(19)
(11) EP 2 595 181 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
04.07.2018 Bulletin 2018/27

(45) Mention of the grant of the patent:
21.03.2018 Bulletin 2018/12

(21) Application number: 10854711.8

(22) Date of filing: 14.07.2010
(51) International Patent Classification (IPC): 
H01L 29/778(2006.01)
H01L 27/06(2006.01)
H01L 29/417(2006.01)
H01L 29/20(2006.01)
 H01L 21/336(2006.01)
H01L 29/06(2006.01)
H01L 29/205(2006.01)
H01L 29/04(2006.01)
(86) International application number:
PCT/JP2010/061902
(87) International publication number:
WO 2012/008027 (19.01.2012 Gazette 2012/03)

(54)

COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

VERBUNDHALBLEITERBAUELEMENT UND HERSTELLUNGSVERFAHREN DAFÜR

DISPOSITIF SEMI-CONDUCTEUR COMPOSÉ ET SON PROCÉDÉ DE FABRICATION

(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

(43) Date of publication of application:
22.05.2013 Bulletin 2013/21

(73) Proprietor: Fujitsu Limited
Kawasaki-shi, Kanagawa 211-8588 (JP)

(72) Inventor:
  • IMADA, Tadahiro
    Kanagawa 211-8588 (JP)

(74) Representative: Stebbing, Timothy Charles 
Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn
London WC1V 7JH
London WC1V 7JH (GB)


(56) References cited: : 
EP-A2- 1 835 544
JP-A- 2003 229 566
JP-A- 2008 235 613
JP-A- 2009 164 158
US-A1- 2009 283 776
 WO-A1-2009/110254
JP-A- 2005 026 242
JP-A- 2009 004 398
US-A1- 2009 230 433
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).