(19)
(11) EP 2 564 677 A1

(12)

(43) Date of publication:
06.03.2013 Bulletin 2013/10

(21) Application number: 10850903.5

(22) Date of filing: 30.04.2010
(51) International Patent Classification (IPC): 
H05K 1/16(2006.01)
(86) International application number:
PCT/US2010/033295
(87) International publication number:
WO 2011/136817 (03.11.2011 Gazette 2011/44)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(71) Applicant: DDI Global Corp
Anaheim, CA 92806 (US)

(72) Inventors:
  • KUMAR, Rajesh
    Mission Viejo CA 92692 (US)
  • DREYER, Monte, P.
    Rancho Santa Margarita CA 92688 (US)
  • TAYLOR, Michael, J.
    Longmont CO 80502-1808 (US)

(74) Representative: Yeadon, Mary Elizabeth et al
Greaves Brewster LLP Copa House Station Road
Cheddar BS27 3AH
Cheddar BS27 3AH (GB)

   


(54) METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING PARALLEL PROCESSES TO INTERCONNECT WITH SUBASSEMBLIES