(19)
(11) EP 2 449 004 A1

(12)

(43) Date of publication:
09.05.2012 Bulletin 2012/19

(21) Application number: 10729044.7

(22) Date of filing: 30.06.2010
(51) International Patent Classification (IPC): 
C08J 5/04(2006.01)
B08B 1/00(2006.01)
(86) International application number:
PCT/US2010/040574
(87) International publication number:
WO 2011/002867 (06.01.2011 Gazette 2011/01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 02.07.2009 US 222770 P

(71) Applicant: E. I. du Pont de Nemours and Company
Wilmington, DE 19898 (US)

(72) Inventor:
  • BOOZE, J., David
    Wilmington, Delaware 19803 (US)

(74) Representative: Heinemann, Monica 
Abitz & Partner Patentanwälte Hörselbergstrasse 5
81677 München
81677 München (DE)

   


(54) SEMICONDUCTOR MANUFACTURE COMPONENT