guide", , 1 January 2016 (2016-01-01), XP055348601, Retrieved from the Internet: URL:http://www.epotek.com/site/files/broch ures/pdfs/adhesive_application_guide.pdf [retrieved on 2017-02-22]
   
Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).