FIELD
[0001] The present disclosure relates to systems and methods for using rotating sample processing
devices to, e.g., amplify genetic materials, etc.
BACKGROUND
[0002] Many different chemical, biochemical, and other reactions are sensitive to temperature
variations. Examples of thermal processes in the area of genetic amplification include,
but are not limited to, Polymerase Chain Reaction (PCR), Sanger sequencing, etc. One
approach to reducing the time and cost of thermally processing multiple samples is
to use a device including multiple chambers in which different portions of one sample
or different samples can be processed simultaneously. Examples of some reactions that
may require accurate chamber-to-chamber temperature control, comparable temperature
transition rates, and/or rapid transitions between temperatures include, e.g., the
manipulation of nucleic acid samples to assist in the deciphering of the genetic code.
Nucleic acid manipulation techniques include amplification methods such as polymerase
chain reaction (PCR); target polynucleotide amplification methods such as self-sustained
sequence replication (3SR) and strand-displacement amplification (SDA); methods based
on amplification of a signal attached to the target polynucleotide, such as "branched
chain" DNA amplification; methods based on amplification of probe DNA, such as ligase
chain reaction (LCR) and QB replicase amplification (QBR); transcription-based methods,
such as ligation activated transcription (LAT) and nucleic acid sequence-based amplification
(NASBA); and various other amplification methods, such as repair chain reaction (RCR)
and cycling probe reaction (CPR). Other examples of nucleic acid manipulation techniques
include, e.g., Sanger sequencing, ligand-binding assays, etc.
[0003] Some systems used to process rotating sample processing devices are described in
U.S. Patent No. 6,889,468 titled MODULAR SYSTEMS AND METHODS FOR USING SAMPLE PROCESSING DEVICES and
U.S. Patent No. 6,734,401 titled ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS (Bedingham et al).
[0004] A system, according to the preamble of claim 1, for processing sample processing
devices, is disclosed in
JP 2009 216395 A.
SUMMARY
[0005] Embodiments of the present disclosure provide a system for processing sample processing
devices according to claim 1. The system includes a base plate operatively coupled
to a drive system and having a first surface, wherein the drive system rotates the
base plate about a rotation axis, and wherein the rotation axis defines a z-axis.
The system further includes a cover adapted to be positioned facing the first surface
of the base plate. The cover includes a first projection. The system further includes
a housing comprising a portion movable with respect to the base plate between an open
position in which the cover is not coupled to the base plate and a closed position
in which the cover is coupled to the base plate. The portion includes a second projection.
The first projection and the second projection are adapted to be coupled together
when the portion is in the open position and decoupled from each other when the portion
is in the closed position, such that the cover is rotatable with the base plate about
the rotation axis when the portion is in the closed position and when the cover is
coupled to the base plate. The system further includes a sample processing device
comprising at least one process chamber and adapted to be positioned between the base
plate and the cover. The sample processing device is rotatable with the base plate
about the rotation axis when the sample processing device is coupled to the base plate.
The system further comprises at least one first magnetic element operatively coupled
to the base plate, and at least one second magnetic element operatively coupled to
the cover, the at least one first magnetic element configured to attract the at least
one second magnetic element to force the cover in a first direction along the z-axis.
[0006] Embodiments of the present disclosure provide a method for processing sample processing
devices according to claim 12. The method includes providing a base plate operatively
coupled to a drive system and having a first surface, providing a cover adapted to
be positioned facing the first surface of the base plate, and providing a housing.
The housing includes a portion movable with respect to the base plate between an open
position in which the cover is not coupled to the base plate and a closed position
in which the cover is coupled to the base plate.
[0007] The method further includes positioning a sample processing device on the base plate.
The sample processing device includes at least one process chamber. The method further
includes coupling the cover to the portion of the housing when the portion of the
housing is in the open position, and moving the portion of the housing from the open
position to the closed position. The method further includes coupling the cover to
the base plate at least partially in response to moving the portion of the housing
from the open position to the closed position. The method further includes rotating
the base plate about a rotation axis, wherein the rotation axis defines a z-axis.
The method includes providing at least one first magnetic element operatively coupled
to the base plate, and providing at least one second magnetic element operatively
coupled to the cover, wherein coupling the cover to the base plate includes coupling
the at least one first magnetic element and the at least one second magnetic element.
[0008] Other features and aspects of the present disclosure will become apparent by consideration
of the detailed description and accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009]
FIG. 1 is an exploded perspective view of an assembly according to one embodiment
of the present disclosure, the system including a cover, a sample processing device,
and a base plate.
FIG. 2 is an assembled perspective cross-sectional view of the system of FIG. 1.
FIG. 3 is a perspective view of a system according to one embodiment of the present
disclosure, the system including the assembly of FIGS. 1-2, the system shown in an
open position.
FIG. 4 is a perspective view of the system of FIG. 3, the system shown in a partially
open position.
FIG. 5 is a close-up side cross-sectional view of the system of FIGS. 3-4, the system
shown in a first position.
FIG. 6 is a close-up side cross-sectional view of the system of FIGS. 3-5, the system
shown in a second position.
FIG. 7 is a close-up side cross-sectional view of the system of FIGS. 3-6, the system
shown in a third position.
DETAILED DESCRIPTION
[0010] Before any embodiments of the present disclosure are explained in detail, it is to
be understood that the invention is not limited in its application to the details
of construction and the arrangement of components set forth in the following description
or illustrated in the following drawings. The invention is capable of other embodiments
and of being practiced or of being carried out in various ways. Also, it is to be
understood that the phraseology and terminology used herein is for the purpose of
description and should not
be regarded as limiting. The use of "including," "comprising," or "having" and variations
thereof herein is meant to encompass the items listed thereafter and equivalents thereof
as well as additional items. Unless specified or limited otherwise, the terms "connected,"
and "coupled" and variations thereof are used broadly and encompass both direct and
indirect connections and couplings. Further, "connected" and "coupled" are not restricted
to physical or mechanical connections or couplings. It is to be understood that other
embodiments may be utilized, and structural or logical changes may be made without
departing from the scope of the present disclosure. Furthermore, terms such as "front,"
"rear," "top," "bottom," and the like are only used to describe elements as they relate
to one another, but are in no way meant to recite specific orientations of the apparatus,
to indicate or imply necessary or required orientations of the apparatus, or to specify
how the invention described herein will be used, mounted, displayed, or positioned
in use.
[0011] The present disclosure generally relates to systems and methods for sample processing
devices. Such systems can include means for holding, rotating, thermally controlling
and/or accessing portions of a sample processing device. In addition, systems and
methods of the present disclosure can provide or facilitate positioning a sample processing
device in a desired location of the system, for example, for conducting an assay of
interest, and/or removing the sample processing device from the system, for example,
when an assay of interest is complete. Furthermore, systems and methods of the present
disclosure can facilitate such positioning or removal of a sample processing device
without the need for additional tools or equipment.
[0012] In some embodiments of systems and methods of the present disclosure, the system
can include an annular compression system, which can include an open area (e.g., an
open central area), such that the annular compression system can perform and/or facilitate
the desired thermal control and rotation functions for the sample processing device,
while allowing access to at least a portion of the sample processing device. For example,
some systems of the present disclosure cover a top surface of a sample processing
device in order to hold the sample processing device onto a rotating base plate and/or
to thermally control and isolate portions of the sample processing device (e.g., from
one another and/or ambience). However, other systems of the present disclosure (e.g.,
annular compression systems and methods) can provide the desired positioning and holding
functions as well as the desired thermal control functions, while also allowing a
portion of the sample processing device to be exposed to other devices or systems
for which it may be desirable to have direct access to the sample processing device.
For example, in some embodiments, sample delivery (e.g., manual or automatic pipetting)
can be accomplished after the sample processing device has already been positioned
between an annular cover and a base plate. By way of further example, in some embodiments,
a portion of the sample processing device can be optically accessible (e.g., to electromagnetic
radiation), for example, which can enable more efficient laser addressing of the sample
processing device, or which can be used for optical interrogation (e.g., absorption,
reflectance, fluorescence, etc.). Such laser addressing can be used, for example,
for fluid (e.g., microfluidic) manipulation of a sample in the sample processing device.
[0013] Furthermore, in some embodiments, annular compression systems and methods of the
present disclosure can enable unique temperature control of various portions of a
sample processing device. For example, fluid (e.g., air) can be moved over an exposed
surface of the sample processing device in areas that are desired to be rapidly cooled,
while the areas that are desired to be heated or maintained at a desired temperature
can be covered and isolated from other portions of the sample processing device and/or
from ambience.
[0014] In addition, in some embodiments, systems and methods of the present disclosure can
allow a portion of the sample processing device to be exposed to interact with other
(e.g., external or internal) devices or equipment, such as robotic workstations, pipettes,
interrogation instruments, and the like, or combinations thereof. Similarly, the systems
and methods of the present disclosure can protect desired portions of the sample processing
device from contact.
[0015] As a result, "accessing" at least a portion of a sample processing device can refer
to a variety of processing steps and can include, but is not limited to, physically
or mechanically accessing the sample processing device (e.g., delivering or retrieving
a sample via direct or indirect contact, moving or manipulating a sample in the sample
processing device via direct or indirect contact, etc.); optically accessing the sample
processing device (e.g., laser addressing); thermally accessing the sample processing
device (e.g., selectively heating or cooling an exposed portion of the sample processing
device); and the like; and combinations thereof.
[0016] The present disclosure provides methods and systems for sample processing devices
that can be used in methods that involve thermal processing, e.g., sensitive chemical
processes such as polymerase chain reaction (PCR) amplification, transcription-mediated
amplification (TMA), nucleic acid sequence-based amplification (NASBA), ligase chain
reaction (LCR), self-sustaining sequence replication, enzyme kinetic studies, homogeneous
ligand binding assays, and more complex biochemical or other processes that require
precise thermal control and/or rapid thermal variations. The sample processing systems
are capable of providing simultaneous rotation of the sample processing device in
addition to effecting control over the temperature of sample materials in process
chambers on the devices.
[0017] Some examples of suitable sample processing devices that may be used in connection
with the methods and systems of the present disclosure may be described in, e.g.,
commonly-assigned
U.S. Patent Publication No. 2007/0010007 titled SAMPLE PROCESSING DEVICE COMPRESSION SYSTEMS AND METHODS (Aysta et al.);
U.S. Patent Publication No. 2007/0009391 titled COMPLIANT MICROFLUIDIC SAMPLE PROCESSING DISKS (Bedingham et al.);
U.S. Patent Publication No. 2008/0050276 titled MODULAR SAMPLE PROCESSING APPARATUS KITS AND MODULES (Bedingham et al.);
U.S. Patent No. 6,734,401 titled ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS (Bedingham et al.)
and
U.S. Patent No. 7,026,168 titled SAMPLE PROCESSING DEVICES (Bedingham et al.). Other useable device constructions
may be found in, e.g.,
U.S. Patent No. 7,435,933 (Bedingham et al.) titled ENHANCED SAMPLE PROCESSING DEVICES, SYSTEMS AND METHODS;
U.S. Provisional Patent Application Serial No. 60/237,151 filed on October 2, 2000 and entitled SAMPLE PROCESSING DEVICES, SYSTEMS AND METHODS (Bedingham et al.); and
U.S. Patent No. 6,814,935 titled SAMPLE PROCESSING DEVICES AND CARRIERS (Harms et al.). Other potential device
constructions may be found in, e.g.,
U.S. Patent No. 6,627,159 titled CENTRIFUGAL FILLING OF SAMPLE PROCESSING DEVICES (Bedingham et al.);
PCT Patent Publication No. WO 2008/134470 titled METHODS FOR NUCLEIC ACID AMPLIFICATION (Parthasarathy et al.); and
U.S. Patent Publication No. 2008/0152546 titled ENHANCED SAMPLE PROCESSING DEVICES, SYSTEMS AND METHODS (Bedingham et al.).
[0018] Some embodiments of the sample processing systems of the present disclosure can include
base plates attached to a drive system in a manner that provides for rotation of the
base plate about an axis of rotation. When a sample processing device is secured to
the base plate, the sample processing device can be rotated with the base plate. The
base plate can include at least one thermal structure that can be used to heat portions
of the sample processing device and may include a variety of other components as well,
e.g., temperature sensors, resistance heaters, thermoelectric modules, light sources,
light detectors, transmitters, receivers, etc.
[0019] Other elements and features of systems and methods for processing sample processing
devices can be found in Patent Application No._ (Attorney Docket No. 65861US002),
filed on even date herewith.
[0020] FIGS. 1-2 illustrate a sample processing assembly 50 that can be used in connection
with sample processing systems of the present disclosure. For example, systems of
the present disclosure can include the sample processing assembly 50 or portions thereof,
and can include other elements as well. FIGS. 3-7 illustrate a system 100 according
to one embodiment of the present disclosure that, by way of example only, includes
the sample processing assembly 50. Elements and features of the sample processing
assembly 50 will be described first below.
[0021] As shown in FIGS. 1-2, the assembly 50 can include a base plate 110 that rotates
about an axis of rotation 111. The base plate 110 can also be attached to a drive
system 120, for example, via a shaft 122. It will, however, be understood that the
base plate 110 may be coupled to the drive system 120 through any suitable alternative
arrangement, e.g., belts or a drive wheel operating directly on the base plate 110,
etc.
[0022] As shown in FIGS. 1-2, the assembly 50 can further include a sample processing device
150 and an annular cover 160 that can be used in connection with the base plate 110,
as will be described herein. Systems of the present disclosure may not actually include
a sample processing device as, in some instances, sample processing devices are consumable
devices that are used to perform a variety of tests, etc. and then discarded. As a
result, the systems of the present disclosure may be used with a variety of different
sample processing devices.
[0023] As shown in FIGS. 1-2, the depicted base plate 110 includes a thermal structure 130
that can include a thermal transfer surface 132 exposed on the top surface 112 of
the base plate 110. By "exposed" it is meant that the transfer surface 132 of the
thermal structure 130 can be placed in physical contact with a portion of a sample
processing device 150 such that the thermal structure 130 and the sample processing
device 150 are thermally coupled to transfer thermal energy via conduction. In some
embodiments, the transfer surface 132 of the thermal structure 130 can be located
directly beneath selected portions of a sample processing device 150 during sample
processing. For example, in some embodiments, the selected portions of the sample
processing device 150 can include one or more process chambers, such as thermal process
chambers 152. The process chambers can include those discussed in, e.g.,
U.S. Patent No. 6,734,401 titled ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS (Bedingham et al.).
By way of further example, the sample processing device 150 can include various features
and elements, such as those described in
U.S. Patent Publication No. 2007/0009391 titled COMPLIANT MICROFLUIDIC SAMPLE PROCESSING DISKS (Bedingham et al.).
[0024] As a result, by way of example only, the sample processing device 150 can include
one or more input wells and/or other chambers (sometimes referred to as "non-thermal"
chambers or "non-thermal" process chambers) 154 positioned in fluid communication
with the thermal process chambers 152. For example, in some embodiments, a sample
can be loaded onto the sample processing device 150 via the input wells 154 and can
then be moved via channels (e.g., microfluidic channels) and/or valves to other chambers
and/or ultimately to the thermal process chambers 152.
[0025] In some embodiments, as shown in FIGS. 1-2, the input wells 154 can be positioned
between a center 151 of the sample processing device 150 and at least one of the thermal
process chambers 152. In addition, the annular cover 160 can be configured to allow
access to a portion of the sample processing device 150 that includes the input well(s)
154, such that the input well(s) 154 can be accessed when the cover 160 is positioned
adjacent to or coupled to the sample processing device 150.
[0026] As shown in FIGS. 1-2, the annular cover 160 can, together with the base plate 110,
compress a sample processing device 150 located therebetween, for example, to enhance
thermal coupling between the thermal structure 130 on the base plate 110 and the sample
processing device 150. In addition, the annular cover 160 can function to hold and/or
maintain the sample processing device 150 on the base plate 110, such that the sample
processing device 150 and/or the cover 160 can rotate with the base plate 110 as it
is rotated about axis 111 by drive system 120. The rotation axis 111 can define a
z-axis of the assembly 50.
[0027] As used herein, the term "annular" or derivations thereof can refer to a structure
having an outer edge and an inner edge, such that the inner edge defines an opening.
For example, an annular cover can have a circular or round shape (e.g., a circular
ring) or any other suitable shape, including, but not limited to, triangular, rectangular,
square, trapezoidal, polygonal, etc., or combinations thereof. Furthermore, an "annulus"
of the present invention need not necessarily be symmetrical, but rather can be an
asymmetrical or irregular shape; however, certain advantages may be possible with
symmetrical and/or circular shapes.
[0028] The compressive forces developed between the base plate 110 and the cover 160 may
be accomplished using a variety of different structures or combination of structures.
One exemplary compression structure depicted in FIGS. 1-2 are magnetic elements 170
located on (or at least operatively coupled to) the cover 160 and corresponding magnetic
elements 172 located on (or at least operatively coupled to) the base plate 110. Magnetic
attraction between the magnetic elements 170 and 172 may be used to draw the cover
160 and the base plate 110 towards each other, thereby compressing, holding, and/or
deforming a sample processing device 150 located therebetween. As a result, the magnetic
elements 170 and 172 can be configured to attract each other to force the annular
cover 160 in a first direction D
1 (see FIG. 1) along the z-axis of the assembly 50, such that at least a portion of
the sample processing device 150 is urged into contact with the transfer surface 132
of the base plate 110.
[0029] As used herein, a "magnetic element" is a structure or article that exhibits or is
influenced by magnetic fields. In some embodiments, the magnetic fields can be of
sufficient strength to develop the desired compressive force that results in thermal
coupling between a sample processing device 150 and the thermal structure 130 of the
base plate 110 as discussed herein. The magnetic elements can include magnetic materials,
i.e., materials that either exhibit a permanent magnetic field, materials that are
capable of exhibiting a temporary magnetic field, and/or materials that are influenced
by permanent or temporary magnetic fields.
[0030] Some examples of potentially suitable magnetic materials include, e.g., magnetic
ferrite or "ferrite" which is a substance including mixed oxides of iron and one or
more other metals, e.g., nanocrystalline cobalt ferrite. However, other ferrite materials
may be used. Other magnetic materials which may be used in the assembly 50 may include,
but are not limited to, ceramic and flexible magnetic materials made from strontium
ferrous oxide which may be combined with a polymeric substance (such as, e.g., plastic,
rubber, etc.); NdFeB (this magnetic material may also include Dysprosium); neodymium
boride; SmCo (samarium cobalt); and combinations of aluminum, nickel, cobalt, copper,
iron, titanium, etc.; as well as other materials. Magnetic materials may also include,
for example, stainless steel, paramagnetic materials, or other magnetizable materials
that may be rendered sufficiently magnetic by subjecting the magnetizable material
to a sufficient electric and/or magnetic field.
[0031] In some embodiments, the magnetic elements 170 and/or the magnetic elements 172 can
include strongly ferromagnetic material to reduce magnetization loss with time, such
that the magnetic elements 170 and 172 can be coupled with a reliable magnetic force,
without substantial loss of that force over time.
[0032] Furthermore, in some embodiments, the magnetic elements of the present disclosure
may include electromagnets, in which the magnetic fields can be switched on and off
between a first magnetic state and a second non-magnetic state to activate magnetic
fields in various areas of the assembly 50 in desired configurations when desired.
[0033] In some embodiments, the magnetic elements 170 and 172 can be discrete articles operatively
coupled to the cover 160 and the base plate 110, as shown in FIGS. 1-2 (in which the
magnetic elements 170 and 172 are individual cylindrically-shaped articles). However,
in some embodiments, the base plate 110, the thermal structure 130, and/or the cover
160 can include sufficient magnetic material (e.g., molded or otherwise provided in
the structure of the component), such that separate discrete magnetic elements are
not required. In some embodiments, a combination of discrete magnetic elements and
sufficient magnetic material (e.g., molded or otherwise) can be employed.
[0034] As shown in FIGS. 1-2, the annular cover 160 can include a center 161, which can
be in line with the rotation axis 111 when the cover 160 is coupled to the base plate
110, an inner edge 163 that at least partially defines an opening 166, and an outer
edge 165. As described above, the opening 166 can facilitate accessing at least a
portion of the sample processing device 150 (e.g., a portion comprising the input
wells 154), for example, even when the annular cover 160 is positioned adjacent to
or coupled to the sample processing device 150. As shown in FIGS. 1-2, the inner edge
163 of the annular cover 160 can be configured to be positioned inwardly (e.g., radially
inwardly) of the thermal process chambers 152, relative to the center 161 of the annular
cover 160, for example, when the annular cover 160 is positioned adjacent the sample
processing device 150. In addition, the inner edge 163 of the annular cover 160 can
be configured to be positioned radially outwardly of the input wells 154. Furthermore,
in some embodiments, as shown in FIGS. 1-2, the outer edge 165 of the annular cover
160 can be configured to be positioned outwardly (e.g., radially outwardly) of the
thermal process chambers 152 (and also outwardly of the input wells 154).
[0035] The inner edge 163 can be positioned a first distance d
1 (e.g., a first radial distance or "first radius") from the center 161 of the annular
cover 160. In such embodiments, if the annular cover 160 has a substantially circular
ring shape, the opening 166 can have a diameter equal to twice the first distance
d
1. In addition, the outer edge 165 can be positioned a second distance d
2 (e.g., a second radial distance or "second radius") from the center 161 of the annular
cover 160. In some embodiments, the first distance d
1 can be at least about 50 % of the second distance. In some embodiments, at least
about 60 %, and in some embodiments, at least about 70 %. In addition, in some embodiments,
the first distance d
1 can be no greater than about 95 % of the second distance, in some embodiments, no
greater than about 85 %, and in some embodiments, no greater than about 80 %. In some
embodiments, the first distance d
1 can be about 75 % of the second distance d
2.
[0036] Furthermore, in some embodiments, the outer edge 165 can be positioned a distance
d
2 (e.g., a radial distance) from the center 161, which can define a first area, and
in some embodiments, the area of the opening 166 can be at least about 30 % of the
first area, in some embodiments, at least about 40 %, and in some embodiments, at
least about 50 %. In some embodiments, the opening 166 can be no greater than about
95 % of the first area, in some embodiments, no greater than about 75 %, and in some
embodiments, no greater than about 60 %. In some embodiments, the opening 166 can
be about 53 % of the first area.
[0037] In addition, the annular cover 160 can include an inner wall 162 (e.g., an "inner
circumferential wall" or "inner radial wall"; which can function as an inner compression
ring, in some embodiments, as described below) and an outer wall 164 (e.g., an "outer
circumferential wall" or "outer radial wall"; which can function as an outer compression
ring, in some embodiments, as described below). In some embodiments, inner and outer
walls 162 and 164 can include or define the inner and outer edges 163 and 165, respectively,
such that the inner wall 162 can be positioned inwardly (e.g., radially inwardly)
of the thermal process chambers 152, and the outer wall 164 can be positioned outwardly
(e.g., radially outwardly) of the thermal process chambers 152. As further shown in
FIGS. 1-2, in some embodiments, the inner wall 162 can include the magnetic elements
170, such that the magnetic elements 170 form a portion of or are coupled to the inner
wall 162. For example, in some embodiments, the magnetic elements 170 can be embedded
(e.g., molded) in the inner wall 162. As shown in FIG. 1-2, the annular cover 160
can further include an upper wall 167 that can be positioned to cover a portion of
the sample processing device 150, such as a portion that comprises the thermal process
chambers 152.
[0038] As shown in FIGS. 1 and 2, in some embodiments, the upper wall 167 can extend inwardly
(e.g., radially inwardly) of the inner wall 162 and the magnetic elements 170. In
the embodiment illustrated in FIGS. 1-4, the upper wall 167 does not extend much inwardly
of the inner wall 162. However, in some embodiments, the upper wall 167 can extend
further inwardly of the inner wall 162 and/or the magnetic elements 170 (e.g., toward
the center 161 of the cover 160), for example, such that the size of the opening 166
is smaller than what is depicted in FIGS. 1-4. Furthermore, in some embodiments, the
upper wall 167 can define the inner edge 163 and/or the outer edge 165.
[0039] In some embodiments, at least a portion of the cover 160, such as one or more of
the inner wall 162, the outer wall 164, and the upper wall 167, can be optically clear.
For example, at least a portion of the upper wall 167 that is adapted to be positioned
over one or more of the input wells 154 and/or a portion of the upper wall 167 that
is adapted to be positioned over the thermal process chambers 152 can be optically
clear to allow for optically accessing at least a portion of the sample processing
device 150.
[0040] As used herein, the phrase "optically clear" can refer to an object that is transparent
to electromagnetic radiation ranging from the infrared to the ultraviolet spectrum
(e.g., from about 10 nm to about 10 µm (10,000 nm)); however, in some embodiments,
the phrase "optically clear" can refer to an object that is transparent to electromagnetic
radiation in the visible spectrum (e.g., about 400 nm to about 700 nm). In some embodiments,
the phrase "optically clear" can refer to an object with a transmittance of at least
about 80 % within the wavelength ranges above.
[0041] Such configurations of the annular cover 160 can function to effectively or substantially
isolate the thermal process chambers 152 of the sample processing device 150 when
the cover 160 is coupled to or positioned adjacent the sample processing device 150.
For example, the cover 160 can physically, optically, and/or thermally isolate a portion
of the sample processing device 150, such as a portion comprising the thermal process
chambers 152. In some embodiments, as shown in FIG. 1, the sample processing device
150 can include one or more thermal process chambers 152, and further, in some embodiments,
the one or more thermal process chambers 152 can be arranged in an annulus about the
center 151 of the sample processing device 150, which can sometimes be referred to
as an "annular processing ring." In such embodiments, the annular cover 160 can be
adapted to cover and/or isolate a portion of the sample processing device 150 that
includes the annular processing ring or the thermal process chambers 152. For example,
the annular cover 160 includes the inner wall 162, the outer wall 164, and the upper
wall 167 to cover and/or isolate the portion of the sample processing device 150 that
includes the thermal process chambers 152. In some embodiments, one or more of the
inner wall 162, the outer wall 164, and the upper wall 167 can be a continuous wall,
as shown, or can be formed of a plurality of portions that together function as an
inner or outer wall (or inner or outer compression ring), or an upper wall. In some
embodiments, enhanced physical and/or thermal isolation can be obtained when at least
one of the inner wall 162, the outer wall 164 and the upper wall 167 is a continuous
wall.
[0042] In addition, in some embodiments, the ability of the annular cover 160 to cover and
effectively thermally isolate the thermal process chambers 152 from ambience and/or
from other portions of the assembly 50 can be important, because otherwise, as the
base plate 110 and the sample processing device 150 are rotated about the rotation
axis 111, air can be caused to move quickly past the thermal process chambers 152,
which, for example, can undesirably cool the thermal process chambers 152 when it
is desired for the chambers 152 to be heated. Thus, in some embodiments, depending
on the configuration of the sample processing device 150, one or more of the inner
wall 162, the upper wall 167 and the outer wall 164 can be important for thermal isolation.
[0043] As shown in FIGS. 1-2, in some embodiments, the sample processing device 150 can
also include a device housing or body 153, and in some embodiments, the body 153 can
define the input wells 154 or other chambers, any channels, the thermal process chambers
152, etc. In addition, in some embodiments, the body 153 of the sample processing
device 150 can include an outer lip, flange or wall 155. In some embodiments, as shown
in FIGS. 1-2, the outer wall 155 can include a portion 157 adapted to cooperate with
the base plate 110 and a portion 159 adapted to cooperate with the annular cover 160.
For example, as shown in FIG. 2, the annular cover 160 (e.g., the outer wall 164)
can be dimensioned to be received within the area circumscribed by the outer wall
155 of the sample processing device 150. As a result, in some embodiments, the outer
wall 155 of the sample processing device 150 can cooperate with the annular cover
160 to cover and/or isolate the thermal process chambers 152. Such cooperation can
also facilitate positioning of the annular cover 160 with respect to the sample processing
device 150 such that the thermal process chambers 152 are protected and covered without
the annular cover 160 pressing down on or contacting any of the thermal process chambers
152.
[0044] In some embodiments, the outer wall 155 of the sample processing device 150 and the
one or more input wells 154 formed in the body 153 of the sample processing device
150 can effectively define a recess (e.g., an annular recess) 156 in the sample processing
device 150 (e.g., in a top surface of the sample processing device 150) in which at
least a portion of the annular cover 160 can be positioned. For example, as shown
in FIGS. 1-2, the inner wall 162 (e.g., including the magnetic elements 170) and the
outer wall 164 can be positioned in the recess 156 of the sample processing device
150 when the annular cover 160 is positioned over or coupled to the sample processing
device 150. As a result, in some embodiments, the outer wall 155, the input wells
154 and/or the recess 156 can provide reliable positioning of the cover 160 with respect
to the sample processing device 150.
[0045] In some embodiments, as shown in FIGS. 1-2, the magnetic elements 170 can be arranged
in an annulus, and the annulus or portion of the cover 160 that includes the magnetic
elements 170 can include an inner edge (e.g., an inner radial edge) 173 and an outer
edge (e.g., an outer radial edge) 175. As shown in FIGS. 1-2, the cover 160 and/or
the magnetic elements 170 can be configured, such that both the inner edge 173 and
the outer edge 175 can be positioned inwardly (e.g., radially inwardly) with respect
to the thermal process chambers 152.
[0046] As a result, in some embodiments, the magnetic elements 170 can be restricted to
an area of the cover 160 where the magnetic elements 170 are positioned outwardly
(e.g., radially outwardly) of the input wells 154 (or other protrusions, chambers,
recesses, or formations in the body 153) and inwardly (e.g., radially inwardly) of
the thermal process chambers 152. In such configurations, the magnetic elements 170
can be said to be configured to maximize the open area of the sample processing device
150 that is available for access by other devices or for other functions. In addition,
in such embodiments, the magnetic elements 170 can be positioned so as not to interrupt
or disturb the processing of a sample positioned in the thermal process chambers 152.
[0047] In some embodiments, as shown in FIGS. 1-2, the magnetic elements 170 of the cover
160 can form at least a portion of or be coupled to the inner wall 162, such that
the magnetic elements 170 can function as at least a portion of the inner compression
ring 162 to compress, hold, and/or deform the sample processing device 150 against
the thermal transfer surface 132 of the thermal structure 130 of the base plate 110.
As shown in FIGS. 1-2, one or both of the magnetic elements 170 and 172 can be arranged
in an annulus, for example, about the rotation axis 111. Furthermore, in some embodiments,
at least one of the magnetic elements 170 and 172 can include a substantially uniform
distribution of magnetic force about such an annulus.
[0048] In addition, the arrangement of the magnetic elements 170 in the cover 160 and the
corresponding arrangement of the magnetic elements 172 in the base plate 110 can provide
additional positioning assistance for the cover 160 with respect to one or both of
the sample processing device 150 and the base plate 110. For example, in some embodiments,
the magnetic elements 170 and 172 can each include sections of alternating polarity
and/or a specific configuration or arrangement of magnetic elements, such that the
magnetic elements 170 of the cover 160 and the magnetic elements 172 of the base plate
110 can be "keyed" with respect to each other to allow the cover 160 to reliably be
positioned in a desired orientation (e.g., angular position relative to the rotation
axis 111) with respect to at least one of the sample processing device 150 and the
base plate 110.
[0049] In some embodiments, compliance of sample processing devices of the present disclosure
may be enhanced if the devices include annular processing rings that are formed as
composite structures including cores and covers attached thereto using pressure sensitive
adhesives. The sample processing device 150 shown in FIGS. 1-2 is an example of one
such composite structure. As shown in FIG. 1, in some embodiments, the sample processing
device 150 can include the body 153 to a first covers 182 and a second cover (not
shown) are attached using adhesives (e.g., pressure sensitive adhesives). Where process
chambers (e.g., thermal process chambers 152) are provided in a circular array (as
depicted in FIG. 1) that is formed by a composite structure, the thermal process chambers
152 and covers can at least partially define a compliant annular processing ring that
is adapted to conform to the shape of the underlying thermal transfer surface 132
when the sample processing device 150 is forced against the transfer surface 132,
such as a shaped thermal transfer surface 132. In such embodiments, the compliance
can be achieved with some deformation of the annular processing ring while maintaining
the fluidic integrity of the thermal process chambers or any other fluidic passages
or chambers in the sample processing device 150 (i.e., without causing leaks).
[0050] In some embodiments, the annular cover 160 may not include an outer wall 164 and/or
an upper wall 167. In such embodiments, the thermal process chambers 152 may be exposed
and accessible, or the upper wall 167 alone, if present, may cover that portion of
the sample processing device 150. Furthermore, in some embodiments, the cover may
include a smaller opening than the opening 166 shown in FIGS. 1-2, and in some embodiments,
the cover may not include an opening at all, but rather can be disc-shaped.
[0051] That is, in some embodiments, the assembly 50 and system 100 can be used in connection
with a different sample processing device and/or cover than those of the sample processing
assembly 50. It should be understood that that the sample processing assembly 50 is
shown by way of example only. Other sample processing devices may themselves be capable
of substantially thermally isolating thermal process chambers without requiring that
the cover be configured to provide thermal isolation. As a result, the systems of
the present disclosure can be adapted to cooperate with a variety of covers and sample
processing devices. In addition, certain covers may be more useful in combination
with some sample processing devices than others.
[0052] The system 100 shown in FIGS. 3-7 is shown as including the sample processing assembly
50; however, it should be noted that other sample processing assemblies can be used
in connection with, or form a portion of, the system 100. In addition, as mentioned
above, in some embodiments, the sample processing device is a consumable component
and does not form a portion of the sample processing assembly 50 or the system 100.
[0053] The system 100 is shown in an open position or state P
o in FIG. 3 and in a partially closed (or partially open) state or position P
p in FIG. 4. As shown in FIGS. 3 and 4, the system 100 can include a housing 102 that
can include a first portion (sometimes referred to as a "lid") 104 and a second portion
(sometimes referred to as a "base") 106 that are movable with respect to each other
between the open position P
o and a closed position P
c (see FIG. 5), including a variety of positions intermediate of the open position
P
o and the closed position P
c, such as the partially closed position P
p. By way of example only, the first portion 104 is shown in FIGS. 3 and 4 as being
movable with respect to the second portion 106, while the second portion 106 remains
substantially stationary. However, it should be understood that a variety of suitable
relative movements between the first portion 104 and the second portion 106 can be
employed. For example, in some embodiments, the second portion 106 can be movable
relative to the first portion 104.
[0054] The housing 102, and particularly, the first portion 104 and the second portion 106,
can form an enclosure around the sample processing assembly 50, for example, during
various processing or assaying steps or procedures, such as those described above,
so as to isolate the sample processing assembly 50 from ambience during such processing.
That is, in some embodiments, the housing 102 can be configured to have at least one
state or position in which the at least a portion of the sample processing assembly
50 can be thermally isolated from ambience, physically separated or protected from
ambience, and/or fluidly separated from ambience.
[0055] As described above, the cover 160 can be used to hold, maintain and/or deform the
sample processing device 150 on the base plate 110. The base plate 110 is not visible
in FIGS. 3 and 4 because the sample processing device 150 has already been positioned
on the base plate 110 in FIGS. 3 and 4. The cover 160 is shown in FIGS. 3 and 4 as
being coupled to a portion of the first portion 104 of the housing 102. For example,
in FIG. 3, the cover 160 has been positioned on a hanger 108 that is provided by the
first portion 104 of the housing 102. The housing 102 can include or can be coupled
to the hanger 108. In addition, by way of example only, the system 100 is shown in
FIGS. 3 and 4 as the cover 160 being coupled to the first portion 104 of the housing
102, and the sample processing device 150 being positioned on the base plate 110 in
the second portion 106 of the housing 102. However, it should be understood that a
variety of other suitable configurations are possible and within the scope of the
present disclosure. For example, in some embodiments, the second portion 106 is movable
with respect to the first portion 104, and in some embodiments, the sample processing
device 150 and the base plate 110 are positioned in the first portion 104 of the housing
102, and the cover 160 is coupled to a hanger 108 in the second portion 106 of the
housing 102.
[0056] In addition, although not shown in FIGS. 3 and 4, the base plate 110 can be rotated
about the rotation axis 111 via any of a variety of drive systems that can be positioned
in the system 100, or coupled to the system 100. For example, in some embodiments,
a suitable drive system can be located in the second portion 106 of the housing 102,
positioned to drive the base plate 110. Furthermore, in some embodiments, the electromagnetic
energy source 190 can also be positioned below the base plate 110 in the second portion
106 of the housing 102.
[0057] As shown in FIGS. 3 and 4, the cover 160 can interact with at least a portion of
the housing 102 (e.g., the hanger 108 provided by the first portion 104 of the housing
102), such that the cover 160 can be moved toward or away from the sample processing
device 150 when the first portion 104 and the second portion 106 of the housing 102
are moved relative to one another. In addition, in some embodiments, the cover 160
can be coupled to or decoupled from a portion of the housing 102 without the use of
additional tools or equipment. Such an interaction between the cover 160 and the housing
102 can provide robust, reliable and safe positioning of the cover 160 with respect
to the sample processing device 150 and/or the base plate 110. Furthermore, the cover
160 can be decoupled from the first portion 104 of the housing 102 for cleaning and/or
disposal. Then, the cover 160 can be reused, for example, with a new sample processing
device 150, by repositioning the cover 160 on the hanger 108. Alternatively, the cover
160 can be discarded after use, and a new, second cover can then be coupled to the
housing 102 and moved toward the sample processing device 150 (or a new sample processing
device) and/or the base plate 110.
[0058] As described above, the magnetic elements 170 in the cover 160 can be adapted to
attract the magnetic elements 172 in the base plate 110. As a result, as the first
portion 104 of the housing 102 is moved closer to the second portion 106, the magnetic
elements 170 begin to get near enough to the magnetic elements 172 to cause an attraction
between the magnetic elements 170 and the magnetic elements 172. Such an attraction
can provide additional positioning assistance between the cover 160 and the base plate
110 and/or the sample processing device 150. For example, such an attraction can inhibit
the cover 160 from falling off of the hanger 108 as the angle
α (as shown in FIG. 4 and described below) between the first portion 104 and the second
portion 106 decreases.
[0059] As shown in FIGS. 1-2, the inner edge 163 of the cover 160 is at least partially
provided by a lip, flange or projection 124 (see also FIGS. 3-7; also sometimes referred
to as the "first projection"). By way of example only, the projection 124 is shown
as being an extension of the upper wall 167 of the cover 160, and extending further
inwardly (e.g., radially inwardly) of the inner edge 173 of the magnetic elements
170 (and/or of the inner wall 162). Because the cover 160 is shown in the illustrated
embodiment as having a circular ring shape, the projection 124 of the illustrated
embodiment is an inner radial projection that projects radially inwardly, relative
to the center 161 of the cover 160. However, it should be understood that other configurations
of the projection 124 are possible, and can depend on the general shape and structure
of the cover 160. For example, in some embodiments, the projection 124 is not necessarily
a radial projection, and in some embodiments, the projection 124 is not necessarily
an inner projection, as will be described in greater detail below.
[0060] As further shown in FIGS. 5-7, the hanger 108 can include a lip, flange or projection
126 (see FIGS. 5-7; also sometimes referred to as the "second projection") that can
be adapted to engage or to be coupled to the first projection 124 of the cover 160.
By way of example only, the hanger 108 is shown as including an arc and having a substantially
arcuate (e.g., almost semi-circular) shape, and the second projection 126 is shown
as including an arc and having a substantially arcuate (e.g., almost semi-circular)
shape. In addition, the second projection 126 is shown as being an outer projection
and as extending radially outwardly, for example, relative to the center 161 of the
cover 160 when the cover 160 is coupled to the hanger 108.
[0061] The arcuate shape of the hanger 108 of the illustrated embodiment can facilitate
coupling the cover 160 to the hanger 108, can facilitate coupling/decoupling the cover
160 to/from the hanger 108 without the need for additional tools or equipment, and
can facilitate holding the cover 160 throughout the relative movement between the
first portion 104 and the second portion 106 (e.g., from an open position P
o to a closed position Pc).
[0062] As a result, in some embodiments, the hanger 108 can include at least a 90-degree
arc, in some embodiments, at least a 120-degree arc, and in some embodiments, at least
a 140-degree arc. Furthermore, in some embodiments, the hanger 108 can include an
arc of no greater than 180 degrees, in some embodiments, an arc of no greater than
170 degrees, and in some embodiments, an arc of no greater than 160 degrees. In embodiments
in which the hanger 108 has a lower-angled arc, coupling/decoupling the cover 160
to/from the hanger 108 can be facilitated. However, in embodiments in which the hanger
108 has a higher-angled arc, the cover 160 can be better inhibited from undesirably
falling off of the hanger 108.
[0063] In addition, with reference to FIGS. 5-7, in some embodiments, the distance between
the cover 160 and the first portion 104 of the housing 102 when the cover 160 is coupled
to the hanger 108 can at least partially play a role in facilitating coupling/decoupling
the cover 160 to/from the hanger 108 and/or in inhibiting the cover 160 from undesirably
falling off of the hanger 108. For example, in some embodiments, a pocket formed in
the first portion 104 can be adapted to receive at least a portion of the cover 160
when the cover 160 is coupled to the hanger 108, and, in some embodiments, the clearance
between the cover 160 and the pocket can facilitate coupling/decoupling the cover
160 to/from the hanger 108 and/or can inhibit the cover 160 from undesirably falling
off of the hanger 108.
[0064] That is, when the first portion 104 of the housing 102 is at least partially open
(i.e., moved at least partially away from the second portion 106), the cover 160 can
be hung on the hanger 108 by coupling the first projection 124 to the second projection
126. As shown in FIG. 3, positioning the first portion 104 of the housing 102 in the
open position P
o shown in FIG. 3, can facilitate hanging the cover 160 on the hanger 108 by engaging
the first projection 124 and the second projection 126. Furthermore, the cover 160
can be coupled to the hanger 108 (and the first projection 124 can be coupled to the
second projection 126) without the need for additional tools or equipment.
[0065] Then, as shown in FIG. 4, the first portion 104 and the second portion 106 of the
housing 102 can be moved toward one another to close the housing 102 and to assemble
the sample processing assembly 50, such that the cover 160 comes down into contact
with one or more of the sample processing device 150 and the base plate 110 and urges
at least a portion of the sample processing device 150 into contact with at least
a portion of the base plate 110 (e.g., the thermal structure 130 of the base plate
110). For example, such compression and urging can be accomplished by attraction of
the magnetic elements 170 and 172.
[0066] As shown by way of example only in FIGS. 3 and 4, in some embodiments, the housing
102 can be configured so that the first portion 104 and the second portion 106 are
pivotally movable with respect to one another. For example, as shown in FIGS. 3 and
4, the first portion 104 can be pivoted (e.g., rotated about a pivot axis A) between
an open position P
o and a closed position P
c (see FIG. 5) to close the housing 102 and to move the cover 160 toward the sample
processing device 150 and/or the base plate 110. In such embodiments, particular advantages
can be achieved by allowing a certain amount of overlap between the first and second
projections 124 and 126, to inhibit the cover 160 from falling off of the hanger 108
when the first portion 104 is in a partially closed position P
p, as shown in FIG. 4. That is, as shown in FIG. 4, the first and second projections
124 and 126 can be configured such that the cover 160 can remain coupled to the hanger
108 (i.e., and the first projection 124 and the second projection 126 can remain coupled)
throughout movement of the first portion 104 between an open position, such as position
P
o, and a closed position. Said another way, in some embodiments, the second projection
126 can be used to hold the cover 160 by the first projection 124. For example, when
the first portion 104 and the second portion 106 are pivotally movable with respect
to one another, the cover 160 can remain coupled to the hanger 108 (i.e., and the
first projection 124 and the second projection 126 can remain coupled) no matter what
the angle
α is between the first portion 104 and the second portion 106.
[0067] Employing pivotal movement between the first portion 104 and the second portion 106
of the housing 102 (and, in the illustrated embodiment, between the first portion
104 and the base plate 110) is shown and described by way of example only; however,
it should be understood that a variety of types of movement can be employed in the
housing 102 without departing from the scope of the present disclosure. For example,
in some embodiments, the first portion 104 and the second portion 106 of the housing
102 can be slidably movable with respect to one another. By way of further example,
in some embodiments, the first portion 104 and the second portion 106 of the housing
102 (or the first portion 104 and the base plate 110) can be movable with respect
to one another via a gantry system. For example, in some embodiments, the first portion
104 can move via a gantry system above the second portion 106 (and the base plate
110).
[0068] One of skill in the art will understand that the first and second projections 124
and 126 can be configured in a variety of manners to achieve coupling of the cover
160 to the hanger 108 throughout movement of the first portion 104 and/or the second
portion 106 between an open and closed position. For example, in some embodiments,
the first projection 124 and the second projection 126 can be configured to overlap
by at least about 1 mm, in some embodiments, at least about 2 mm, and in some embodiments,
at least 3 mm. In some embodiments, the first projection 124 and the second projection
126 can be configured to overlap by no greater than the first distance d
1. In addition, in some embodiments, one or more of the projections 124 and 126 can
be angled or oriented toward the other to further encourage coupling of the first
and second projections 124 and 126, for example, at a variety of angles
α between an open and closed position. Furthermore, in some embodiments, one or more
of the projections 124 and 126 can include a mating or engaging feature to further
encourage or facilitate coupling of the first and second projections 124 and 126,
for example, at a variety of angles
α between an open and closed position.
[0069] In some embodiments, the first projection 124 can extend a first distance (e.g.,
a first radial distance) in a first direction (e.g., a first radial direction, such
as toward the center 161 of the cover 160) in a plane orthogonal to the rotation axis
111 or the z-axis of the system 100. In addition, in some embodiments, the second
projection 126 can extend a second distance (e.g., a second radial distance) in a
second direction substantially parallel and opposite to the first direction (e.g.,
away from the center 161 of the cover 160), such that the first projection 124 and
the second projection 126 overlap, for example, when the cover 160 is coupled to the
hanger 108.
[0070] Furthermore, in some embodiments, the first projection 124 can include the inner
edge 163 (which can be referred to as a "first edge"; see FIGS. 1-2 and 5-7), which
is positioned a first distance d
1 from the center 161 of the cover 160 (or the rotation axis 111). In addition, in
some embodiments, the second projection 126 can include an outer edge 123 (which can
be referred to as a "second edge"; see FIGS. 5-7) positioned a second distance d
2' from the center 161 of the cover 160 when the cover 160 is coupled to the hanger
108. Furthermore, in some embodiments, the second distance d
2' can be greater than the first distance d
1, such that the first projection 124 and the second projection 126 overlap.
[0071] As shown in FIGS. 5-7, in some embodiments, the overlap between the first projection
124 and the second projection 126 can increase as the first portion 104 and the second
portion 106 are moved apart from one another (e.g., as the first portion 104 is moved
from the first position P
1 shown in FIG. 5 to the second position P
2 shown in FIG. 6 and the third position P
3 shown in FIG. 7). That is, the cover 160 can slide toward the hanger 108 further
as the hanger 108 picks up the cover 160 (e.g., in embodiments employing pivotal movement
between the first portion 104 and the second portion 106). As such, in some embodiments,
the first distance d
1 can decrease as the first portion 104 and the second portion 106 are moved with respect
to one another, such that the distance between (or difference between) the first distance
d
1 and the second distance d
2' can increase.
[0072] Moreover, in some embodiments, the cover 160 can be in the shape of a circular ring.
In such embodiments, the first projection 124 can be a first radial projection 124
which can extend radially inwardly (e.g., toward the center 161 of the cover 160)
and which can define a first or inner radius d
1 measured from the center 161 of the cover 160 (or the rotation axis 111 of the system
100). In addition, in such embodiments, the second projection 126 can be a second
radial projection 126 which can extend radially outwardly (e.g., away from the center
161 of the cover 160) and which can define a second or outer radius d
2' measured from the center 161 of the cover 160 (or the rotation axis 111). The second
radius can be greater than the first radius, such that the first radial projection
124 and the second radial projection 126 overlap.
[0073] As described in greater detail below with reference to FIGS. 5-7, in some embodiments,
the cover 160 and the hanger 108 (and accordingly, the first projection 124 and the
second projection 126) can become decoupled at a desired position. For example, in
some embodiments, the cover 160 and the hanger 108 can become decoupled when the housing
102 is closed, that is, when the first portion 104 and the second portion 106 are
positioned adjacent one another in a closed position (see position P
c in FIG. 5). Such decoupling can occur in order to allow the cover 160 to disengage
from the hanger 108 and/or to engage with the other components of the sample processing
assembly 50.
[0074] By way of example only, three different relative positions of the first portion 104
and the second portion 106 of the housing 102 are shown in FIGS. 5-7. A first position
P
1, which is also the closed position P
c referenced above, is shown in FIG. 5. As shown in FIG. 5, the housing 102 is closed,
and the sample processing assembly 50 is closed. That is, as shown, the cover 160
is positioned atop the sample processing device 150, which is positioned atop the
base plate 110, and the magnetic elements 170 of the cover 160 and the magnetic elements
172 of the base plate 110 are being attracted to each other, urging at least a portion
of the sample processing device 150 in the first direction D
1 along the z-axis toward the base plate 110, and namely, toward the thermal transfer
surface 132 of the thermal structure 130 of the base plate 110.
[0075] As further shown in FIG. 5, in the first position P
1, the second projection 126 is not coupled to the first projection 124, and the cover
160 is not coupled to the hanger 108. Rather, the first projection 124 and the second
projection 126 are spaced a distance X apart (e.g., wherein X is a vertical distance
along the z-axis or rotation axis 111 of the system 100 and parallel to the first
direction D
1), such that the cover 160 can rotate with the base plate 110 about the rotation axis
111, without any interference from the second projection 126. That is, as the first
portion 104 and the second portion 106 of the housing 102 are moved closer together,
the cover 160, and particularly, the magnetic elements 170, are able to interact with
the base plate 110 and/or the sample processing device 150. In addition, as the first
portion 104 and the second portion 106 are moved closer together, the cover 160 may
begin to disengage from the hanger 108 and may begin to engage the other components
of the sample processing assembly 50. In some embodiments, this may all occur at one
point in time, for example, at the moment when the housing 102 is closed, or when
the first portion 104 is moved into its closed position P
c relative to the second portion 106 of the housing 102.
[0076] FIG. 6 shows the first portion 104 and the second portion 106 of the housing 102
in a second position P
2 relative to one another. In the second position P
2, the first portion 104 and the second portion 106 have become to be separated or
moved apart from one another. As shown in FIG. 6, such movement of the first portion
104 can begin to move the hanger 108 and the second projection 126 relative to the
cover 160 and the first projection 124. As such, in the second position P
2, the second projection 126 has begun to engage or be coupled to the first projection
124. As shown in FIG. 6, the housing 102 is open (e.g., in a partially open (or partially
closed) position), while the sample processing assembly 50 remains in a closed position,
because the cover 160 is still coupled to the sample processing device 150 and/or
the base plate 110 (e.g., at least partially via the magnetic attraction between the
magnetic elements 170 and the magnetic elements 172).
[0077] FIG. 7 illustrates the first portion 104 and the second portion 106 of the housing
102 in a third position P
3 relative to one another. In the third position P
3, the first portion 104 and the second portion 106 have become separated even further
than in the second position P
2 of FIG. 6. In addition, FIG. 6 shows that the additional movement of the first portion
104 to the third position P
3 caused the second projection 126 of the hanger 108 to pull upwardly on the first
projection 124 of the cover 160, ultimately overcoming the attraction between the
magnetic elements 170 and the magnetic elements 172, and allowing the cover 160 to
lift off of the other components of the sample processing assembly 50 (i.e., the sample
processing device 150 and/or the base plate 110). As a result, the housing 102 is
open (e.g., in a partially open (or partially closed) position), and the sample processing
assembly 50 is also open (e.g., in a partially open (or partially closed) position.
The first portion 104 and the second portion 106 can then continue to be moved further
apart from one another to, for example, the open position P
o shown in FIG. 3. As described above, the first and second projections 124 and 126
can be configured to inhibit the cover 160 from falling off of the hanger 108 (and,
accordingly, to inhibit the first projection 124 and the second projection 126 from
becoming decoupled) during the movement from the closed position P
c shown in FIG. 5 to the open position P
o shown in FIG. 3.
[0078] As a result, the first portion 104 of the housing 102 can be moved toward and away
from the base plate 110, which can move the cover 160 between a position in which
the cover 160 is not coupled to the base plate 110 (e.g., via the magnetic elements
170 and 172) and a position in which the cover 160 is coupled to the base plate 110.
By way of example only, the magnetic attraction between the magnetic elements 170
and the magnetic elements 172 is described as being configured to pull the cover 160
onto the base plate 110, for example, along the first direction D
1. However, it should be understood that a variety of suitable configurations of the
magnetic elements 170 and 172, in addition to other compression structures, can also
be employed in order to couple the cover 160 to the base plate 110. For example, in
some embodiments, the cover 160 can be pushed along the first direction D
1 rather than being pulled. By way of example only, there could be an electromagnetic
connection between at least a portion of the first portion 104 of the housing 102
(e.g., the hanger 108) and the magnetic elements 170 of the cover 160, and there could
be no magnetic elements 172 in the base plate 110. In such embodiments, the electromagnetic
connection between the cover 160 and the first portion 104 of the housing 102 could
be reversed as the cover 160 approached the base plate 110 in order to push the cover
160 down onto the base plate 110.
[0079] Similarly, in some embodiments, the first and second projections 124 and 126 or other
portions of the cover 160 and the hanger 108 can be adapted to be magnetically coupled
together. For example, in some embodiments, electromagnets that can be switched on
and off can be employed to assist in the coupling and decoupling between the hanger
108 and the cover 160. In addition, in some embodiments, there is no magnetic attraction
between the hanger 108 and the cover 160 so as not to compete with the magnetic forces
occurring between the cover 160 and the base plate 110.
[0080] In the embodiment illustrated in FIGS. 1-7 and described herein, the first projection
124 is shown as projecting or extending inwardly, and the second projection 126 is
shown as projecting or extending outwardly, such that the first and second projections
124 and 126 overlap and can be engaged. However, it should be understood that in some
embodiments, the first projection 124 can be an outer projection. For example, the
first projection 124 can project outwardly away from the center 161 of the cover 160,
e.g., in embodiments employing covers including continuous top surfaces and no opening
166. In such embodiments, the second projection 126 can be an inner projection adapted
to engage the first outer projection 124. For example, the second projection 126 can
project inwardly toward the center 161 of the cover 160 (e.g., when the cover 160
is coupled to the hanger 108).
1. System zur Verarbeitung von Probenverarbeitungsvorrichtungen (150),
wobei das System aufweist:
eine Grundplatte, die mit einem Antriebssystem (120) wirkverbunden ist und die eine
erste Oberfläche aufweist, wobei das Antriebssystem die Grundplatte (110) um eine
Rotationsachse rotiert und wobei die Rotationsachse eine z-Achse definiert;
eine Abdeckung (160), die dazu ausgelegt ist, so angeordnet zu werden, dass sie der
ersten Oberfläche der Grundplatte (110) zugewandt ist, wobei die Abdeckung einen ersten
Vorsprung (124) enthält;
ein Gehäuse (102), das einen Abschnitt (104) aufweist, welcher in Bezug auf die Grundplatte
(110) zwischen einer Offenstellung, in welcher die Abdeckung (160) nicht mit der Grundplatte
(110) gekoppelt ist, und einer Schließstellung, in welcher die Abdeckung mit der Grundplatte
gekoppelt ist, beweglich ist, wobei der Abschnitt (104) einen zweiten Vorsprung (126)
aufweist und wobei der erste Vorsprung (124) und der zweite Vorsprung (126) dazu ausgelegt
sind, miteinander gekoppelt zu sein, wenn der Abschnitt (104) sich in der Offenstellung
befindet und voneinander entkoppelt zu sein, wenn der Abschnitt (104) sich in der
Schließstellung befindet, derart, dass die Abdeckung von dem Abschnitt des Gehäuses
(102) entkoppelt ist und mit der Grundplatte um die Rotationsachse rotierbar ist,
wenn der Abschnitt (104) sich in der Schließstellung befindet und wenn die Abdeckung
mit der Grundplatte gekoppelt ist;
eine Probenverarbeitungsvorrichtung (150), aufweisend mindestens eine Prozesskammer
(152, 154) und dazu ausgelegt, zwischen der Grundplatte (110) und der Abdeckung (160)
angeordnet zu sein, wobei die Probenverarbeitungsvorrichtung (150) mit der Grundplatte
(110) um die Rotationsachse drehbar ist, wenn die Probenverarbeitungsvorrichtung (150)
mit der Grundplatte gekoppelt ist;
dadurch gekennzeichnet, dass das System weiter aufweist:
mindestens ein erstes magnetisches Element (172), welches mit der Grundplatte (110)
wirkverbunden ist; und
mindestens ein zweites magnetisches Element (170), welches mit der Abdeckung (160)
wirkverbunden ist, wobei das mindestens eine erste magnetische Element (172) dazu
ausgelegt ist, das mindestens eine zweite magnetische Element (170) anzuziehen, um
die Abdeckung in eine erste Richtung entlang der z-Achse zu drängen.
2. System nach Anspruch 1, wobei der erste Vorsprung (124) einen ersten Rand (163) aufweist,
welcher um eine erste Entfernung von einem Zentrum der Abdeckung (160) entfernt angeordnet
ist, wobei der zweite Vorsprung (126) einen zweiten Rand (123) aufweist, welcher um
eine zweite Entfernung von dem Zentrum der Abdeckung entfernt angeordnet ist, und
wobei die zweite Entfernung größer ist als die erste Entfernung.
3. System nach Anspruch 1 oder 2, wobei die Abdeckung (160) die Form eines Kreisrings
aufweist, wobei der erste Vorsprung (124) der Abdeckung (160) einen ersten Radialvorsprung
enthält, der sich radial einwärts erstreckt und einen inneren Radius definiert, welcher
von einem Zentrum der Abdeckung aus gemessen ist, und wobei der zweite Vorsprung (126)
einen zweiten Radialvorsprung enthält, der sich radial auswärts erstreckt und einen
äußeren Radius definiert, welcher von dem Zentrum der Abdeckung (160) aus gemessen
ist, und wobei der äußere Radius größer ist als der innere Radius.
4. System nach einem der Ansprüche 1-3, wobei die Abdeckung (160) dazu ausgelegt ist,
ohne zusätzliche Werkzeuge mit dem Abschnitt (104) des Gehäuses (102) gekoppelt und/oder
ohne zusätzliche Werkzeuge von diesem entkoppelt zu werden.
5. System nach Anspruch 1, wobei der erste Vorsprung (124) von dem zweiten Vorsprung
(126) entkoppelt wird, und dies zumindest zum Teil als Reaktion auf die magnetische
Anziehungskraft zwischen dem mindestens einen ersten magnetischen Element (172) und
dem mindestens einen zweiten magnetischen Element (170).
6. System nach Anspruch 1 oder 5, wobei das mindestens eine erste magnetische Element
(172) in einem ersten Ringraum magnetischer Elemente angeordnet ist, und wobei das
mindestens eine zweite magnetische Element (170) in einem zweiten Ringraum magnetischer
Elemente angeordnet ist.
7. System nach Anspruch 6, wobei der zweite Ringraum magnetischer Elemente einen inneren
Rand (163) und einen äußeren Rand (165) aufweist und wobei sowohl der innere Rand
(163) als auch der äußere Rand (165) bezüglich der Rotationsachse innerhalb der mindestens
einen Prozesskammer (152, 154) angeordnet sind, wenn die Probenverarbeitungsvorrichtung
(150) mit der Grundplatte (110) gekoppelt ist.
8. System nach Anspruch 7, wobei zumindest einer des ersten Ringraums magnetischer Elemente
und des zweiten Ringraums magnetischer Elemente eine im Wesentlichen gleichmäßige
Verteilung der Magnetkraft um den Ringraum umfasst.
9. System nach einem der vorangehenden Ansprüche, wobei das zumindest eine erste magnetische
Element (172) und das zumindest eine zweite magnetische Element (170) in Bezug zueinander
derart zueinander passen, dass die Abdeckung (160) in einer gewünschten Ausrichtung
mit der Grundplatte (110) koppelt.
10. System nach einem der vorangehenden Ansprüche, weiter aufweisend eine mit der Grundplatte
(110) wirkverbundene thermische Struktur (130), wobei die thermische Struktur eine
Übertragungsfläche (132) aufweist, die in der Nähe einer ersten Oberfläche der Grundplatte
freiliegt, und wobei die magnetische Anziehung zwischen dem mindestens einen ersten
magnetischen Element (172) und dem mindestens einen zweiten magnetischen Element (170)
mindestens einen Abschnitt der Probenverarbeitungsvorrichtung (150) in Kontakt mit
der Übertragungsfläche (132) der Grundplatte drängt.
11. System nach Anspruch 10, wobei der mindestens eine Abschnitt der Probenverarbeitungsvorrichtung
(150) die mindestens eine Prozesskammer (152, 154) umfasst.
12. Verfahren zur Verarbeitung von Probenverarbeitungsvorrichtungen (150),
wobei das Verfahren aufweist:
Vorsehen einer Grundplatte (110), die mit einem Antriebssystem (120) wirkverbunden
ist und eine erste Oberfläche aufweist;
Vorsehen einer Abdeckung (160), die dazu ausgelegt ist, so angeordnet zu werden, dass
sie der ersten Oberfläche der Grundplatte (110) zugewandt ist, wobei die Abdeckung
einen ersten Vorsprung (124) enthält;
Vorsehen eines Gehäuses (102), das einen Abschnitt (104) aufweist, welcher in Bezug
auf die Grundplatte (110) zwischen einer Offenstellung, in welcher die Abdeckung (160)
nicht mit der Grundplatte (110) gekoppelt ist, und einer Schließstellung, in welcher
die Abdeckung mit der Grundplatte gekoppelt ist, beweglich ist, wobei der Abschnitt
(104) einen zweiten Vorsprung (126) aufweist und wobei der erste Vorsprung (124) und
der zweite Vorsprung (126) dazu ausgelegt sind, miteinander gekoppelt zu werden, wenn
der Abschnitt (104) sich in der Offenstellung befindet und voneinander entkoppelt
zu werden, wenn der Abschnitt (104) sich in der Schließstellung befindet;
Positionieren einer Probenverarbeitungsvorrichtung (150) auf der Grundplatte (110),
wobei die Probenverarbeitungsvorrichtung (150) mindestens eine Prozesskammer (152,
154) aufweist;
Koppeln der Abdeckung (160) mit dem Abschnitt (104) des Gehäuses (102), wenn sich
der Abschnitt des Gehäuses in der Offenstellung befindet;
Bewegen des Abschnitts (104) des Gehäuses (102) von der Offenstellung in die Schließstellung;
Koppeln der Abdeckung (160) mit der Grundplatte (110) und Entkoppeln der Abdeckung
(160) von dem Abschnitt (104) des Gehäuses (102) zumindest teilweise als Reaktion
auf das Bewegen des Abschnitts des Gehäuses von der Offenstellung in die Schließstellung;
Rotieren der Grundplatte (110) um eine Rotationsachse, wobei die Rotationsachse eine
z-Achse definiert, wobei die Abdeckung (160) mit der Grundplatte um die Rotationsachse
rotierbar ist, wenn der Abschnitt des Gehäuses (102) sich in der Schließstellung befindet
und wenn die Abdeckung mit der Grundplatte (110) gekoppelt ist;
dadurch gekennzeichnet, dass das Verfahren weiter aufweist:
Vorsehen zumindest eines ersten magnetischen Elements (172), welches mit der Grundplatte
wirkverbunden ist, und
Vorsehen zumindest eines zweiten magnetischen Elements (170), welches mit der Abdeckung
(160) wirkverbunden ist, wobei das Koppeln der Abdeckung mit der Grundplatte (110)
das Koppeln des mindestens einen ersten magnetischen Elements (172) mit dem mindestens
einen zweiten magnetischen Element (170) umfasst.
13. Verfahren nach Anspruch 12, wobei das Entkoppeln der Abdeckung (160) von dem Abschnitt
(104) des Gehäuses (102) das Koppeln des mindestens einen ersten magnetischen Elements
(172) mit dem mindestens einen zweiten magnetischen Element (170) umfasst.