Semiconductor substrate having copper/diamond composite material and method of making same

(19)

(11)

EP 2 587 536 B8

(12)	CORRECTED EUROPEAN PATENT SPECIFICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 B1)

(48)	Corrigendum issued on:
	29.03.2017 Bulletin 2017/13

(45)	Mention of the grant of the patent:
	07.12.2016 Bulletin 2016/49

(21)	Application number: 12189387.9

(22)	Date of filing: 24.10.2003

(51)

International Patent Classification (IPC):

H01L 23/373^(2006.01)

H01L 23/14^(2006.01)

(54)	Semiconductor substrate having copper/diamond composite material and method of making same Halbleitersubstrat mit Kupfer-/Diamantverbundmaterial und Verfahren zur Herstellung desselben Substrat semi-conducteur comportant un matériau composite en cuivre/diamant et son procédé de fabrication

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

(30)

Priority:

07.11.2002 US 291126

(43)	Date of publication of application:
	01.05.2013 Bulletin 2013/18

(62)	Application number of the earlier application in accordance with Art. 76 EPC:
	03768542.7 / 1576653

(73)	Proprietor: Kyocera International, Inc.
	San Diego, CA 92123-1580 (US)

(72)	Inventor:
	McCoy, John Washington San Diego, CA 92103 (US)

(74)	Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte
	Grillparzerstraße 14 81675 München 81675 München (DE)

(56)

References cited: :

EP-A- 0 364 155
US-A- 5 024 680
US-A- 5 783 316
US-A- 6 114 048

JP-A- 11 289 037
US-A- 5 099 310
US-A- 6 031 285

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).