<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP12151409A3" file="EP12151409NWA3.xml" lang="en" country="EP" doc-number="2479764" kind="A3" date-publ="20120822" status="n" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORSMESM..................</B001EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.15 (14 Jul 2008) -  1620000/0</B007EP></eptags></B000><B100><B110>2479764</B110><B120><B121>EUROPEAN PATENT APPLICATION</B121></B120><B130>A3</B130><B140><date>20120822</date></B140><B190>EP</B190></B100><B200><B210>12151409.5</B210><B220><date>20120117</date></B220><B240><B241><date>20120203</date></B241></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>2011010366</B310><B320><date>20110121</date></B320><B330><ctry>JP</ctry></B330></B300><B400><B405><date>20120822</date><bnum>201234</bnum></B405><B430><date>20120725</date><bnum>201230</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>H01F  27/32        20060101AFI20120713BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>H01F  30/12        20060101ALI20120713BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Harzgeformte Spule und geformter Transformator damit</B542><B541>en</B541><B542>Resin molded coil and molded transformer using the same</B542><B541>fr</B541><B542>Bobine moulée en résine et transformateur moulé l'utilisant</B542></B540><B590><B598>1</B598></B590></B500><B700><B710><B711><snm>Hitachi Industrial Equipment Systems Co., Ltd.</snm><iid>101156636</iid><irf>TRC/FP6807218</irf><adr><str>3, Kanda Neribei-cho 
Chiyoda-ku</str><city>Tokyo</city><ctry>JP</ctry></adr></B711></B710><B720><B721><snm>Azegami, Tatsuhito</snm><adr><str>c/o Hitachi, Ltd., Intellectual Property Group,
12th Floor, Marunouchi Center
Building
6-1, Marunouchi 1-chome, Chiyoda-ku</str><city>Tokyo 100-8220</city><ctry>JP</ctry></adr></B721><B721><snm>Takeuchi, Masaki</snm><adr><str>c/o Hitachi, Ltd., Intellectual Property Group,
12th Floor, Marunouchi Center
Building
6-1, Marunouchi 1-chome, Chiyoda-ku</str><city>Tokyo 100-8220</city><ctry>JP</ctry></adr></B721><B721><snm>Sato, Kohei</snm><adr><str>c/o Hitachi, Ltd., Intellectual Property Group,
12th Floor, Marunouchi Center
Building
6-1, Marunouchi 1-chome, Chiyoda-ku</str><city>Tokyo, 100-8220</city><ctry>JP</ctry></adr></B721><B721><snm>Suzuki, Atsushi</snm><adr><str>c/o Hitachi, Ltd., Intellectual Property Group,
12th Floor, Marunouchi Center
Building
6-1, Marunouchi 1-chome, Chiyoda-ku</str><city>Tokyo 100-8220</city><ctry>JP</ctry></adr></B721><B721><snm>Ito, Yoshimitsu</snm><adr><str>c/o Hitachi, Ltd., Intellectual Property Group,
12th Floor, Marunouchi Center
Building
6-1, Marunouchi 1-chome, Chiyoda-ku</str><city>Tokyo 100-8220</city><ctry>JP</ctry></adr></B721></B720><B740><B741><snm>Calderbank, Thomas Roger</snm><sfx>et al</sfx><iid>101176526</iid><adr><str>Mewburn Ellis LLP 
33 Gutter Lane</str><city>London EC2V 8AS</city><ctry>GB</ctry></adr></B741></B740></B700><B800><B840><ctry>AL</ctry><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MK</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>RS</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>SM</ctry><ctry>TR</ctry></B840><B844EP><B845EP><ctry>BA</ctry></B845EP><B845EP><ctry>ME</ctry></B845EP></B844EP><B880><date>20120822</date><bnum>201234</bnum></B880></B800></SDOBI>
<abstract id="abst" lang="en">
<p id="pa01" num="0001">A resin molded coil is configured by providing multiple layers of a prepreg layer (41,42,43,44) and a fiber glass-base layer (31,32,33,34) in the inner/outer circumference resin layers in the radial direction of the concentric circle of a coil (1) and a winding wire to make the resin layer multiply-layered and subdivided. This configuration reduces the resin contraction amount of each layer and increases crack resistance.
<img id="iaf01" file="imgaf001.tif" wi="65" he="106" img-content="drawing" img-format="tif"/></p>
</abstract>
<search-report-data id="srep" lang="en" srep-office="EP" date-produced=""><doc-page id="srep0001" file="srep0001.tif" wi="160" he="233" type="tif"/><doc-page id="srep0002" file="srep0002.tif" wi="160" he="233" type="tif"/><doc-page id="srep0003" file="srep0003.tif" wi="158" he="233" type="tif"/></search-report-data><search-report-data date-produced="20120710" id="srepxml" lang="en" srep-office="EP" srep-type="ep-sr" status="n"><!--
 The search report data in XML is provided for the users' convenience only. It might differ from the search report of the PDF document, which contains the officially published data. The EPO disclaims any liability for incorrect or incomplete data in the XML for search reports.
 -->
<srep-info><file-reference-id>TRC/FP6807218</file-reference-id><application-reference><document-id><country>EP</country><doc-number>12151409.5</doc-number></document-id></application-reference><applicant-name><name>Hitachi Industrial Equipment Systems Co., Ltd.</name></applicant-name><srep-established srep-established="yes"/><srep-invention-title title-approval="yes"/><srep-abstract abs-approval="yes"/><srep-figure-to-publish figinfo="by-applicant"><figure-to-publish><fig-number>1</fig-number></figure-to-publish></srep-figure-to-publish><srep-info-admin><srep-office><addressbook><text>MN</text></addressbook></srep-office><date-search-report-mailed><date>20120719</date></date-search-report-mailed></srep-info-admin></srep-info><srep-for-pub><srep-fields-searched><minimum-documentation><classifications-ipcr><classification-ipcr><text>H01F</text></classification-ipcr></classifications-ipcr></minimum-documentation></srep-fields-searched><srep-citations><citation id="sr-cit0001"><patcit dnum="US2010134227A1" id="sr-pcit0001" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=US2010134227&amp;CY=ep"><document-id><country>US</country><doc-number>2010134227</doc-number><kind>A1</kind><name>MORI MITSUTOSHI [JP] ET AL</name><date>20100603</date></document-id></patcit><category>X</category><rel-claims>1-6</rel-claims><rel-passage><passage>* paragraphs [0007],  [0011],  [0031],  [0042]; figures 2,3 *</passage><category>Y</category><rel-claims>7</rel-claims></rel-passage></citation><citation id="sr-cit0002"><patcit dnum="JP56062311A" id="sr-pcit0002" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP56062311&amp;CY=ep"><document-id><country>JP</country><doc-number>56062311</doc-number><kind>A</kind><name>HITACHI LTD</name><date>19810528</date></document-id></patcit><category>X</category><rel-claims>1,4</rel-claims><rel-passage><passage>* abstract; figures 1,2 *</passage></rel-passage></citation><citation id="sr-cit0003"><patcit dnum="JP60059724A" id="sr-pcit0003" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP60059724&amp;CY=ep"><document-id><country>JP</country><doc-number>60059724</doc-number><kind>A</kind><name>TOSHIBA KK</name><date>19850406</date></document-id></patcit><category>X</category><rel-claims>1-4,7</rel-claims><rel-passage><passage>* abstract; figures 1,4 *</passage></rel-passage></citation><citation id="sr-cit0004"><patcit dnum="JP60053007A" id="sr-pcit0004" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP60053007&amp;CY=ep"><document-id><country>JP</country><doc-number>60053007</doc-number><kind>A</kind><name>TOSHIBA KK</name><date>19850326</date></document-id></patcit><category>X</category><rel-claims>1-4</rel-claims><rel-passage><passage>* abstract; figure 1 *</passage></rel-passage></citation><citation id="sr-cit0005"><patcit dnum="JP55015268A" id="sr-pcit0005" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP55015268&amp;CY=ep"><document-id><country>JP</country><doc-number>55015268</doc-number><kind>A</kind><name>MATSUSHITA ELECTRIC IND CO LTD</name><date>19800202</date></document-id></patcit><category>X</category><rel-claims>1</rel-claims><rel-passage><passage>* abstract; figures 1,2 *</passage></rel-passage></citation><citation id="sr-cit0006"><patcit dnum="JP56081907A" id="sr-pcit0006" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP56081907&amp;CY=ep"><document-id><country>JP</country><doc-number>56081907</doc-number><kind>A</kind><name>TOKYO SHIBAURA ELECTRIC CO</name><date>19810704</date></document-id></patcit><category>X</category><rel-claims>1</rel-claims><rel-passage><passage>* abstract; figures 1-10 *</passage></rel-passage></citation><citation id="sr-cit0007"><patcit dnum="JP2010219251A" id="sr-pcit0007" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP2010219251&amp;CY=ep"><document-id><country>JP</country><doc-number>2010219251</doc-number><kind>A</kind><name>SUMITOMO ELECTRIC INDUSTRIES</name><date>20100930</date></document-id></patcit><category>Y</category><rel-claims>7</rel-claims><rel-passage><passage>* abstract; figure 1 *</passage><category>A</category><rel-claims>1,4</rel-claims></rel-passage></citation><citation id="sr-cit0008"><patcit dnum="JP61177702A" id="sr-pcit0008" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP61177702&amp;CY=ep"><document-id><country>JP</country><doc-number>61177702</doc-number><kind>A</kind><name>MITSUBISHI ELECTRIC CORP</name><date>19860809</date></document-id></patcit><category>A</category><rel-claims>1</rel-claims><rel-passage><passage>* abstract; figure 1 *</passage></rel-passage></citation><citation id="sr-cit0009"><patcit dnum="JP2000012343A" id="sr-pcit0009" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP2000012343&amp;CY=ep"><document-id><country>JP</country><doc-number>2000012343</doc-number><kind>A</kind><name>HITACHI LTD</name><date>20000114</date></document-id></patcit><category>A</category><rel-claims>1</rel-claims><rel-passage><passage>* abstract; figure 1 *</passage></rel-passage></citation><citation id="sr-cit0010"><patcit dnum="JP11214237A" id="sr-pcit0010" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP11214237&amp;CY=ep"><document-id><country>JP</country><doc-number>11214237</doc-number><kind>A</kind><name>HITACHI LTD</name><date>19990806</date></document-id></patcit><category>A</category><rel-claims>4</rel-claims><rel-passage><passage>* abstract; figures 4,5 *</passage></rel-passage></citation><citation id="sr-cit0011"><patcit dnum="JP3107307A" id="sr-pcit0011" url="http://v3.espacenet.com/textdoc?DB=EPODOC&amp;IDX=JP3107307&amp;CY=ep"><document-id><country>JP</country><doc-number>3107307</doc-number><kind>A</kind><name>HITACHI LTD</name><date>19910507</date></document-id></patcit><category>A</category><rel-claims>1</rel-claims><rel-passage><passage>* abstract; figures 1-4 *</passage></rel-passage></citation></srep-citations><srep-admin><examiners><primary-examiner><name>Rouzier, Brice</name></primary-examiner></examiners><srep-office><addressbook><text>Munich</text></addressbook></srep-office><date-search-completed><date>20120710</date></date-search-completed></srep-admin><!--
							The annex lists the patent family members relating to the patent documents cited in the above mentioned European search report.
							The members are as contained in the European Patent Office EDP file on
							The European Patent Office is in no way liable for these particulars which are merely given for the purpose of information.
							For more details about this annex : see Official Journal of the European Patent Office, No 12/82
						--><srep-patent-family><patent-family><priority-application><document-id><country>US</country><doc-number>2010134227</doc-number><kind>A1</kind><date>20100603</date></document-id></priority-application><family-member><document-id><country>DE</country><doc-number>102009047147</doc-number><kind>A1</kind><date>20100902</date></document-id></family-member><family-member><document-id><country>JP</country><doc-number>2010239113</doc-number><kind>A</kind><date>20101021</date></document-id></family-member><family-member><document-id><country>US</country><doc-number>2010134227</doc-number><kind>A1</kind><date>20100603</date></document-id></family-member></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>56062311</doc-number><kind>A</kind><date>19810528</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>60059724</doc-number><kind>A</kind><date>19850406</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>60053007</doc-number><kind>A</kind><date>19850326</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>55015268</doc-number><kind>A</kind><date>19800202</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>56081907</doc-number><kind>A</kind><date>19810704</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>2010219251</doc-number><kind>A</kind><date>20100930</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>61177702</doc-number><kind>A</kind><date>19860809</date></document-id></priority-application><text>NONE</text></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>2000012343</doc-number><kind>A</kind><date>20000114</date></document-id></priority-application><family-member><document-id><country>JP</country><doc-number>3847958</doc-number><kind>B2</kind><date>20061122</date></document-id></family-member><family-member><document-id><country>JP</country><doc-number>2000012343</doc-number><kind>A</kind><date>20000114</date></document-id></family-member></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>11214237</doc-number><kind>A</kind><date>19990806</date></document-id></priority-application><family-member><document-id><country>JP</country><doc-number>3807839</doc-number><kind>B2</kind><date>20060809</date></document-id></family-member><family-member><document-id><country>JP</country><doc-number>11214237</doc-number><kind>A</kind><date>19990806</date></document-id></family-member></patent-family><patent-family><priority-application><document-id><country>JP</country><doc-number>3107307</doc-number><kind>A</kind><date>19910507</date></document-id></priority-application><text>NONE</text></patent-family></srep-patent-family></srep-for-pub></search-report-data>
</ep-patent-document>
