(57) The present invention provides a first presspin (6) with a foot (8), whereby a base
(12) of the foot (8) is provided for contacting a contact element (4a, 4b) of a power
semiconductor device (3), especially within a power semiconductor module (1) comprising
a base plate (2) and at least one power semiconductor device (3), which is arranged
on the base plate (2) and contacted by at least one further presspin (6, 7), whereby
an insulation means (13) is provided for electrically isolating an outer surface (14)
of the foot (8). The present invention further provides a power semiconductor module
(1) comprising a base plate (2), at least one power semiconductor device (3), which
is arranged on the base plate (2), and at least one first presspin (6), which is provided
with an insulation means (13) as specified above for electrically isolating an outer
surface (14) of the foot (8) of the first presspin (6), whereby the least one first
presspin (6) is provided for contacting at least one contact element (4a, 4b) of the
at least one power semiconductor device (3). The present invention also provides a
power semiconductor module assembly, comprising multiple power semiconductor modules
(1) as specified above, whereby the power semiconductor modules (1) are arranged side
by side to each other with electric connections between adjacent power semiconductor
modules (1).
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