(19)
(11) EP 2 571 068 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
14.08.2013 Bulletin 2013/33

(43) Date of publication:
20.03.2013 Bulletin 2013/12

(21) Application number: 11780357.7

(22) Date of filing: 27.04.2011
(51) International Patent Classification (IPC): 
H01L 33/60(2010.01)
G02B 5/08(2006.01)
H05K 1/03(2006.01)
 F21S 2/00(2006.01)
F21Y 101/02(2006.01)
(86) International application number:
PCT/JP2011/002492
(87) International publication number:
WO 2011/142097 (17.11.2011 Gazette 2011/46)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 18.05.2010 JP 2010114810
18.05.2010 JP 2010114809
18.05.2010 JP 2010114808
13.05.2010 JP 2010111519

(71) Applicant: Panasonic Corporation
Kadoma-shi Osaka 571-8501 (JP)

(72) Inventors:
  • MOTOYA, Atsushi
    Osaka-shi, Osaka 540-6207 (JP)
  • OKANO, Kazuyuki
    Osaka-shi, Osaka 540-6207 (JP)
  • AKAI, Minako
    Osaka-shi, Osaka 540-6207 (JP)
  • GOTO, Yurika
    Osaka-shi, Osaka 540-6207 (JP)
  • TAGAMI, Naoki
    Osaka-shi, Osaka 540-6207 (JP)
  • HORIUCHI, Makoto
    Osaka-shi, Osaka 540-6207 (JP)
  • MORI, Toshio
    Osaka-shi, Osaka 540-6207 (JP)
  • UEMOTO, Takaari
    Osaka-shi, Osaka 540-6207 (JP)
  • MIKI, Masahiro
    Osaka-shi, Osaka 540-6207 (JP)

(74) Representative: Appelt, Christian W. 
Boehmert & Boehmert Pettenkoferstrasse 20-22
80336 München
80336 München (DE)


(56) References cited: : 
   
       


    (54) MOUNTING BOARD, METHOD FOR MANUFACTURING SAME, LIGHT EMITTING MODULE, AND ILLUMINATING APPARATUS


    (57) An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate (101) according to the present invention includes a substrate (108) and a reflective film (106) that is formed on a front surface of the substrate (108) and has a front surface on which LED chips (102) are to be mounted, and the reflective film (106) is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips (102).