<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP12180662B8W1" file="EP12180662W1B8.xml" lang="en" country="EP" doc-number="2527405" kind="B8" correction-code="W1" date-publ="20130925" status="c" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="en"><B000><eptags><B001EP>......DE............................................................................................</B001EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.40 (30 Jan 2013) -  2999001/0</B007EP></eptags></B000><B100><B110>2527405</B110><B120><B121>CORRECTED EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20130925</date></B140><B150><B151>W1</B151><B153>73</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>12180662.4</B210><B220><date>20070403</date></B220><B240><B241><date>20121112</date></B241></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>2006111289</B310><B320><date>20060413</date></B320><B330><ctry>JP</ctry></B330></B300><B400><B405><date>20130925</date><bnum>201339</bnum></B405><B430><date>20121128</date><bnum>201248</bnum></B430><B450><date>20130807</date><bnum>201332</bnum></B450><B452EP><date>20130212</date></B452EP><B480><date>20130925</date><bnum>201339</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>C08L 101/00        20060101AFI20130116BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>C08K   3/32        20060101ALI20130116BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>C08K   5/49        20060101ALI20130116BHEP        </text></classification-ipcr><classification-ipcr sequence="4"><text>C08K   9/04        20060101ALI20130116BHEP        </text></classification-ipcr><classification-ipcr sequence="5"><text>C08L  21/00        20060101ALI20130116BHEP        </text></classification-ipcr><classification-ipcr sequence="6"><text>C08L  69/00        20060101ALI20130116BHEP        </text></classification-ipcr><classification-ipcr sequence="7"><text>C08L  77/02        20060101ALI20130116BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Thermoplastische Harzzusammensetzung und Harzformartikel</B542><B541>en</B541><B542>Thermoplastic resin composition and resin molded article</B542><B541>fr</B541><B542>Composition de résine thermoplastique et article moulé en résine</B542></B540><B560><B561><text>US-A- 5 637 643</text></B561><B561><text>US-A- 5 961 710</text></B561></B560></B500><B600><B620><parent><pdoc><dnum><anum>07737017.9</anum><pnum>2006333</pnum></dnum><date>20070403</date></pdoc></parent></B620></B600><B700><B720><B721><snm>Nakamura, Makoto</snm><adr><str>c/o MITSUBISHI ENGINEERING-PLASTICS  CORPORATION
6-2, Higashi-Yawata 5-chome
Hiratsuka-shi</str><city>Kanagawa 254-0016</city><ctry>JP</ctry></adr></B721><B721><snm>Nakano, Hiroshi</snm><adr><str>c/o MITSUBISHI ENGINEERING-PLASTICS  CORPORATION
6-2, Higashi-Yawata 5-chome
Hiratsuka-shi</str><city>Kanagawa 254-0016</city><ctry>JP</ctry></adr></B721><B721><snm>Otsuka, Katsuhiro</snm><adr><str>c/o Tokyo Plant
Matsumurasangyo Co., Ltd.
2-12, Uchikanda
Chiyoda-ku</str><city>Tokyo 101-0047</city><ctry>JP</ctry></adr></B721><B721><snm>Matsumura, Kazutoyo</snm><adr><str>c/o Matsumura Sangyo Co., Ltd.
3-8, Tsukuda 7-chome
Nishiyodogawa-ku
Osaka-shi</str><city>Osaka 555-0001</city><ctry>JP</ctry></adr></B721></B720><B730><B731><snm>DSM IP Assets B.V.</snm><iid>100112629</iid><irf>157 584 a/scho</irf><adr><str>Het Overloon 1</str><city>6411 TE  Heerlen</city><ctry>NL</ctry></adr></B731></B730><B740><B741><snm>HOFFMANN EITLE</snm><iid>100061036</iid><adr><str>Patent- und Rechtsanwälte 
Arabellastrasse 4</str><city>81925 München</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>DE</ctry></B840><B880><date>20121128</date><bnum>201248</bnum></B880></B800></SDOBI>
</ep-patent-document>
