(19)
(11) EP 2 487 444 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
19.03.2014 Bulletin 2014/12

(43) Date of publication A2:
15.08.2012 Bulletin 2012/33

(21) Application number: 12000962.6

(22) Date of filing: 14.02.2012
(51) International Patent Classification (IPC): 
F28D 9/00(2006.01)
F24D 3/18(2006.01)
 F28F 3/04(2006.01)
F25B 30/02(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 14.02.2011 JP 2011028106

(71) Applicant: Mitsubishi Electric Corporation
Chiyoda-ku Tokyo 100-8310 (JP)

(72) Inventors:
  • Uchino, Shinichi
    Tokyo 100-8310 (JP)
  • Hayashi, Takehiro
    Tokyo 100-8310 (JP)
  • Ito, Daisuke
    Tokyo 100-8310 (JP)

(74) Representative: Pfenning, Meinig & Partner GbR 
Patent- und Rechtsanwälte Theresienhöhe 13
80339 München
80339 München (DE)

   


(54) Plate heat exchanger and heat pump device


(57) One of the purpose is to improve a yield ratio of members to be used for a plate heat exchanger and a yield ratio of the plate heat exchanger itself, and to improve a strength of the plate heat exchanger. Each heat transfer plate 101 in the plate heat exchanger has a rectangular shape with a long side and a short side, in which two flow channel holes that are openings through which any of the first fluid and the second fluid passes are formed respectively on one side of the short sides and another side of the short sides. Each heat transfer plate 101 includes a structure 102 which protrudes from a part of a periphery of any flow channel hole of four flow channel holes, and bends and extends in a direction to be distanced from an opening. The structure 102 is attached firmly to a vicinity of a periphery of a corresponding flow channel hole in a lamination direction of the heat transfer plate that is adjacent on the other side.







Search report









Search report