(19)
(11) EP 2 577 718 A2

(12)

(88) Date of publication A3:
19.04.2012

(43) Date of publication:
10.04.2013 Bulletin 2013/15

(21) Application number: 11789983.1

(22) Date of filing: 23.05.2011
(51) International Patent Classification (IPC): 
H01L 21/304(2006.01)
(86) International application number:
PCT/KR2011/003747
(87) International publication number:
WO 2011/152625 (08.12.2011 Gazette 2011/49)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 01.06.2010 KR 20100051685

(71) Applicant: LG Siltron Inc.
Gumi, Gyeongsanbuk-do 730-350 (KR)

(72) Inventor:
  • AN, Sang Min
    Pyeongtaek-si Gyeonggi-do 459-090 (KR)

(74) Representative: Novagraaf Technologies 
122 rue Edouard Vaillant
92593 Levallois-Perret Cedex
92593 Levallois-Perret Cedex (FR)

   


(54) WAFER POLISHING APPARATUS