METHOD, ASSEMBLY AND DEVICE FOR APPLYING A STRUCTURED LAYER TO A SUBSTRATE - Patent 2566675

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EP 2 566 675 A2

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(88)	Date of publication A3:
	23.02.2012

(43)	Date of publication:
	13.03.2013 Bulletin 2013/11

(21)	Application number: 11720205.1

(22)	Date of filing: 02.05.2011

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International Patent Classification (IPC):

B29C 35/08^(2006.01)
B29C 43/02^(2006.01)

B29C 43/14^(2006.01)

(86)	International application number:
	PCT/NL2011/050298

(87)	International publication number:
	WO 2011/155819 (15.12.2011 Gazette 2011/50)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

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Priority:

04.05.2010 NL 2004658

(71)	Applicant: Wafer Based Solutions B.V.
	5627 SZ Eindhoven (NL)

(72)	Inventors:
	VAN DE VORST, Michel Theodorus Henricus NL-5627 JD Eindhoven (NL) KAMP, Johannes Cornelis Adriaan NL-5652 RA Eindhoven (NL)

(74)	Representative: Eveleens Maarse, Pieter
	Patentwerk B.V. P.O. Box 1514 5200 BN 's-Hertogenbosch 5200 BN 's-Hertogenbosch (NL)

(54)	METHOD, ASSEMBLY AND DEVICE FOR APPLYING A STRUCTURED LAYER TO A SUBSTRATE