(19)
(11) EP 2 475 808 A1

(12)

(43) Date of publication:
18.07.2012 Bulletin 2012/29

(21) Application number: 10751798.9

(22) Date of filing: 12.08.2010
(51) International Patent Classification (IPC): 
C25D 3/38(2006.01)
C25D 5/50(2006.01)
C25D 5/10(2006.01)
C25D 7/00(2006.01)
(86) International application number:
PCT/EP2010/004942
(87) International publication number:
WO 2011/029507 (17.03.2011 Gazette 2011/11)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(30) Priority: 11.09.2009 DE 102009041250

(71) Applicant: Umicore Galvanotechnik GmbH
73525 Schwäbisch Gmünd (DE)

(72) Inventors:
  • GASSNER, Franz
    86561 Oberlauterbach (DE)
  • STRAUBINGER, Frank
    73529 Schwaebisch Gmuend (DE)
  • REI MÜLLER, Klaus
    73565 Spraitbach-Vorderlintal (DE)
  • WIRTH, Guenter
    73560 Boebingen (DE)
  • NEUHAUS, Silvia
    73527 Schwaebisch Gmuend (DE)

(74) Representative: Retzow, Stefan 
Umicore AG & Co. KG Patente Rodenbacher Chaussee 4
63457 Hanau-Wolfgang
63457 Hanau-Wolfgang (DE)

   


(54) PROCESS FOR THE ELECTROLYTIC COPPER PLATING OF ZINC DIECASTING HAVING A REDUCED TENDENCY TO BLISTER FORMATION